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TECHNET Archives


1996


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Table of Contents:

..."Battery Substitution" (1 message)
!st reflow oven (2 messages)
"Average" solder defect rate (1 message)
"Drape" of Material (4 messages)
"J" Lead shear strength? (2 messages)
"RWE" labelled connector (1 message)
"SHADOW / EIDSCHUN"DILEMMA (2 messages)
"washable/removable" soldermask? (2 messages)
# of Layers? (2 messages)
%P in electroless Ni (1 message)
(ASSEM) Wave soldering SOT-23 (10 messages)
(ASSY): Cost estimating (1 message)
(DES, FAB, ASSEM) Din Rail Mountable PCB's (1 message)
(FAB) Fine Line Imaging (1 message)
(Fwd) AMI Multichip Package Engineering Position - NEW - (1 message)
(Fwd) Filleting of via pads (1 message)
(Fwd) FW: Buy me! (1 message)
(Fwd) Mail Delivery Failure. (1 message)
(Fwd) Re: Military Polyimide Board Failures (1 message)
(Fwd) Re: Military Polyimide Board Failures-EDN (1 message)
(Fwd) Re: Wave Solder SPC (1 message)
(Fwd) Seinfeldisms (2 messages)
(Fwd) TO220 reflow soldering (1 message)
(Fwd) TopFive -- 7/23/96 -- Movie Sequels Nobody Wants to See (1 message)
(gen):cti for getek (1 message)
(no subject) (5 messages)
(no subject) (fiducials) (1 message)
(U) (1 message)
*"Potato Chipping" "ANSI/J-STD-011" (3 messages)
-D Circuit Boards (Vendor wanted) (2 messages)
-No Subject- (1 message)
...no subject... (2 messages)
10 years of UK MCMs - an IEEE CPMT technical meeting (1 message)
2 New IPC Documents (1 message)
2 questions (1 message)
2-up panels. (1 message)
21st ANNUAL ELECTRONICS MANUFACTURING SEMINAR (2 messages)
2nd hand EX200 drill router (1 message)
4 vs 6 layer (2 messages)
4-layer vs 6-layer (3 messages)
500M SMDII (1 message)
8 inch Floppies (6 messages)
8 inch Floppies -Reply (1 message)
;-) Hadco + Zycon (3 messages)
<No subject> (3 messages)
<none> (3 messages)
<unidentified subject/ aka / Shadow/Eidschun Dilemma> (1 message)
? (1 message)
Abstracts of IEPS OC Emerging Tech 96, Feb 7 (1 message)
AC imp. eval sold paste (1 message)
Acronyms (4 messages)
Acronyms-CAF (1 message)
Activity (1 message)
Additive technology (3 messages)
address (2 messages)
Adhesive query (2 messages)
adhesives (2 messages)
Adipic acid (5 messages)
ADM: Job opportunity (1 message)
ADM: SWOT Analysis (1 message)
ADMIN- Poll Results on S (1 message)
ADMIN: Another Interruption in TechNet (1 message)
ADMIN: Enough is enough! (1 message)
ADMIN: faulty mail delivery (1 message)
ADMIN: IPC-CF-148 (2 messages)
ADMIN: Job required (1 message)
ADMIN: Please do not quote the digest. (1 message)
ADMIN: Poll Results on Splitting TechNet (3 messages)
ADMIN: Re: digest format? (1 message)
ADMIN: Re: job posting (1 message)
ADMIN: Reminder to Identify Contents (2 messages)
ADMIN: Sales postings / A... (1 message)
ADMIN: Sales postings / Advertisements (11 messages)
ADMIN: Sales postings / Advertisements -Reply (2 messages)
ADMIN: Sales postings / Advertisements -Reply -Last R (1 message)
ADMIN: Sales postings / Advertisements -Reply -Last Reply (1 message)
ADMIN: Sales/Ads (2 messages)
ADMIN: TechNet Digest list: What is that? (1 message)
ADMIN: Temporary mail problems at IPC (1 message)
ADMIN: Use of DesignerCouncil and TechNet Forums (2 messages)
ADMIN: Using IPC mail lists: (3 messages)
ADMIN: We are back (1 message)
ADMIN:RE:Sales postings / Advertisements (2 messages)
Advise CTM (1 message)
Ag or Pd alternative to HASL inquiry (4 messages)
AGEING OF ELECTROLESS NI/IMMERSION AU FINISH (2 messages)
Air Emissions from Printed Circuit Manufacturing (2 messages)
Air flow across solder joints (2 messages)
Airbourne bovines etc (2 messages)
AK-225 (1 message)
Allegro to IPC-D-356 utility (1 message)
Alloy 42 (7 messages)
Alloy 42 TSOP Solder Joint Cracks (1 message)
Almit solder (2 messages)
ALMIT Source (3 messages)
ALPHA POLYSOLDER LT (1 message)
Alpha Prep (1 message)
Alpha Preq (3 messages)
Alphametals Ionograph 500 M Test (2 messages)
Alternate Heat Sink Compounds (1 message)
Alternate Heatsink compound (1 message)
Alternative Solder Masks (2 messages)
Alternatives to Bromine in Flame Retardants (4 messages)
Aluminum Oxide Scrubbing (1 message)
Ammoniacal Etching Speed (2 messages)
Analog guard rings (1 message)
Announcement for your e-mail comm network (1 message)
Annular ring breakout (3 messages)
Another passing (1 message)
ANSI-J (3 messages)
ANSI/IPC-A-6700D (2 messages)
Answers to IPC-D-356 Test Formats (1 message)
Anyone using AlphaLevel (2 messages)
Anyone using AlphaLevel? (2 messages)
AOI/PCMCIA thin core (3 messages)
application of adhesive dots (4 messages)
AQP (1 message)
arlon clte (1 message)
Arrgh Oh No did some one up AOL BTW this is not a specific PCB topic! (1 message)
ARRGHH! Re: Silver Ink Screen Print. (1 message)
ascii art on the rise (1 message)
ASEMEP Symposium (1 message)
ASM Surface mount w/out soldermask (2 messages)
ASM: 610B / 2000A Comparison (4 messages)
ASM: Exposed copper on component leads (1 message)
ASM: Flexibility Testing (2 messages)
ASM: Follow-up soldermask dam question (1 message)
ASM: Parylene Conformal Coating (2 messages)
ASM: RTV (5 messages)
ASM: SMT pads with vias. (2 messages)
Aspect Ratios (2 messages)
ASS- X S Solder on SOT-23 (3 messages)
Ass. BGA shape (2 messages)
ass: axial (3 messages)
Ass: Bob Willis Fan Club (1 message)
Ass: Cable Assembly Destructive Testing (2 messages)
ASS: Cracking of Decoupling Caps (5 messages)
ASS: Defects on CD ROM ? (1 message)
ASS: Eyring Model (1 message)
ASS: Green Contamination (3 messages)
ASS: Masking of Switches (1 message)
ASS: SIR tests (3 messages)
ASS: Socket temperature performance (3 messages)
Ass: Soldermask problem! (4 messages)
ASS: Storeage of HASL PCBs (1 message)
ASS: Storeage of PWB (3 messages)
ASS: Storeage of PWB -Reply (2 messages)
Ass: Sunken Solder (1 message)
Ass: Wavesoldering temperature profiles (1 message)
ASS: X S Solder on SOT-23 (2 messages)
Ass:Des:Free UK Seminars (1 message)
Ass:Fab:Des:SMART European Workshops (1 message)
Ass:Fab:Des:SMART Workshops (1 message)
ASSEM: Block changes (1 message)
ASSEM: Component attrition during placem (4 messages)
ASSEM: Dendritic growths (2 messages)
ASSEM: Pick/Place (1 message)
ASSEM: Re: IPC-A-610 (1 message)
ASSEM:FW: Component attrition (1 message)
ASSEM:NI/GOLD (6 messages)
ASSEM:Router (2 messages)
Assembly (4 messages)
Assembly - OSP? Clarification. (3 messages)
assembly - pressfit connections (3 messages)
Assembly Benchmarking Survey (1 message)
Assembly: OSP and Bake. (4 messages)
Assembly: Silver PWA Finishes (3 messages)
Assembly: Solder Paste Life Extension (4 messages)
ASSEMBLY:solder paste stencils (1 message)
Assisted visual inspection of fine-pitch solder connec (1 message)
Assisted visual inspection of fine-pitch solder connecti (1 message)
Assisted visual inspection of fine-pitch solder connections (2 messages)
assly-stencil aperture s (1 message)
assly:baking of hasl pcbs (3 messages)
assly:baking of hasl pcbs (#994327) (1 message)
assly:baking of hasl pcbs -Reply (1 message)
assly:stencil aperture size for 20 mil pitch component (4 messages)
ASSLY:X-OUT PROBLEM IN PANELS (3 messages)
ASSM: 610B (3 messages)
ASSM: Assembly Bench Mark Study (1 message)
ASSM: Re: JEDEC Testing Specifications (1 message)
ASSM: Top fillet formation (10 messages)
ASSM: Top fillet formation - Thanks (1 message)
ASSY (16 messages)
ASSY (2); Intrusive Reflow (Through-hole reflow) (1 message)
ASSY - Padless Plated Thru Holes (6 messages)
ASSY - soldering thru-hole connectors (2 messages)
ASSY -Reply (1 message)
Assy : Component Engineer (1 message)
ASSY : Cracks in TSOP (1 message)
ASSY : Hot Bar Reflow (1 message)
ASSY : LowHighProfile (3 messages)
ASSY : Marking On Nickel/Gold (2 messages)
ASSY : paste printing (3 messages)
ASSY : Post Assembly soldering (1 message)
Assy : Re : Laser Stencils (1 message)
ASSY Circuits Assembly (3 messages)
ASSY cleaning. (1 message)
ASSY ink marking (1 message)
ASSY light guided assembly. (1 message)
ASSY Marking of 0603's (1 message)
ASSY minimum fillet height. (1 message)
ASSY Moisture Release Rates and Prebake Parameters (6 messages)
ASSY More info on Omegameter 600SMD problem (2 messages)
ASSY non-rosin flux and MIL (4 messages)
ASSY Omegameter 600SMD (6 messages)
ASSY post reflow cleaning (1 message)
ASSY post-reflow cleaning (3 messages)
ASSY Prepping radial leaded components (2 messages)
ASSY Qualifying reflow solder process (3 messages)
Assy Re: Compatability between saponification and PWB soldermask/marking (1 message)
ASSY RE: light guided assembly (1 message)
ASSY re: soldering old boards (1 message)
Assy Re: Tant. Caps (1 message)
ASSY reflow profile expert software. (3 messages)
ASSY revision J-STD-001 (3 messages)
ASSY UNactivated R-fluxed solder paste (1 message)
Assy, training (5 messages)
Assy, training provider (1 message)
ASSY,FAB,DES Electronics Manufacturing Seminar (3 messages)
ASSY- (Mac?) Gerber View (1 message)
Assy- Ball Grid Array (1 message)
ASSY- calculation of ac (1 message)
ASSY- Gold-to-Gold Sold (1 message)
ASSY- Laser Ash? (4 messages)
ASSY- OCC and Zn Mounti (1 message)
ASSY- PCMCIA Board Depa (1 message)
ASSY- PQFP pull test (1 message)
ASSY- RE>BGA PPM Question (1 message)
ASSY- Rework of PBGA pac (1 message)
ASSY- Solder joint mech (2 messages)
ASSY- TSOP Underfilling? (1 message)
Assy-Fiducials (4 messages)
ASSY-Flagging (6 messages)
assy-Immersion gold fini (2 messages)
ASSY-Metal Stamping (4 messages)
ASSY-part search MC78M06CDT (1 message)
ASSY. (3 messages)
ASSY. Solder joint temp (2 messages)
ASSY/DES: RWE connector (2 messages)
ASSY/FAB - Padless Plated Thru Holes (1 message)
Assy/Fab Grn Rst-Gold (1 message)
Assy/Fab SIR handbook available for comment. (1 message)
Assy/Fab: PCB Thickness (6 messages)
ASSY/FAB: SnPb Oxidation (4 messages)
ASSY/FAB: SnPb Oxidation, Removal (3 messages)
Assy/Fab: Solder in via-hole (2 messages)
ASSY: (5 messages)
ASSY: "Off-the-Shelf" Enclosures (3 messages)
ASSY: (Mac?) Gerber Viewing Software (1 message)
ASSY: 0402 chip placement (2 messages)
ASSY: 0402 chip placement (#570929) (2 messages)
ASSY: 3D Visual Inspection Request (1 message)
ASSY: Accelerated Aging Equations (1 message)
ASSY: adhesive (4 messages)
ASSY: Adhesive Dots for 0805s (8 messages)
ASSY: ADHESIVE SCREEN CLEANING (3 messages)
ASSY: Adipic acid (1 message)
ASSY: Affect of Sulfur on Gold or Silver Platings (3 messages)
ASSY: Affects on solder mask after wave solder (2 messages)
ASSY: Alloy 42 Plating Questions (2 messages)
ASSY: Aluminum to Tin/Lead (4 messages)
ASSY: Aramid material and baking (2 messages)
ASSY: Area Calc. for Ionic Contamination (4 messages)
ASSY: Automated Defect Scatter Diagrams ? (1 message)
ASSY: Baking before wave soldering (4 messages)
Assy: Ball Grid Array (4 messages)
ASSY: BGA SOCKETS (4 messages)
ASSY: BGA SOLDERABILITY (6 messages)
Assy: BGA vs QFP (2 messages)
Assy: BGA vs QFP [Round 2] (1 message)
ASSY: BGAs (1 message)
ASSY: Bismuth Solder (1 message)
Assy: Board Bake (1 message)
ASSY: Board Flatness Spec (2 messages)
ASSY: Bottom side Adhesives (1 message)
ASSY: BOUNDARY VS. FULL TUNNEL WAVE SOLDER NITROGEN INER (1 message)
ASSY: BOUNDARY VS. FULL TUNNEL WAVE SOLDER NITROGEN INERTING (2 messages)
ASSY: calculation of accelerated aging factor (7 messages)
ASSY: calculation of accelerating aging factor (1 message)
ASSY: CD ROM Training in SMT (3 messages)
ASSY: Chip on Flex (2 messages)
ASSY: Chip Resistors Breaking (2 messages)
ASSY: Chip under PLCC-44 (1 message)
ASSY: Clamps for Wave Solder Pallets (1 message)
ASSY: Clarification of standards from IPC (1 message)
Assy: Cleaning solder pot (3 messages)
Assy: Cleaning solder pot -Reply (1 message)
ASSY: Conductor Width to Land Ratio (1 message)
Assy: conformal coating (7 messages)
ASSY: Conformal Coating Flammability Problems (3 messages)
ASSY: Conformal Coating NoClean PWB's (2 messages)
ASSY: Conformal Coating Thickness (1 message)
Assy: Conversion to Nitrogen (1 message)
ASSY: Crushed Pins by Nickel Underplate? (1 message)
ASSY: Cu Ni Sn board finishes (7 messages)
ASSY: De-panelizer (1 message)
ASSY: Depanelization of SMT Board Assys (5 messages)
assy: Dross elimination (5 messages)
assy: Dross elimination (#943028) (2 messages)
ASSY: Dry film mask and paste thickness (6 messages)
ASSY: Dry film mask and paste thickness -Reply (2 messages)
ASSY: DSN: Conductor to Land ratio (2 messages)
ASSY: Dual LED failures. (2 messages)
Assy: Dull solder joint - Gold (3 messages)
ASSY: Early Supplier Involvment (1 message)
ASSY: Entek Coating (4 messages)
ASSY: Entek Coating (#870153) (1 message)
ASSY: Equipment Suppliers (3 messages)
ASSY: Fiducials (5 messages)
ASSY: Fine Pitch Dewetting? (3 messages)
ASSY: Fixturing for wave solder and in-line cleaning (1 message)
ASSY: Flux contamination in Pentium Socket (1 message)
ASSY: GEN: Popcorning during reflow (3 messages)
ASSY: Glue and Fine Pitch Devices - Thanks (1 message)
ASSY: Gold -- Tin/Lead contacts (1 message)
ASSY: Gold contamination after wave (1 message)
ASSY: Gold contamination after wave soldering? (3 messages)
ASSY: Gold plated terminations (4 messages)
ASSY: Gold-to-Gold Soldering (5 messages)
ASSY: Gritty Solder Joint (1 message)
ASSY: HASL plating uniformity (1 message)
ASSY: Heatsink Adhesives (4 messages)
ASSY: Immersion Gold (4 messages)
ASSY: Immersion Gold -Reply (2 messages)
ASSY: Intrusive reflow (through-hole reflow) (2 messages)
Assy: Ionograph & No-Clean Flux (4 messages)
ASSY: IPC related question (component rotation) (2 messages)
ASSY: IPC-A-610 MTBF (1 message)
ASSY: J-Lead, PLCC-44 (1 message)
ASSY: J-Standards (3 messages)
ASSY: Job opportunity (1 message)
ASSY: Job Posting (1 message)
ASSY: Large Boards for Telecom (3 messages)
ASSY: Laser Ash? (1 message)
ASSY: Lead pull test (1 message)
ASSY: Lead Trim After Wave (3 messages)
assy: limit on mechanical flexure of PWA during test (1 message)
Assy: LPI Matte vs Gloss and Conformal Coating (2 messages)
Assy: LPI Matte vs Gloss and Conformal Coating -Reply (1 message)
ASSY: MARKING PENS (2 messages)
assy: matte or glossy soldermask? (4 messages)
assy: matte or glossy soldermask? -Reply (2 messages)
assy: matte or glossy soldermask? -Reply/question (1 message)
Assy: max board width (2 messages)
ASSY: MDA and ICT Test (1 message)
ASSY: MELF's (7 messages)
ASSY: Menisograph Testers (1 message)
ASSY: Moisture sensitivity? (3 messages)
Assy: need dummy FP package (1 message)
Assy: No-clean Solder Paste w/o Nitrogen (2 messages)
ASSY: OCC and Zn Mounting Screws (2 messages)
Assy: opens after 2nd solder (5 messages)
ASSY: Packaging (2 messages)
ASSY: Packaging Standards (5 messages)
ASSY: Pad and Trace Repair (Material and Standard) (1 message)
ASSY: Pad damage on 504 pin BGA's (2 messages)
ASSY: Passive Devices under PLCC-44 (1 message)
ASSY: Paste In Hole (3 messages)
ASSY: PBGA Void Size Specifications? (3 messages)
ASSY: PCB Packaging (3 messages)
ASSY: PCB Repair - Plating (2 messages)
ASSY: PCMCIA Board Depanelizing (4 messages)
ASSY: PCMCIA Connectors (2 messages)
Assy: PCMCIA depaneling (2 messages)
ASSY: PCMCIA or PWA REFLOW CARRIERS (1 message)
ASSY: PCMCIA pallets (3 messages)
ASSY: PCMCIA Vendor (3 messages)
ASSY: Peelable Soldermask for Wave Soldering Process (5 messages)
ASSY: Pem nuts installed prior to reflow (1 message)
ASSY: Polishing fiducials (8 messages)
ASSY: Post-wave Warpage (5 messages)
Assy: PWB Cleaning-bath life (1 message)
ASSY: PWB RAW MATERIALS (1 message)
ASSY: QFP Tape & Reel (1 message)
ASSY: QUERIES ON IPC-A-610B & IPC-A-600D (1 message)
assy: Re: Browne (belt reflow) (1 message)
Assy: Re: Green Rust (1 message)
ASSY: Re: Soldering iron tip temperatures (2 messages)
ASSY: re:Rework of PBGA package (1 message)
ASSY: recycling matrix trays (1 message)
ASSY: reflow of mixed technology (2 messages)
ASSY: Rework of PBGA package (2 messages)
ASSY: Rework Simulation Test (2 messages)
Assy: RF Boards (2 messages)
ASSY: Rusty Reflow oven. (2 messages)
Assy: Scored edge Clearance to components (1 message)
ASSY: Security coating of SMT leads. (5 messages)
Assy: Semi-Auto Fine Pitch Rework Machines (3 messages)
ASSY: Semi-automatic pick & place (1 message)
ASSY: Short leads in a PWA (8 messages)
ASSY: Simm Board Handling (2 messages)
ASSY: Smocks, are they necessary? (2 messages)
ASSY: SMT BOARDS ASSMEBLY ISSUE... (2 messages)
ASSY: SMT Equipment (1 message)
Assy: SMT resistor arrays/networks (2 messages)
ASSY: SMT Rework Equipment (1 message)
ASSY: SMT Shelf Life (6 messages)
ASSY: SMT Socket Reliability (1 message)
ASSY: SMT Soldering to Nickle pads (3 messages)
ASSY: SMT vs. Thru Hole Component costs (4 messages)
ASSY: SOIC'S IN WAVESOLDERING (fwd) (4 messages)
ASSY: SOIC'S IN WAVESOLDERING Rockwell (1 message)
Assy: Solder ball removal (2 messages)
ASSY: Solder deposition on pin thru connector (1 message)
ASSY: Solder Fatigue Data Sn40 - Sn50 (4 messages)
ASSY: Solder in Connector Pins (1 message)
Assy: Solder Paste Height (4 messages)
Assy: Solder Paste Height (#889153) (1 message)
Assy: Solder Paste in Wave Solde (1 message)
Assy: Solder Paste in Wave Solder Pots... (8 messages)
ASSY: Solder Paste Viscosity (3 messages)
ASSY: Solder paste viscosity measurements (2 messages)
ASSY: Solder Paste Volume (2 messages)
Assy: Solder paste volume after reflow (1 message)
ASSY: Solder schools (3 messages)
Assy: Solder Thieves (2 messages)
ASSY: Solderability - Storage of Tin Plated Parts (2 messages)
ASSY: Solderability problems with Intel 28F004 TSOPs (3 messages)
ASSY: Soldering process for 50 mil pitch connectors (5 messages)
ASSY: Soldering to Nickel (4 messages)
ASSY: soldermask flaking (4 messages)
ASSY: soldermask flaking -Reply (1 message)
ASSY: Solderpaste In Through-Hole Process (2 messages)
ASSY: Source for Copper in Flux Activity TM (2 messages)
ASSY: SPEC FOR PULL TEST (1 message)
ASSY: Stencil printing adhesive for chip components (1 message)
ASSY: StressRelief (1 message)
ASSY: StressReliefAgain (1 message)
ASSY: Surface Mount Plastic Components (4 messages)
ASSY: Tab route or not (1 message)
ASSY: Teflon Board Repair (3 messages)
Assy: Thermally Conductive Adhesive (5 messages)
ASSY: tinning of components (1 message)
Assy: Tombstoning of SOT23 (2 messages)
ASSY: Topside Reflow on .062 boards (2 messages)
ASSY: training (1 message)
Assy: Transformer Varnish (1 message)
ASSY: TSOP Solder Joint Cracks (3 messages)
ASSY: TSOP with Alloy 42 lead frame field failures (1 message)
ASSY: Ultrasonics (2 messages)
ASSY: User feedback on MX920 cut and clinch system (1 message)
ASSY: User friendly ionic contamination tester? (3 messages)
ASSY: VACUUM BAGS (2 messages)
ASSY: Vertical angle (3 messages)
ASSY: Vertical angle -Forwarded (1 message)
ASSY: VIAS DIA. (3 messages)
ASSY: Vision/Inspection Equipment (4 messages)
Assy: wave soldering 603's (1 message)
ASSY: Whiskers on QFP's After Reflow (2 messages)
Assy: Wisker growth (1 message)
Assy: [SPC] Solder Paste Height Spec (1 message)
ASSY:Alloy 42 (1 message)
Assy:BlisterPack (1 message)
Assy:Board Identification (2 messages)
ASSY:CLARIFICATIONS ON IPC 610B & 600D (1 message)
assy:compatability gold vs tin/lead (12 messages)
ASSY:DES: More Book Reviews (1 message)
ASSY:equipments for conformal coating (5 messages)
ASSY:FAB:Des: Joint Cracking LCCCC (5 messages)
assy:FLUX Related issues (1 message)
Assy:Flux residue on SMC (2 messages)
ASSY:Gerber Viewing Software (9 messages)
assy:gold/indum/solder (2 messages)
ASSY:hot bar summary (1 message)
assy:Immersion gold finishes (2 messages)
ASSY:IPC related question (Solder Joint Stress) (1 message)
ASSY:JTAG Testing (1 message)
ASSY:LeadProtrusion (3 messages)
Assy:looking for production aid (2 messages)
ASSY:Need parts axial sequenced! (1 message)
assy:NiAu pwb soldering w/Sn62? (2 messages)
ASSY:Oil coating on components. (4 messages)
ASSY:Panasonic SMD feeders (1 message)
ASSY:PCB-rework (4 messages)
ASSY:PCMCIA card contract manufacturing (2 messages)
ASSY:Pin Headers (1 message)
ASSY:Plastic QFP vs. MQUAD (1 message)
ASSY:Post-wave Warpage (1 message)
ASSY:Quality of consumables. (2 messages)
ASSY:Re:chemical clean prior to soldermask (1 message)
Assy:S-BGA (1 message)
ASSY:SMD adhesive (1 message)
ASSY:SMD Fiducials (2 messages)
ASSY:SMD JEDIC tray orientation (4 messages)
ASSY:SMT pallets (3 messages)
ASSY:solder mask problem (1 message)
ASSY:Solder Paste for Through Hole Connections (1 message)
ASSY:Solder Wicking,Fine Pitch Leads (4 messages)
ASSY:Solder Wicking,Fine Pitch Leads (#939978) (1 message)
Assy:SPC of cleaning process (3 messages)
assy:spreading of paste flux (2 messages)
Assy:StraightThruPartRetention (3 messages)
Assy:VerticalFill (3 messages)
ASSY:Workmanship Standards For Intrusive Reflow (2 messages)
ASSY; 3-D Bar Code Technology (2 messages)
Assy; Baking flex boards prior to reflow (2 messages)
ASTM D-3638 (2 messages)
ASTM D149 For Flex Materials (1 message)
ASY- HOT BAR EQUIPMENT (1 message)
ASY: Conformal Coating Adhesion Testing (2 messages)
ASY: Conformal Coatings (3 messages)
ASY: external high-voltage testing (1 message)
ASY: HOT BAR EQUIPMENT (2 messages)
ASY: Water Cleanliness Standard (1 message)
AT&S in Austria (1 message)
AT&T Spray Fluxer - Clarification to Verifone's Comments (2 messages)
ATE Contract Services wit... (1 message)
ATE Contract Services with 206 or 309 Capability (1 message)
ATI Driller / Router (1 message)
Attendance Monitoring Systems. (2 messages)
auto exposure systems (1 message)
Automated Defect Scatter Diagrams ? (3 messages)
Automated labeling equipment (2 messages)
AUTOMATED TEST VOLTAGE (1 message)
Automatic solder Insp. system for PTH (2 messages)
AW: Dielectric Constant-1 -4 gigaHz (2 messages)
AW: Duraflex/Roll-o-Lan (1 message)
AW: Re: AW: Dielectric Constant-1 -4 gigaHz (1 message)
Axarel--Rajan, Sanjay (1 message)
B-24 CCOUON (2 messages)
B-24 CCOUPON (1 message)
Back Panel Info (3 messages)
BackPlane Design (3 messages)
backplane info (4 messages)
Bad boards...who pays (1 message)
Baking of Plastic Components (2 messages)
BALANCE Cu Construction (3 messages)
Ball Grid Array Back End Processing (2 messages)
Bare Board Test and Data Sources of Errors in Test Files (1 message)
Bare Board Test PCBs with BGAs (3 messages)
Bare board testing of buried components. (1 message)
Bare board testing with integral components (3 messages)
bare copper shelf life (1 message)
Basic Fab. Tech. - 2 oz copper boards (1 message)
Beginners Course on Controlled Impedance (2 messages)
Bellcore (10 messages)
BELLCORE EXP Cu PAPER (1 message)
BELLCORE Standards (3 messages)
Bellcore TR-78 Revision (1 message)
Bellcore TR-NWT-000078 (5 messages)
Bellcore: TR-NWT-000078 (1 message)
Benchmark Stud ies (2 messages)
Benchmarking (2 messages)
Berquist & Cracking MLC's (1 message)
Best PCB solderability test (1 message)
BGA (9 messages)
BGA & MCML Packaging (1 message)
BGA and MCM (4 messages)
BGA assembly. (6 messages)
BGA Bare Board Testing? (2 messages)
BGA defects (4 messages)
BGA FInish (4 messages)
BGA Flux Cleaning and Testing (3 messages)
BGA INSPECTION (2 messages)
BGA JEDEC Spec? (3 messages)
BGA Pattern (6 messages)
BGA Pick & Place Using FUJI IP-2 (2 messages)
BGA PPM Question (2 messages)
BGA PROCESS GUIDELINES (4 messages)
BGA Reliability -- JPL Consortium Investigating BGA for NASA Use (1 message)
BGA shape (1 message)
BGA Solder Defect Criteria (2 messages)
BGA Solder joint cracki (1 message)
BGA Solder joint crackin (1 message)
BGA Solder joint cracking (1 message)
BGA solderability test (1 message)
BGA Standards (3 messages)
BGA's (1 message)
BGA's - one user's pers (1 message)
BGA's - one user's perspective (3 messages)
BGA, MCML & Chip Packaging (1 message)
BGAs (5 messages)
bismuth based solder (3 messages)
Black oxide on outer layers (9 messages)
Black Oxide Racks (1 message)
Black(??) oxide on outer layers (1 message)
Blind or Burried Via vs Number of Layers in PWB (2 messages)
Blind Via's in MLB's (3 messages)
Blind vias (9 messages)
Blind Vias In BGA Pads (1 message)
blowholes in entek boards (2 messages)
blowholes inentek boards/outgassing test (1 message)
Board Assembly of Chip-Size Packaged ICs (2 messages)
Board Bake (2 messages)
Board fab/Extended bake (3 messages)
Board Specification (fwd) (2 messages)
Board warp (4 messages)
Bob's Nearly New Books Reviews (1 message)
Bonding chip caps with Conductive adhesives (1 message)
bonding FR4 to 3003/3010 (1 message)
Bow & twist (3 messages)
Bow and Twist (8 messages)
Bow and twist - a new perspective for now/future (1 message)
Bow and twist - an old perspective for at least a while (2 messages)
Brittle Copper (3 messages)
bromine (1 message)
bromine free laminates (2 messages)
Brown resin like residue in solder bath (4 messages)
Browne (1 message)
BT desmear (2 messages)
BT Resin (1 message)
Bubbles in Conformal Coating (8 messages)
Buehler address (1 message)
Buried Resistors (4 messages)
Buying a used lamination press (1 message)
C A Picard Exposure Frames (5 messages)
CA Picard Exposure Frames (2 messages)
CA-Santa Rosa - (Contract) CAE Engineer with Mentor Design and Tool Background - Key Words: CCT C or Ample Programming Skills Quad EDA Mentor (1 message)
Cad packages (1 message)
Calcium ion on laminate (2 messages)
Call for technical sessions and speakers (1 message)
Can This Improvement to TechNet be Made? (4 messages)
Capacitor Aging (3 messages)
Capping vias for BGA's (6 messages)
Carbon Disulfide Generation (2 messages)
Carbon Ink vs Palladium (1 message)
Carbon Treatment (6 messages)
Cardboard boxes (3 messages)
Career Opportunity (1 message)
Cause and Corrective Actions for Pink Ring and Wedge Voids. (1 message)
CAUSE AND CORRECTIVE ACTIONS FOR PINK RING AND WEDGE VOIDS.. (1 message)
Cause and Corrective Actions for Pink Ring and Wedge Voids... (2 messages)
Causes for Shorts on PWB's (5 messages)
CCA Conference (1 message)
CCA Electrical Testing (1 message)
ccMail SMTPLINK Undeliverable Message (3 messages)
CE and Press Fit Connectors (1 message)
CEM-3 vs. FR-4 (2 messages)
CEM-3 vs. FR4 (1 message)
Certification (1 message)
CFC Cleaning Alternative (1 message)
CFCs (1 message)
Changing of reflow profile. (4 messages)
chemical clean prior to soldermask (4 messages)
Chemical Strippers (2 messages)
Chemistry to strip 90/10 SnPb (4 messages)
Chip bonding info (2 messages)
Chip on board (2 messages)
Chip Resistors Breaking (1 message)
Chip-on-Board (C.O.B.)technology in Portugal (1 message)
Chip-on-Board (C.O.B.)technology in Portugal (CORRECTED) (1 message)
Christmas (1 message)
CIQC (1 message)
Circuits Assy Mag (1 message)
Clarification (1 message)
Class on Basic Connectors (1 message)
Clean Rooms (2 messages)
Cleaning PCB's in Cascade to pass SIR test (1 message)
Cleaning SMT PCB's with demi-water or IPA. (1 message)
Cleaning unreflowed no-clean paste (1 message)
Cleaning with Water and IPA for Surface Mount ?! (2 messages)
Closure of Sigma Circuits (1 message)
CMI XRF Troubles (1 message)
COB/MCM (2 messages)
Collecting Thermal Data on Wave Soldered SMC's (1 message)
Collumated printers and fine lines (3 messages)
COMMERCIAL SOURCE OF ANTIMONY TETRAOXIDE POWDER (1 message)
COMP : BGA Positional Tolerance (1 message)
Comparison of ANSI/J-STD-001A to Mil-Std-200A (2 messages)
Compatability between saponification and PWB soldermask/marking (1 message)
compensation machine (4 messages)
Compliancenet (2 messages)
Component Lead Plating Thickness (1 message)
component mounting (1 message)
components in wiring (3 messages)
COMPOSITECH (2 messages)
Compositech CL 200+ (2 messages)
Conductive Anodic Filament Growth (CAF) (2 messages)
Conductive Epoxy w/ Solder Term. Chip Caps (2 messages)
Conductive Epoxy/ink (3 messages)
Conductive epoxy/ink circuitry. (2 messages)
Conductor widths (4 messages)
Condutor spacing of IPC and UL (1 message)
Conference (1 message)
CONFERENCE PAPER (2 messages)
Conferences on pcb:s (1 message)
Conformal Coating Adhesion Testing (2 messages)
Conformal Coating of BGA (1 message)
Conformal Coating of BGA's (1 message)
conformal coating spec (1 message)
Conformal Coatings (5 messages)
Connecting wires to PCB's (2 messages)
Connector soldering (1 message)
CONNECTOR WAVE SOLDERING (4 messages)
Consultants Council Forum at IPC Printed Circuits Expo (1 message)
contactless technologie for printed circuit boards (1 message)
contract manufacturing (6 messages)
Controlled depth drilling (2 messages)
controlled impedance (8 messages)
Controlled Impedance - Dielectric Consta (1 message)
Controlled Impedance - Dielectric Constant (6 messages)
Controlled Impedance - Dielectric Constant- Comment (4 messages)
Controlled Impedance - Reference Planes (4 messages)
Controlled Impedance Software (1 message)
CONVERT ARTWORK TO GERBER (1 message)
Conveyorized oxide? (3 messages)
Copper coupons for J-STD-004 Flux Activity Wetting Test (1 message)
copper gold galvanic during OSP application (4 messages)
Copper Pattern Plating Nodgles (5 messages)
Copper peel strength (1 message)
Copper plating (15 messages)
Copper Reclaim/Sale (2 messages)
copper thickness (2 messages)
Copper Thickness Designa (1 message)
Copper Thickness Designation (2 messages)
Copy of: Book Reviews from 1995 (1 message)
Copy of: Re: Fwd: SIR Handbook (2 messages)
Copyright on a PWB (fwd) (2 messages)
Corner cracks (1 message)
Correcte info for NEPCON proceedings (1 message)
Correlation between PCB form factors and multichip module (MCM) packages (1 message)
Coverlay for Adhesiveless Flex (1 message)
cracked solder joints with alloy 42 tsops (3 messages)
Cracking Capacitors (1 message)
Creepage (2 messages)
CRIMSON (2 messages)
Cross Sections (1 message)
Cross-section (1 message)
CTE & BGA's (1 message)
Cu on FR-4 (1 message)
Cu on FR-4 Laminates (2 messages)
CuPlating-Nodules (1 message)
Cut Sheet Lam (1 message)
Dangerous Material (3 messages)
Dave Rooke--Scoring Questions (1 message)
De-aging of capacitors (4 messages)
Deburring (3 messages)
Decoupling Tips (1 message)
Defect Rate (1 message)
Definitions (3 messages)
Definitions of CI (1 message)
Defoaming agents (1 message)
Delamination (2 messages)
Delay with feedthrus (1 message)
depanelization (3 messages)
des (2 messages)
DES & ASSY>Large Conductive Areas (1 message)
DES - BGA Layout App notes? (1 message)
DES - Poor Implementation (2 messages)
DES and ASSY>Bow and Twist (1 message)
DES and fab?? Back Pressure (4 messages)
des re: hot trace width (3 messages)
DES Solder lands 2 (2 messages)
DES VME Sizes (1 message)
DES, ASSY: Fine Pitch SMT (1 message)
DES- Gerber formats? (12 messages)
DES- Punched via (1 message)
DES- Soldermask Webs (1 message)
DES- True Differential Stri (2 messages)
DES-PC Board Frequency Limi (2 messages)
DES. (1 message)
DES/ASSY : BGA design question (3 messages)
DES/ASSY: 2 pin shunt connector (6 messages)
DES/ASSY: DFM Software (2 messages)
DES/ASSY: Diode Polarity (1 message)
DES/ASSY: Max size Thermal Relief (2 messages)
DES/FAB/ASSEM: BATB = ? (3 messages)
DES/FAB/ASSEM: Discontinued MIL specs (2 messages)
DES/FAB/ASSY ruggedize (1 message)
DES/FAB/ASSY: Part & via to board edge spacing (4 messages)
DES/FAB/ASSY: Ruggedized PWA's (1 message)
DES/FAB: 2.8-3.3 Dielectric 20x30 In. Laminate (1 message)
DES/FAB: hole wall thickness (1 message)
Des/Fab: IPC-D-356 netlist test (1 message)
DES/FAB: IPC-D-949 Solder Coat Thickness (4 messages)
DES/FAB: PEMNUT FASTENERS IN FR4 FIBERGLASS (11 messages)
DES/FAB: PEMNUT FASTENERS IN FR4 FIBERGLASS -Reply (1 message)
DES/FAB:Simulation data translation (1 message)
DES: "Spec"ing Controlled Impedance (1 message)
DES: 1/2 OZ. vs 1 OZ. Cu (2 messages)
DES: 1500V isolation (1 message)
DES: ASSY: BGA Sockets (1 message)
DES: Backplane termination (1 message)
DES: BGA "Extender Card" Interface (1 message)
DES: Blind or Burried Via vs Number of Layers in PWB (3 messages)
DES: bulk decoupling caps (1 message)
DES: Carbon Composition Resistors (1 message)
DES: Conductor Widths for High Current Conditions (2 messages)
DES: copper thickness (1 message)
DES: Current Through Vias (3 messages)
DES: Current Through Vias -Reply (1 message)
DES: Design for Testability (1 message)
DES: Design for Testability (fwd) (1 message)
DES: DFM and DFT about BGAs (3 messages)
DES: DFM and DFT about BGAs (E-MAIL) (1 message)
DES: DFM References (5 messages)
DES: Dimensional Specifications (fwd) (1 message)
DES: Embedded Microstrip IPC-D-317A (2 messages)
DES: EMI and micro switching induced noise (2 messages)
DES: EMI/RFI Training (3 messages)
DES: ETCH BACK (2 messages)
DES: Fiducials (1 message)
DES: Fusible link (3 messages)
DES: Greenfield (3 messages)
DES: Hole Sizes on PCBs for tight tolerance non-plated holes (4 messages)
DES: Internal and external ground planes (1 message)
DES: IPC-D-275 (1 message)
DES: IPC-D-275, part 1 (1 message)
DES: IPC-D-275, part 2 (1 message)
DES: IPC-SM-840 REV C (1 message)
DES: MATERIAL FINISHES (2 messages)
DES: Mixed dielectric controlled impedance (1 message)
DES: NC flux/stacked film capacitors (1 message)
DES: New Material? (4 messages)
DES: ODD/EVEN Mode Impedances (1 message)
DES: PCB Breakaway Design Rules (1 message)
DES: Punched via (3 messages)
Des: Re: Controlled Impedance - Dielectric Constant (1 message)
DES: Re: Delay with feedthrus (1 message)
DES: Re: IPC-D-356 (1 message)
DES: Re: PCB Copyright (1 message)
DES: RE>Sheet Resistivity of 1 OZ. Copper (2 messages)
DES: Re[2]: Conductor Widths (2 messages)
DES: Rigid Flex (3 messages)
DES: schematic conventions (2 messages)
DES: SOLDER SPLASH ON GOLD FINGER (1 message)
DES: Soldermask Webs (1 message)
DES: Specs for VME conduction cooling wedgelocks (2 messages)
DES: Switching speeds, stray capacitance, & No Clean flux (1 message)
DES: Tear Drops (1 message)
DES: Temperature Rise vs. Current of Heavy Copper (2 messages)
DES: Tented vias??? (1 message)
DES: Thermal Relief From Ground Planes (3 messages)
Des: To David Bergman c/o Technet (1 message)
DES: Tooling Holes tolerances. (3 messages)
DES: True Differential Striplines (1 message)
DES: VIAS - Thermal vs. Direct (9 messages)
DES:,FAB: - Thermal relief for via holes ?? (10 messages)
Des:1206 vs 0805 (1 message)
DES:? Coplanar + Stripline impedance equation wanted (FW) (1 message)
DES:ASSY: component mounting (4 messages)
Des:Conductive Adhesive (Was Pb Free) (1 message)
DES:FAB:ASSY: Breakdown (5 messages)
DES:FAB:ASSY:correction PWB SPEC MIGRATION (1 message)
DES:ISOLATION (2 messages)
DES:MIL-G-45204C (3 messages)
Des:Pb-Free solder etc (2 messages)
DES> Connector Reliability (3 messages)
design (7 messages)
Design comments (3 messages)
Design for Assembly softwares (1 message)
Design for Manufacture? (7 messages)
Design limits for traces under 1206 style packages (1 message)
Design questions (1 message)
DESIGN-benchmarking (1 message)
Design/Fab/Vias/thermals (1 message)
DESIGN: Bypass capacitor under PLCCs? (2 messages)
DESIGN: D-275 CURRENT CHART, RALPH ARE YOU OUT THERE? (1 message)
DESIGN: Tantalum failure modes (4 messages)
Design:Openings (1 message)
Designing, Processing and Disposition of electronics for the Environment (1 message)
DES\ASSY: Blind Vias In BGA Pads (1 message)
Details of measurement:Cleaning SMT PCB's with demi-water or IPA (1 message)
Dewetting & Pumice Scrub (7 messages)
DFA software (3 messages)
Dfe Info (1 message)
DFM (7 messages)
DFM Handbook (1 message)
diazo problems during lpi imaging (5 messages)
Die surface delamination (1 message)
Dielectric Breakdown Voltage of FPC (1 message)
Dielectric Constant-1 -4 gigaHz (1 message)
Dielectric/plated barrel separation in PWB holes (3 messages)
Differences in net lists (1 message)
Digest (1 message)
digest format? (1 message)
Digital Camera (1 message)
dimensional question (3 messages)
Dimensional specifications (5 messages)
Diode Polarity (3 messages)
DIP Socket (1 message)
Direct metalization of Flex Rigid PWBs (4 messages)
Direct Metallisation (1 message)
Direct metallization (3 messages)
direct plate & imaging (1 message)
Discontinued MIL SPECS (2 messages)
Dispensing Solder Paste (2 messages)
Disscussion on seepage /resist lifting problem in (1 message)
Disscussion on seepage /resist lifting problem in 4/4mil (2 messages)
Disscussion on seepage /resist lifting problem in 4/4mil a nd (1 message)
Disscussion on seepage /resist lifting problem in 4/4mil and 5/5 mil jobs.. (1 message)
Disscussion on seepage /resist lifting problem in 4/4mil and5/5 mil jobs.. (1 message)
Documentation for panelizing Different boards (4 messages)
Does IPC Puplish a standard on ESD (2 messages)
Don't want to scrap it. (3 messages)
Double sided reflow part restrictions (1 message)
Double Treat Laminate Surface Preparation (2 messages)
Dougal Stewart's email address <HAST> (1 message)
drill check (1 message)
Drill File Format (1 message)
Drill files for Plated/Unplated Holes (2 messages)
Drill size proliferation (1 message)
Drilling shift specs (1 message)
Drilling shifted (4 messages)
Drilling Spindle Runout (5 messages)
Drilling Study (5 messages)
Dross (1 message)
Dross Inquiry (1 message)
Dross on CCA (3 messages)
dry box (1 message)
Dry Box Source? (5 messages)
Dry Film adhesion (2 messages)
Dry Film Breakdown (5 messages)
Dry Film Processing (2 messages)
Dry Film Resist Test (6 messages)
Dry Film Test (2 messages)
Dryfilm (2 messages)
Dryfilm soldermask (4 messages)
Dryfilm soldermask -Reply (1 message)
DSN/FAB : 50 mil pitch thru hole connectors (1 message)
DSN: BGA DESIGN LAYOUT (5 messages)
Dst foil (3 messages)
Dull Copper after Tin stripping (2 messages)
Dull solder joint - Gold (1 message)
Dupont Publications (2 messages)
Duraflex/Roll-o-Lan (1 message)
Dynachem Film Problems (3 messages)
E.T. (1 message)
EBP/CEM33 (1 message)
EC Low Voltage Directive (3 messages)
Editor (2 messages)
Editors/Publishers (4 messages)
Editors/Publishers (fwd (1 message)
Editors/Publishers names and addresses (1 message)
Effects of poorly controlled Black-Oxide process (2 messages)
Elec. Cond. Adhesive for Hi Temp (3 messages)
Electrical test efficienc (2 messages)
Electrical test efficiency. (1 message)
Electrical Testing Conference (1 message)
Electro Deposited Resist (1 message)
Electro-Mechanical design position (1 message)
Electroforming vs Laser Cut Stencil (1 message)
Electroless Copper (1 message)
Electroless Ni (1 message)
Electroless Ni Eqpmt.-Vendor Req'd (1 message)
Electroless Ni-Boron (1 message)
Electroless Ni/Immersion Au (3 messages)
Electroless Nickel (3 messages)
Electroless Nickel - Immersion Gold (2 messages)
electroless nickel et. al. (1 message)
Electronic Packaging & Production (2 messages)
Electronics industry benchmarking tool (2 messages)
EMERSION GOLD (1 message)
EMI and micro switching induced noise (2 messages)
EMI/EMC Training Soruces? (1 message)
Emissivity (2 messages)
EMPF (1 message)
Employ. Opp. (SMT/Wave Eng.) (1 message)
Employment (1 message)
Employment Opportunities (3 messages)
Employment Opportunities / (1 message)
Employment Opportunity (8 messages)
Employment search (3 messages)
Employment: IE Tech and SMT Line Operator (1 message)
Encapsulation of Alloy 42 TSOP Solder Joints (1 message)
Encapsulation of TSOP Solder Joints (2 messages)
Eng:Formats Translators (4 messages)
Engineer Exercises Right Side Of Brain! (1 message)
Engineer for Hire (1 message)
Engineering Employment Opportunity (1 message)
Entec 106 (2 messages)
Entech (8 messages)
entek (4 messages)
ENTEK 106 (3 messages)
Entek Plus w/ tin fingers (1 message)
ENTEK PROCESS (1 message)
Entek vs Entech (1 message)
Entek/flex (1 message)
entry mat'l (2 messages)
Environmentally friendly saponifiers (3 messages)
EPOXY BONDING COMPONENTS TO SN/PB (2 messages)
Epoxy Resin Basic Sources (1 message)
EQUINOX (4 messages)
Equipment wanted (1 message)
ESD (2 messages)
ESD Material Evaluation (3 messages)
ESD packaging: antistatic polythene or metallised bags? (3 messages)
ESD standards (1 message)
ESD-humidity control (1 message)
ESD: Process capability for polymide(Kapton) Tape (2 messages)
ET Test Pins (4 messages)
Etch Information (2 messages)
Etching very thick copper (1 message)
EUROPEAN STANDSRDS (1 message)
EUTECTIC OR PLASTIC (1 message)
experience of wet lamination with Dstf or Mls copper laminate (2 messages)
Exposed Copper (4 messages)
Exposed copper after electroless nickel gold (2 messages)
Exposed Copper on Assem (1 message)
Exposed Copper on Assemb (1 message)
Exposed Copper on Assemblies (11 messages)
Exposing thru-hole componets to reflow temperature (1 message)
Exposing thru-hole componets to reflow temperature cycles. (1 message)
Exposure equipment (1 message)
Fab (13 messages)
FAB - Black oxide on outer layers (1 message)
FAB - Durabond as a replacement for Black Oxide... (7 messages)
FAB - Employment Opportunity (1 message)
FAB - IPC-ML-910 & IPC-ML-950 (1 message)
FAB - IPC-ML-910 & IPC-ML... (1 message)
FAB - JOB Opening (1 message)
fab - looking for QUAD control impedance software (3 messages)
FAB - Mil specs (2 messages)
Fab - RB-276 (1 message)
Fab - RB-276 with clarification (2 messages)
Fab - RB-276? (2 messages)
FAB - Small Hole Drilling (4 messages)
Fab - Used tool resale (2 messages)
FAB -Reply (1 message)
FAB .......... Looking for Fume Exhaust Vendors (2 messages)
FAB / ASSY (2 messages)
Fab / Assy => Soldermask (1 message)
FAB 11 June Dinner Meeting, IEPS Los Angles/Orange Chapter, (1 message)
FAB : Odd Layer PCB's (6 messages)
Fab :chemical-clean roller marks (2 messages)
Fab :Soldermask (1 message)
FAB and ASSY - Sulphur contamination (1 message)
FAB and DES: Subject: Design for Manufacture? (Zo) (1 message)
FAB Copper plating (1 message)
FAB Delamination (3 messages)
FAB Dross (1 message)
FAB DWGS - Specifying Material/Stackup (3 messages)
Fab Employment Opportunity (1 message)
Fab FAB Re: Copper Peeling Problem (2 messages)
FAB gold plating problem (3 messages)
Fab houses (1 message)
FAB Inner layer PAD Suppression or NOT? (1 message)
Fab or Assy: Instron Tester (4 messages)
Fab or Des: Thickness of foil (1 message)
FAB or DES: Z-Axis expansion (4 messages)
FAB Re Tin plt. instead of Sn/Pb (9 messages)
FAB RE: Gelatinous residue on High Tg Material (1 message)
FAB RE: Shadow (1 message)
FAB Studies vs. Wirewrap (1 message)
FAB Teflon-like materials (1 message)
FAB Test Fixture Loading (1 message)
FAB Trade OFFs (1 message)
FAB White solder mask (1 message)
FAB, ASSY: "Copper Burning" during plating (3 messages)
FAB,DES:Planar magnetics (1 message)
FAB- AOI DATABASE TERMS (1 message)
Fab- Dosage pumps (1 message)
FAB- E-GLASS VS. S-GLASS (1 message)
FAB- Finding a Solderpot (1 message)
FAB- Green rust (1 message)
Fab- monitoring wavelength in exposure units (4 messages)
FAB-AOI DATABASE TERMS A (1 message)
FAB-etchback (2 messages)
Fab-Ionic Contamination (2 messages)
Fab-Ionic Contamination (#504239) (1 message)
FAB-LAMINATE CROSS PLY (2 messages)
FAB-OSP-copper gold gal (1 message)
Fab-Re- Nailheading (n+1 (1 message)
Fab-Re: More nailheading (4 messages)
Fab-re: Multiple HASL (1 message)
Fab-Re: Nailheading (2 messages)
Fab-Re: Question about Wedge voids (1 message)
FAB-US RIM (3 messages)
Fab. Re: Santa Clara process (1 message)
Fab.:Recycling (1 message)
FAB/ASM: Pressure Fit Entek (3 messages)
FAB/ASSEM: Re: solderability testing (1 message)
FAB/ASSY (1 message)
Fab/Assy : Nitorgen/Inert Storage Chamber/Cabinet (4 messages)
FAB/ASSY Team processes (1 message)
FAB/ASSY/DES: Outgassing solder in via-hole (1 message)
FAB/ASSY: Gold Wire Bonding Tests (1 message)
FAB/ASSY: Lifted land criteria (3 messages)
FAB/ASSY: OSP to No Clean Flux (2 messages)
FAB/ASSY: PREFERED PWB SURFACE FINISH FOR BGA (1 message)
FAB/ASSY: Reliability w/conductor width reduced (3 messages)
FAB/ASSY: solder in via-hole (3 messages)
Fab/assy:reference designators (5 messages)
FAB/DES (4 messages)
FAB/Des - Flex Circuits (3 messages)
FAB/DES Processing Getek, et.al. (1 message)
FAB/DES: Resin Fill Criteria for Vias (1 message)
Fab/Dry film SM (1 message)
FAB/DSN: LCC (1 message)
Fab/HO Reflow (4 messages)
FAB/Re: Soldermask over vias (1 message)
FAB: (1 message)
FAB: .250" vs .375" Thick Lamination Caul Plates (1 message)
FAB: Abrasion resistant coatings (1 message)
FAB: Additive Processes (1 message)
FAB: adhesiveless rigid/flex covercoat (2 messages)
FAB: Aluminum Processing (2 messages)
fab: Aluminum Wire Bonding (2 messages)
FAB: AOI DATABASE TERMS AND DEFS (3 messages)
FAB: Arlon (4 messages)
FAB: ASSY: Fine Pitch solder thickness w/HASL (1 message)
FAB: Automatic exposure machines (2 messages)
Fab: Automatic Feeder (2 messages)
FAB: Barcoding panels (3 messages)
FAB: Barrel Cracking due to Air Entrapment (9 messages)
FAB: Base material flexibility (1 message)
FAB: Basic Fab. Tech. - 2 oz copper boards (1 message)
FAB: BLIND VIAS (3 messages)
FAB: Board Analysis - One More Time (2 messages)
FAB: Bonding Plating (2 messages)
FAB: Brass Saddles (V-Blocks) (2 messages)
Fab: Brittle Copper (1 message)
FAB: Broken Drill Bits (2 messages)
FAB: BT Resin (2 messages)
Fab: Carbon Treatment (2 messages)
FAB: carbonink (1 message)
Fab: Card Bus 90 Ohms? (1 message)
FAB: chemical-clean roller marks (7 messages)
Fab: Chip-On-Board considerations (1 message)
FAB: Cirlog (3 messages)
FAB: CLEANING EXPOSURE UNIT REFLECTORS (5 messages)
FAB: Cleanliness test on bare and soldermask and mounted PWC. (5 messages)
Fab: CMI Eddy Current Probes (5 messages)
FAB: Commercial sources for "weapons complex" boards (2 messages)
FAB: Compositech laminate (3 messages)
FAB: Conductive epoxy/ink circuitry. (2 messages)
FAB: Copper Filled Via's (5 messages)
FAB: Cross Sections (2 messages)
FAB: Curtaincoat Probimer 52 process (2 messages)
FAB: Cut Sheet Lam (3 messages)
FAB: Cut Sheet Lam -Reply (1 message)
FAB: Cut Sheet Lam -Reply -Reply (1 message)
FAB: Cyanate-Ester mil-spec mfr's (1 message)
FAB: DATE CODES (2 messages)
FAB: DELMAT (3 messages)
FAB: Depanel PUSH-in PUSH-out (2 messages)
FAB: Depositing Beryllium (2 messages)
FAB: DES: ASSY: PWB SPEC MIGRATION (1 message)
Fab: Desperately Seeking Suppliers (2 messages)
FAB: Direct Metalization (2 messages)
FAB: Dissipation Loss Specs (3 messages)
FAB: Documentation for panelizing Different boards (1 message)
FAB: Double Treated Copper (4 messages)
Fab: Drill Bit Web Thickness (2 messages)
FAB: Drill Dial Indicator (1 message)
FAB: drill files 1 or 2 (1 message)
FAB: Drill size proliferation (2 messages)
FAB: Drilling accuracy/repeatability (3 messages)
Fab: Drilling Teflon (1 message)
FAB: DSN: V-groove and SMT (2 messages)
Fab: DuPont Resist (1 message)
FAB: E-GLASS VS. S-GLASS (3 messages)
FAB: ED RESIST - DIFFUSION PAPER (1 message)
FAB: Edge Plating (3 messages)
FAB: Electroless copper (3 messages)
FAB: Electroless Nickel - Immersion Gold (5 messages)
FAB: Electroless thickness measurements (3 messages)
FAB: Electroless Tin (7 messages)
FAB: Electrolytic Tin (2 messages)
FAB: Embedded Components (3 messages)
FAB: Emissivity (3 messages)
FAB: Equipment for Cleanliness testing acc. to MIL-P-551 (2 messages)
FAB: Equipment for Cleanliness testing acc. to MIL-P-55110E (2 messages)
FAB: ETCHBACK (8 messages)
FAB: etching process (3 messages)
FAB: European Suppliers (4 messages)
FAB: Excellon EX-300 4 Sale (1 message)
FAB: Exhaust Air "filter" (2 messages)
FAB: Fab Drawing misinterpretation.. (3 messages)
FAB: Fabrication Houses in Phillipines (4 messages)
FAB: Film compensation (9 messages)
FAB: Film Plotting (large format) (2 messages)
FAB: Finding a Solderpot (4 messages)
FAB: Fine Pitch solder thickness w/HASL (4 messages)
FAB: First Article Inspection (2 messages)
FAB: Flash Gold finish (1 message)
FAB: follow-up on electroless thickness measurements (2 messages)
FAB: follow-up on HASL cleaning inquiry (1 message)
FAB: Formula for Etching (3 messages)
FAB: FUSE STANDARDS ON RESEARCH REFUSING MACH (1 message)
FAB: Fwd: Printed Circuit Board Lamination Process (2 messages)
fab: Getek Material (4 messages)
FAB: Gold Porosity Testing (2 messages)
FAB: Green rust (10 messages)
FAB: HAL for thin boards? (3 messages)
FAB: HASL DROSSING (5 messages)
FAB: Heat Expansion (3 messages)
FAB: Heavy Cu/Soldermask (2 messages)
FAB: hole burrs (9 messages)
FAB: Horizontal Hot Air Leveler (2 messages)
FAB: Horizontal vs. Vertical HAL (1 message)
FAB: How quick can a board be made? (4 messages)
FAB: Hull cell measurements (5 messages)
FAB: Humidity Testing (1 message)
FAB: I24768\27 (2 messages)
FAB: IMAGE ROOM CLEANLINESS (2 messages)
FAB: Immersion gold inquiry (2 messages)
FAB: Independent Lab for Board Residue Analysis (4 messages)
FAB: Innerlayer misregistration xray (1 message)
Fab: Interconnect Failure (4 messages)
FAB: Ionic test vs SIR (4 messages)
FAB: IPC-SM-840 (4 messages)
FAB: IPC-SM-840, Rev. C published (1 message)
fab: ipcD275 (1 message)
FAB: IR Pyrometer Emissivity (1 message)
FAB: laminate (1 message)
fab: laminate flame retardant agents (2 messages)
FAB: Laminate properties, film compensation (4 messages)
FAB: Lamination (5 messages)
FAB: Large conductive areas (4 messages)
FAB: LOOKING FOR A BOARD HOUSE (1 message)
Fab: Looking for Fab House (1 message)
FAB: LPISM over Reflow Sn/Pb (4 messages)
FAB: Manual Scrubbing prior to NiAu (4 messages)
FAB: Matte vs. Glossy Soldermask (1 message)
FAB: Measure inner layer (1 message)
FAB: MEASURING DEVICE FOR V-CUT (1 message)
FAB: min outside radius - PWB corner (2 messages)
FAB: Mini Cards ?? (2 messages)
FAB: MOISTURE CONTENT INNER LAYERS (3 messages)
FAB: Moisture extraction (2 messages)
Fab: More nailheading (1 message)
FAB: More Pink-ring (2 messages)
fab: Multilayer Test Coupons (3 messages)
fab: mylar peeler (1 message)
Fab: Nailhead/wedge voids (1 message)
Fab: New Rigid board specs. (1 message)
FAB: Nozzles for Horiz. Conv. (3 messages)
FAB: ODD-EVEN Mode Impedance (2 messages)
FAB: One step soldermasking to plug vias (2 messages)
FAB: organic contam. on wire-bond gold (3 messages)
FAB: Outer layer hole registration - Breakout (1 message)
FAB: PCB Delamination and Warp (5 messages)
FAB: PCB Fabrication Drawing. (4 messages)
FAB: PCB Fabrication Drawing. Part 2 (1 message)
FAB: PCB Materials (2 messages)
FAB: PCB thickness (4 messages)
Fab: PCMCIA PCB Fabrication Spec (2 messages)
FAB: PCMCIA PCB's (2 messages)
FAB: PCMCIA PCB's Cu Weight (1 message)
FAB: Perfag standars (1 message)
FAB: photoresist adhesion - testing and process control (3 messages)
FAB: Pink Ring vs. Delamination (1 message)
FAB: Plating line (1 message)
FAB: Post-Lam Bake (3 messages)
FAB: Prefered way of cutting dry film after lamination (3 messages)
Fab: Printed Wiring Board Qualification (4 messages)
Fab: Processing GETEK (1 message)
FAB: Production Machines (1 message)
FAB: PTH Copper thickness (1 message)
FAB: PWB Benchmark Activity (2 messages)
FAB: Re Pull test SM land (1 message)
Fab: Re: breakout testing (1 message)
FAB: Re: Controlled Impedance - Dielectric Constant- Comment (2 messages)
FAb: Re: filled buried vias (1 message)
Fab: Re: Laminate voids (2 messages)
FAB: Re: Plugged Vias (1 message)
FAB: RE: X-outs on panels (1 message)
Fab: Re:Negative etchback (2 messages)
Fab: Re; More on tin plate (1 message)
Fab: Recent Nailheading Discussion (1 message)
FAB: Reject Identification (1 message)
FAB: Request assistance in choosing AOI, please! (1 message)
FAB: Request water jet cutting info -3/19 message resend. (1 message)
FAB: Resin Coated Cu - Tech Ques's & Availability (3 messages)
FAB: Resin in via (1 message)
FAB: Resist Lamination (7 messages)
FAB: RFI/EMI Vias (6 messages)
FAB: Rogers R4003 (1 message)
FAB: Rolled solder response (1 message)
FAB: seek for powerful strike on customers who don't rea (1 message)
FAB: Shearing Machines for Laminates (1 message)
FAB: Silk-screen ink on surface mount pads (17 messages)
FAB: Silver Decoration Solution (4 messages)
FAB: silver vs. HASL/OSPs (3 messages)
FAB: Single Ply B-stage Use (1 message)
Fab: Single Ply Prepreg (1 message)
FAB: Software (2 messages)
FAB: Solder Finish Survey Results (1 message)
FAB: Solder Mask on Traces Pulling Off (1 message)
FAB: Solder plated shields (5 messages)
fab: Solderability (6 messages)
FAB: Soldermask Clearance and Web Width requirements (4 messages)
FAB: soldermask plugged vias (5 messages)
FAB: Soldermask to edge of board (3 messages)
FAB: Soldermask Webs (1 message)
FAB: Soldermask Webs. (1 message)
Fab: Source for registration fixture (2 messages)
Fab: Source inspector (1 message)
FAB: SPC of printer (4 messages)
FAB: SPC of printers (1 message)
FAB: Tank Liners (CoreSeal) (3 messages)
FAB: Tenting Au/Ni vias (1 message)
FAB: Tenting Au/Ni vias with LPI? (1 message)
fab: Test Coupon Traceability (2 messages)
FAB: Thickness of copper on PCB (1 message)
FAB: Tin Lead etch resists (fwd) (3 messages)
FAB: To Drilling Proc Engineers & "Experts" (2 messages)
FAB: to etch chrome but not copper (3 messages)
FAB: Trace Repairs (1 message)
Fab: Ultrasonic Flood Modules for Conveyorized Equipment (4 messages)
FAB: Use of MEK (5 messages)
FAB: Use of MEK -Reply (1 message)
Fab: Using Amonia (NH3) Gas for Plasma Etching (2 messages)
FAB: UV Exposure machnie (1 message)
Fab: Vacuum Desiccation Chambers (1 message)
Fab: Vacuum Dessication Chambers (3 messages)
FAB: Via Size (2 messages)
FAB: Void holes (4 messages)
FAB: Wanted Solder Reflow Service (1 message)
FAB: Wire-bondable gold (4 messages)
FAB:Ass:Results Solder Finish Survey (1 message)
FAB:Assy More Book Reviews (1 message)
FAB:ASSY:pad spacing (6 messages)
FAB:Black oxide Vs Alpha preq (2 messages)
FAB:BURNS FROM SHORTS (3 messages)
FAB:Controlled Z drilling for blind or buried vias (2 messages)
FAB:Cupric Chloride Etchant (5 messages)
Fab:CyanateEster. (1 message)
FAB:DELAMINATION (1 message)
FAB:DFM Software (2 messages)
FAB:direct plate (1 message)
fab:Electrical Test of Inner Layers (4 messages)
FAB:Electroless Ni/Immersion Au & press-fit connectors (5 messages)
FAB:electroless nickel-Immersion Gold (3 messages)
FAB:Employment Opportunity (1 message)
FAB:etchback (1 message)
FAB:Fwd: Re: Plugged Vias (1 message)
fab:HAL (2 messages)
FAB:haloing (4 messages)
FAB:Open Vias Problem (2 messages)
FAB:OSP:copper gold galvanic during OSP application (1 message)
FAB:peelable soldermask (2 messages)
FAB:Post-Etch-Punch and Optical Post Lamination (Optimizer) (1 message)
FAB:Program to calculate controlled impedance (1 message)
FAB:Questions about pink-ring (4 messages)
Fab:Re: Breakout at innerconnect (2 messages)
Fab:Re: Crossplying lamination (2 messages)
FAB:RE: inspection lighting (1 message)
Fab:Re: Ionic Contamination (2 messages)
FAB:Re: Large Conductive Areas (1 message)
FAB:Re: re: test: FLYING PROBE VS. HARD TOOLING (1 message)
Fab:Re:wavesoldering mixed tech boards (1 message)
Fab:Re:wavesoldering mixed tech boards (fwd) (1 message)
FAB:Removal of Unused Pads (1 message)
Fab:Re[2]:galvanic copper gold reaction. (1 message)
FAB:Riveting Machine (2 messages)
FAB:Single Glass Layer Core Material (FR4) (3 messages)
FAB:Solder Finish Survey (6 messages)
Fab:Tooling Pins for Electrical Test Fixture (1 message)
fab:ultrasonics in conveyorized equipment (1 message)
FAB:Wire Bonding (2 messages)
FAB; ASSY: Conductive Elastomer (3 messages)
Fab; Re; 2 oz copper boards (1 message)
FAB;ASSY New Book Reviews (1 message)
FAB>PCB Grid Boards- Source (1 message)
Fab? (re: Teflon) (1 message)
Fabrication (17 messages)
Fabrication - MIL-specs (3 messages)
Fabrication Qualification Profile (2 messages)
Fabrication(FAB) (1 message)
Fabrication/Repair (1 message)
FABRICATION: E-Test (7 messages)
Failed Mail (1 message)
Family tree of IPC Specs (1 message)
Farewell to [log in to unmask] (3 messages)
Fatigue resistant high temp solder (3 messages)
Fault finding on test vehicles (4 messages)
FIber Optic Handling (1 message)
Field Return Relaibility Data (3 messages)
File Translators!?! (2 messages)
Fill vias for reliability?? (2 messages)
Filleting of via pads (1 message)
Filling via holes with Cu loaded epoxy (1 message)
Fine Lines on PWB's (1 message)
Fine Pitch in Motion (4 messages)
flatness affected by build-up? (2 messages)
Flex Analysis Software (1 message)
Flex Analysis Sorftware (1 message)
Flex and Entek (2 messages)
Flex Drilling (1 message)
flex drilling information (1 message)
Flex Endurance Testing (2 messages)
flexible circuit (6 messages)
Flexible circuit manufacturing (2 messages)
Flip chip bumping alternative (2 messages)
Floor coating for screening (3 messages)
Fluid Dynamics (3 messages)
Flux (2 messages)
Flux - Fumes (2 messages)
Flux complinace to J-Std-001A (4 messages)
Flux contamination in Pentium Socket (2 messages)
Flux fumes (1 message)
Flux Info (2 messages)
Flux Residue After Wave (1 message)
Flux Residue After Wave Cleaning (3 messages)
Flying probe testing (2 messages)
Footprint Pattern (4 messages)
for Bab-Hui Lee %P influence on solderability (1 message)
for ipcTechNET -FABRICATION AND ASSEMBLY (1 message)
Forms (1 message)
forwarded massage (3 messages)
FR-1 - Paper Phenolic Materials (1 message)
FR-4 laminate characterization (1 message)
FR2 Printed Circuit Boards (6 messages)
FR5 LAMINATE FOR PCB (1 message)
FR6 Laminate (2 messages)
Frear, Jones, and Kinsman "Solder Mechanics" text. (1 message)
FREE PHOTO DEFINED MICROVIA WORKSHOP - THURS NOV 14TH - WESTFORD MA - ALL WELCOME - CALL OR E-MAIL TO REGISTER (1 message)
Free Technical Seminar (1 message)
Free Unlimited Gerber Viewer for Windows (1 message)
Frequnecy limits. Dielectric Loss. (1 message)
Fungal contamination (7 messages)
FUTUREBUS+ brd dims (1 message)
FW: !!! VIRUS ALERT !!! (fwd) (1 message)
FW: !st reflow oven (1 message)
FW: (ASSEM) Wave soldering SOT-23 (1 message)
FW: (FAB) Fine Line Imaging (1 message)
FW: Almit solder (1 message)
FW: Alphametals Ionograph 500 M Test (2 messages)
FW: ASSY: Fine Pitch Dewetting? (4 messages)
FW: ASSY: Lead Trim After Wave (1 message)
FW: ASSY: Packaging - Heat Sealing? (1 message)
FW: ASSY: Peelable Soldermask for Wave Soldering Process (1 message)
FW: ASSY: Smocks, are they necessary? (1 message)
FW: ASSY: Teflon Board Repair (1 message)
FW: Buried Resistors (1 message)
FW: Connecting wires to PCB's (1 message)
FW: Cupric Chloride Etching (2 messages)
FW: DES:FAB:ASSY: Breakdown (3 messages)
FW: DIRECT METALIZATION (1 message)
FW: Dry Film Breakdown (1 message)
FW: Entech (1 message)
FW: EQUINOX (1 message)
FW: FAB DES HIGH SPEED DESIGNS ON FR-4 (1 message)
FW: FAB: Finding a Solderpot (1 message)
FW: FAB: IMAGE ROOM CLEANLINESS (1 message)
FW: FAB: Trace Repairs (1 message)
FW: Failed Mail (1 message)
FW: Flux contamination in Pentium Socket (1 message)
FW: FW: ASSY: Fine Pitch Dewetting? (1 message)
FW: FW: Liability (3 messages)
FW: Gen:Environment (1 message)
FW: Gold Flash on PWB's (1 message)
FW: Guideline on selection of stencil thickness for SMT (1 message)
FW: Half ounce internals (2 messages)
FW: HASL Surface Tolerence (1 message)
FW: Help! I Need Training Materials! (2 messages)
FW: Hole breakout - request for opinions/assistance (2 messages)
FW: Ink preparation mixing bubbles (2 messages)
FW: IPC and UL (1 message)
FW: IPC Specification (2 messages)
FW: JTAG Testing (1 message)
FW: Lables for Card Assemblies (1 message)
FW: Liability (2 messages)
FW: Marking of 0603's (1 message)
FW: Military Polyimide Board Failures (1 message)
FW: Need to buy empty reels SMT -Reply (1 message)
FW: Nickel/Gold Immersion (2 messages)
FW: PCB board age (1 message)
FW: Protection of BGA Solder Joints (1 message)
FW: PWB and PCB??? (1 message)
FW: Re[2]: ASSY: Baking before wave soldering (1 message)
FW: Re[2]: Humidity Testing (5 messages)
FW: Re[3]: BGA FInish (1 message)
FW: Re[3]: Soldermask Tented Vias (1 message)
Fw: Single Ply (1 message)
FW: Solder defect rate at 20mil pitch (fwd) (1 message)
FW: Soldermask webs (1 message)
FW: spc (1 message)
Fw: STAT-A-MATRIX (1 message)
FW: Stencil Printing Adhesive (for bottom side SMT) (2 messages)
FW: Unfused Solder and/or Tin (1 message)
FW: Users/designer of buried via product (3 messages)
FW: Vapor Phase Reflow (1 message)
FW: Very heavy copper pcb's (2 messages)
FW: Virus Alert (3 messages)
FW: Virus Alert (Hoax) (1 message)
FW: Warped - Don't want to scrap it. (2 messages)
FW: warped completed assemblies (1 message)
FW: Wave solder not adhering to electrot (2 messages)
FW: wavesoldering mixed tech boards (2 messages)
FW: White residue/lead oxide (1 message)
FW: X-outs on panels (1 message)
FW:Preferred PWB Surface for BGA (1 message)
fwd- FAB- Tenting Au/ (1 message)
fwd- FAB- Tenting Au/Ni (1 message)
Fwd: (ASSEM) Wave soldering SOT-23 (3 messages)
Fwd: (no subject) (1 message)
FWD: ASSY: PCMCIA Vendor (2 messages)
Fwd: Assy:looking for production aid (1 message)
Fwd: BLACK OXIDE (1 message)
FWD: Board stretch (1 message)
FWD: Capping vias for BGA's (1 message)
Fwd: conformal coating (5 messages)
fwd: Controlled depth drilling (1 message)
Fwd: DES/ASSY: 2 pin shunt connector (2 messages)
Fwd: Dross on CCA (1 message)
fwd: Employment Opportunities (1 message)
Fwd: Employment Opportunity (1 message)
fwd: Fab: CMI Eddy Current Probes (1 message)
fwd: FAB: Double Treated Copper (1 message)
fwd: FAB: How quick can a board be made? (1 message)
fwd: FAB: Hull cell measurements (1 message)
fwd: FAB: MOISTURE CONTENT INNER LAYERS (1 message)
fwd: FAB: Post-Lam Bake (1 message)
fwd: FAB: Reject Identification (1 message)
fwd: FAB: Tenting Au/Ni vias with LPI? (2 messages)
fwd: FAB:Questions about pink-ring (1 message)
fwd: Fab:Re: Breakout at innerconnect (1 message)
fwd: Filleting of via pads (1 message)
Fwd: FUTUREBUS+ brd dims (1 message)
Fwd: GEN: Acceptable level of indor humidity? (1 message)
Fwd: GEN: Apology....and then some. (1 message)
Fwd: GEN: Blind via Fill (1 message)
Fwd: GEN: TOC Labs and Acid Copper (1 message)
FWD: gold (1 message)
Fwd: HARDWARE LOOSENING AFTER WAVE SOLDER (1 message)
Fwd: In search of Delta Circuits (1 message)
fwd: In-process Test coupons (1 message)
Fwd: Internet Address (1 message)
fwd: Min. line width and spacing (1 message)
Fwd: Need GERBER Aperture List (1 message)
Fwd: newbie search question (1 message)
Fwd: pc cards (1 message)
fwd: PCMCIA Dimensional Stabilty (2 messages)
Fwd: PEELING TIN LEAD (1 message)
FWD: pwb-cca : conformal coating (7 messages)
Fwd: RE: ASSY: Cu Ni Sn board finishes (2 messages)
FWD: RE: assy: Dross elimination (#943028) (1 message)
FWD: RE: assy:NiAu pwb soldering w/Sn62? (1 message)
FWD: RE: Black oxide on outer layers (1 message)
Fwd: Re: Copper plating (2 messages)
Fwd: Re: GEN: Doggerel (1 message)
FWD: Re: Gold Flash on PWB's (1 message)
FWD: RE: Soldering 50 mil connectors (1 message)
fwd: Reducing Rinse Water Flow Rates (1 message)
fwd: Re[2]: Step tablet (1 message)
fwd: RO40003 and RO4350 (2 messages)
fwd: Screen saver problems under windows 95 (2 messages)
fwd: Soldermask over vias (1 message)
Fwd: Sonada Papers (1 message)
Fwd: Tented vias??? (1 message)
FWD: Text books (1 message)
fwd: Thieving (1 message)
Fwd: User Supplier Workshop (2 messages)
fwd: Vibrators (1 message)
Fwd:HOT ONE, JUST CAME IN!!!!!!!! (1 message)
FWD>>DES/FAB- hole wall thi (1 message)
FWD>Analog guard rings (1 message)
FWD>ass- axial (1 message)
FWD>Ass- Cable Assembly Des (1 message)
FWD>ASSY- PCB Repair - Plat (1 message)
FWD>ASSY- Solder in Connect (1 message)
FWD>ASSY-Flagging (1 message)
FWD>assy: hot bar solder jo (5 messages)
FWD>ASY- external high-volt (1 message)
FWD>Bow and Twist (1 message)
FWD>Bubbles in Conformal Co (1 message)
FWD>Controlled Impedance - (1 message)
FWD>copper thickness (1 message)
FWD>Delay with feedthrus (1 message)
FWD>DES & FAB Large Conduct (1 message)
FWD>DES- 1500V isolation (3 messages)
FWD>DES- bulk decoupling ca (1 message)
FWD>DES- ODD/EVEN Mode Impe (1 message)
FWD>DES- Specs for VME cond (1 message)
FWD>DES-ASSY- component mou (1 message)
FWD>DES-FAB-ASSY- Breakdown (1 message)
FWD>DES-ISOLATION (2 messages)
FWD>DES/FAB- hole wall thic (1 message)
FWD>DES/FAB/ASSY- Ruggediz (2 messages)
FWD>DESIGN- Tantalum failur (1 message)
FWD>DIP Socket (1 message)
FWD>EMI and micro switching (1 message)
FWD>FAB or DES- Z-Axis expa (1 message)
FWD>FAB- (table cleanup) E- (1 message)
FWD>FAB- Depositing Beryll (1 message)
FWD>FAB- Dissipation Loss (1 message)
FWD>FAB- Edge Plating (1 message)
FWD>FAB- Etchback (PB Etchi (3 messages)
FWD>FAB- Etchback (PB Etching) (1 message)
FWD>FAB- Exhaust Air "filte (1 message)
FWD>FAB- FUSE STANDARDS ON (1 message)
FWD>FAB- Fwd- Printed Circu (1 message)
FWD>FAB- MEASURING DEVICE F (4 messages)
FWD>FAB- PCB Materials (1 message)
FWD>FAB- PCB thickness (1 message)
FWD>FAB- RFI/EMI Vias (2 messages)
FWD>Fab-Re- More nailheadin (1 message)
FWD>FAB/ASSY- Lifted land c (1 message)
FWD>FW- ASSY- Smocks, are t (1 message)
FWD>GEN- Dot Spray Marking (1 message)
FWD>Laminate Voids (4 messages)
FWD>Legend (1 message)
FWD>more heavy copper... (1 message)
FWD>Open vias problem (1 message)
FWD>Operating Temperatures (1 message)
FWD>PCB Grid Boards- Source (1 message)
FWD>Questions_about_PCB#180#s (2 messages)
FWD>RE>ADMIN- Sales posting (1 message)
FWD>RE>ASSY revision J- (1 message)
FWD>RE>ASSY revision J-STD- (2 messages)
FWD>RE>ASSY- tinning of com (1 message)
FWD>RE>Can This Improvement (1 message)
FWD>RE>Conductor widths (1 message)
FWD>RE>Controlled Impedance (1 message)
FWD>RE>DES- Re[2]- Conducto (1 message)
FWD>RE>DES-PC Board Frequen (1 message)
FWD>RE>FAB or DES- Z-Axis e (1 message)
FWD>RE>FW- DES-FAB-ASSY- Br (1 message)
FWD>RE>Haloing and Pinkling (2 messages)
FWD>RE>IPC spec IPC-A-600D (1 message)
FWD>RE>Placement of bypass (2 messages)
FWD>RE>Silver Plating over (1 message)
FWD>warped completed assemb (1 message)
FWD>[2]PCB Grid Boards- Sou (1 message)
FYI: Solder Joint Stress Generated from Compression Connector (3 messages)
Galvanic Corrosion (4 messages)
Gelatinous residue on High Tg Material (2 messages)
GEN (1 message)
Gen - Job postings (2 messages)
GEN / FAB: Impedance Testing Services (3 messages)
GEN : Re. SIR Questions (1 message)
Gen : SMT design/process issues (4 messages)
GEN Milspex & JEDEC URL (1 message)
Gen Polar Instruments Controlled Impedance Measurements Contacts (1 message)
GEN- Advice on Process C (1 message)
Gen- Job postings (1 message)
GEN/Persulfate-sulfuric (1 message)
GEN: A Contract Assemblers Happy New Year... (1 message)
GEN: Acceptable level of indor humidity? (1 message)
GEN: Adhesives (3 messages)
GEN: Advice on Process Control (5 messages)
Gen: Announcement for your e-mail comm network (1 message)
GEN: ANSI-J-STD-001A (4 messages)
GEN: Apology....and then some. (4 messages)
GEN: AT&S Help wanted (1 message)
Gen: ATTN: George Franck Jr. (1 message)
GEN: Blind via Fill (7 messages)
GEN: CAD TO GERBER CONVERSION (5 messages)
GEN: Cadence Allegro >--< AutoCAD dwg utilities (3 messages)
GEN: Carbon Ink vs. Gold Reliability (3 messages)
Gen: Cold Solder Joints (3 messages)
GEN: Condor Fan Club (1 message)
GEN: Cu component leads (1 message)
GEN: Doggerel (4 messages)
GEN: Dot Spray Marking (1 message)
GEN: Dream a Little Dream (4 messages)
GEN: Electronic Component Packaging Specs. (4 messages)
GEN: Electrowinning Units (1 message)
GEN: EMAIL (1 message)
Gen: Email -- Temperory stoppage (2 messages)
GEN: Employment Opportunity -- PACE Inc. (1 message)
GEN: Employment; CAD/CAM operator (1 message)
GEN: Enough is enough (1 message)
GEN: ESD FLOORING (1 message)
GEN: ESD FLOORING -Reply (2 messages)
GEN: ESD FLOORS (1 message)
GEN: ETCH 5/5 and 6/6 (1 message)
Gen: Flex Conference '97 (1 message)
gen: GoodBye (1 message)
GEN: Heard of Interconnect Stress Testing (IST)? (8 messages)
GEN: Heat - Sealing? (4 messages)
GEN: Help wanted (2 messages)
GEN: IEEE BGA/Flip Chip Workshop (1 message)
GEN: Inappropriate Email (2 messages)
GEN: Information required (1 message)
GEN: IPC Chapter In The Boston Area (1 message)
GEN: IPC DC Chesapeake Chapter Meeting May 20, 1996 RSVP (1 message)
GEN: ISO-9000 the next step? (6 messages)
GEN: J-STD-001 SOLDERABILITY (2 messages)
GEN: J-STD-001B ESD (1 message)
GEN: JOB OPP (1 message)
Gen: Job postings (1 message)
GEN: Job Postings on TechNet (12 messages)
Gen: Job postings; my opinion (1 message)
GEN: Looking for PCB/Design shops (2 messages)
GEN: Mail Storm (1 message)
GEN: Masking switches during Cleaning (4 messages)
GEN: MEASLING (2 messages)
Gen: Metallurgist Reqd in UK (1 message)
GEN: MIL-HDBK-217 (3 messages)
Gen: Moisture - outgassing of pcb's (2 messages)
GEN: need part source (1 message)
GEN: Need PCB CAD Recruiter (1 message)
Gen: New TR (1 message)
GEN: Nitrogen quality for storage cabinets... (2 messages)
GEN: PACKAGING (1 message)
Gen: Paper from SMI Conference proceedings (1 message)
GEN: Parts procurement (3 messages)
GEN: PC based Allegro to IPC-D-356 software (1 message)
GEN: PCB copyright issues (1 message)
GEN: PCB sales distribution (2 messages)
GEN: Persulfate / Sulfuric Baths (5 messages)
GEN: Phone Number (2 messages)
GEN: Polar Inst. (1 message)
GEN: printed circuits obsolete (1 message)
GEN: Process Qualification (1 message)
Gen: PVC & Endo-Toxins (1 message)
GEN: PWB SURVEY (1 message)
GEN: Re: Help with MODEM INFO (1 message)
GEN: Rectifiers (7 messages)
GEN: Reflow Oven Trend (2 messages)
GEN: Resist Strip (4 messages)
GEN: Shipping/Transportation for Electronic Components (1 message)
GEN: Simple Question (1 message)
GEN: SOLDER IN LEAD BEND (3 messages)
GEN: Solderability and Accelerated aging (1 message)
Gen: Sourcing for AD676JD (1 message)
GEN: Spec on CD (2 messages)
GEN: specs on CD (2 messages)
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Re : PBGA substrate (1 message)
Re : Solder ( "Magee, Andrew P" ) (2 messages)
Re : TSOP with Alloy 42 lead frame field failures (1 message)
Re ASSEM: Dendritic growth (1 message)
Re Correction: BGA Flux Cleaning and Testin (1 message)
Re exp6:Ass.:silver vs. HASL/OSPs (2 messages)
Re Nepcon Workshops 1997 (2 messages)
RE SOLDER BALLS (1 message)
Re whiskers, tin or whatever (2 messages)
Re [2]: Entec 106 (2 messages)
Re- Electroforming vs laser (1 message)
re-filling vias with RESIN (4 messages)
re-immersion silver (1 message)
re-microblind vias laser v plasma (2 messages)
re-odd number layers (1 message)
RE-[FAB] Fine line Imaging (1 message)
Re. tin whisker growth (1 message)
Re.:Cleaning SMT PCB's with demi-water or IPA (4 messages)
Re2: Dielectric/plated barrel separation in PWB holes (1 message)
Re: Ammoniacal Etching Speed (1 message)
re: ASS: Storeage of PWB (1 message)
Re: assly:baking of hasl pcbs (#994327) (1 message)
Re: ASSY: calculation of accelerated aging factor (1 message)
Re: Assy: No-clean Solder Paste w/o Nitrogen (#830576) (1 message)
Re: ASSY: Packaging Standards (1 message)
Re: ASSY: Teflon Board Repair (1 message)
Re: Assy:Flux residue on SMC (#937710) (1 message)
Re: bonding FR4 to 3003/3010 (2 messages)
Re: Bottom side Adhesives (1 message)
Re: DES/FAB: PEMNUT FASTENERS IN FR4 FIBERGLASS (1 message)
Re: DESIGN: Bypass capacitor under PLCCs? (#138450) (1 message)
Re: Don't want to scrap it. FAB,ASSY,DES (1 message)
Re: Dull solder joint - Gold (1 message)
Re: Electroless Copper (1 message)
Re: FAB: Barrel Cracking due to Air Entrapment (1 message)
Re: FAB: Moisture extraction (1 message)
Re: FAB: Resist Lamination (1 message)
RE: FAB: Silk-screen (give them up) (1 message)
Re: FAB:Questions about pink-ring (1 message)
Re: GEN: AT&S Help wanted (1 message)
Re: GEN: Job Postings on TechNet (1 message)
Re: Glue (#613072) (1 message)
re: Label Printing (2 messages)
Re: Laminate Shrinkage (1 message)
Re: matrix trays - recycle? (#667790) (2 messages)
Re: Open vias problem (1 message)
RE: PC-800 and Scanning Services (2ND) (1 message)
RE: Re: assly:baking of hasl pcbs (#994327) (1 message)
RE: Re: bonding FR4 to 3003/3010 (1 message)
Re: REQ: Info on Entek Plus/NC Flux (1 message)
RE: Spray Fluxer (1 message)
RE:ASSY: (1 message)
re:ASSY: CD ROM Training in SMT (2 messages)
Re:High aspect Ratio Holes (1 message)
Re:Re: silver vs. HASL/OSPs (2 messages)
Re:Re:Re: silver vs. HASL/OSPs (1 message)
RE>DES>Current Carrying Capacity (1 message)
RE>Ground Planes (1 message)
Reading attachments to mails (1 message)
REBLINDO attachment?? (2 messages)
Receipt of 12/12/96 9:31 AM message (2 messages)
Receipt of IPC Member Directory (fwd) (1 message)
Recycled water for rinsing (1 message)
Reducing Rinse Water Flow Rates (5 messages)
Reducing Rinse Water Flowrates (1 message)
Refer to mail : 10th May 1996 (1 message)
Reflow Solder Thermal Profiling IPC Questionaire (1 message)
Reflowing teflon circuit boards (2 messages)
registration equipt (2 messages)
Relative issues concerning the tenting of vias (2 messages)
Relative issues concerning the tenting of vias -Reply (1 message)
reliability concerns? (1 message)
Reliability of PCB Made with Blackhole (2 messages)
Reliability test (2 messages)
RELIABILITY test chips (3 messages)
Reliability test data on SLC type te (1 message)
Reliability test data on SLC type technology (3 messages)
Reliability Testing (1 message)
RELIABILITY: Correlations for Accelerated Test Condition (1 message)
RELIABILITY: Correlations for Accelerated Test Conditions (1 message)
Remote handsets for televsion/hifi etc (1 message)
Removal of Pd by Copper etching (1 message)
Remove address (1 message)
Rep. Alloy 42 (1 message)
Repair of PCB's (2 messages)
Repair of PCBs (5 messages)
Replacement parts search. (2 messages)
Reply to ED Resist question (1 message)
Reply: Mil Polyimide Board Failures (1 message)
Reply: Virus Alert (1 message)
req info adhesive less flex (3 messages)
REQ- Info on Entek Plus/ (1 message)
REQ: Info on Entek Plus/NC Flux (5 messages)
Request (3 messages)
Request comments on choosing CAM for our shop! (2 messages)
Request for Drill information (1 message)
Request for Return E-mail Address (1 message)
Research post available (1 message)
Research Project on Laminates (1 message)
Resend: Copper Thickness Designation (1 message)
Resin Recession (3 messages)
Resist Lamination ( rolls) (1 message)
Resist Lamination Adhesion (2 messages)
Resist Stripper filters (1 message)
RESISTIVE CARBON INK (2 messages)
Resistor Networks (4 messages)
Returned mail: User Unknown (1 message)
REUSABLE SRENCIL FRAMES (3 messages)
REUSABLE STENCIL FRAMES (2 messages)
Reusing trays and tubes (1 message)
Revised Agenda (1 message)
Rework after conformal coating (2 messages)
Re[2]- Electroless Ni/Im (1 message)
Re[2]- FAB-etchback (1 message)
Re[2]- Ni/Au SMP mountin (1 message)
Re[2]: ASSM: 610B (2 messages)
Re[2]: ASSY Moisture Release Rates and Prebake Parameters (1 message)
Re[2]: ASSY: Depanelization of SMT Board Assys (1 message)
Re[2]: ASSY: MELF's (1 message)
Re[2]: ASSY: Menisograph Testers (1 message)
Re[2]: ASSY: Post-wave Warpage (2 messages)
Re[2]: Assy: Solder Paste in Wave Solder Pots... (1 message)
Re[2]: BGA assembly. (1 message)
Re[2]: Copper plating (1 message)
Re[2]: DES- Gerber formats? (1 message)
Re[2]: Design (fwd) (1 message)
Re[2]: Drilling shifted (1 message)
Re[2]: FAB - Durabond as a replacement for Black Oxide... (2 messages)
Re[2]: FAB Delamination (1 message)
Re[2]: FAB gold plating problem (1 message)
Re[2]: FAB-etchback (1 message)
Re[2]: Fab-Re: More nailheading (1 message)
Re[2]: FAB: Soldermask Clearance and Web Width requirements (1 message)
Re[2]: FAB: SPC of printer (1 message)
Re[2]: Hey, where's everybody? (1 message)
Re[2]: INSPECTION Internal Solder Joint (2 messages)
Re[2]: Internal and external ground planes (1 message)
Re[2]: Moisture Sensitivity (1 message)
Re[2]: No clean and RF (1 message)
Re[2]: PCB Cost Reduction Effort Help (1 message)
Re[2]: PerfecTest (1 message)
Re[2]: PVC in equipment construction (1 message)
Re[2]: PWB flexing & Chip Cracking (1 message)
Re[2]: seek for powerful strike on customers who don't reaso (3 messages)
Re[2]: Small Via Formation (1 message)
Re[2]: Solder Paste Plastic or Eutectic (2 messages)
Re[2]: Solder Paste Plastic or Eutectic (#975031) (2 messages)
Re[2]: SOLDERMASK DETERIORATION (long) (1 message)
Re[2]: Soldermask peeling (2 messages)
Re[2]: Soldermask Test Guru (1 message)
Re[2]: TDR Measured Dielectric Constant (1 message)
Re[2]: Tented vias??? (2 messages)
Re[2]: UV-vis Methods for Waste Treatment (1 message)
Re[2]: via holes & surface mount components (1 message)
Re[3]: Assy/Fab: PCB Thickness (1 message)
Re[3]: BGA (1 message)
Re[3]: No clean and RF (3 messages)
Re[3]: Soldermask Tented Vias (1 message)
Re[3]: White residue/lead oxide (1 message)
Re[4]: Soldermask peeling (3 messages)
Re[4]: UV-vis Methods for Waste Treatment (1 message)
Re[5]- Soldermask Tented (3 messages)
Re[6]: UV-vis Methods for Waste Treatment (1 message)
RF substrates - test vehicles (1 message)
RO40003 and RO4350 (2 messages)
Robotic Soldering (1 message)
Rockwell CACD Application Engineering Opening-Cedar Rapids I (1 message)
Rogers Internet Home Page (1 message)
Rolled solder (1 message)
Routing PCBs - tool evaluation (3 messages)
Rule: Long Term Storage of PCB's (1 message)
Rule: Pins popping up (1 message)
Rule: Re[2]: Gold Migration into Tin/Lead (1 message)
Russian PCB Conference, April 1997 Call for Papers, Participants and Exhibitors (1 message)
Safety question - smoldering FR-4 (2 messages)
Sales Engineer Position Open (1 message)
Scanning Electron Microscope Wanted (1 message)
Schematic Drawing needed (1 message)
Scicards (2 messages)
Scoring (1 message)
Screen Saver Problems (1 message)
screenprinting (1 message)
ScreenPrinting Multiple pwb's - single pass (1 message)
SEAL A MEAL !!! (1 message)
search for the Eagle (1 message)
Second pass at the Seminar, Total Electronics Manufacturing Process Seminar (1 message)
Second phone lines (1 message)
Secondary Drilling (3 messages)
securing components (3 messages)
seek for powerful strike on customers who don't reaso (5 messages)
seek for powerful strike on customers who don't reason! (5 messages)
Seeking Informative Presentations (2 messages)
Seeking One Oldtime Designer Drafter (1 message)
Seeking part: ULS2003R parts!!! (1 message)
Seinusisms (1 message)
selective solder fixtures/pallets (2 messages)
Selective Soldering (3 messages)
Selective Wave Soldering (5 messages)
Selective Wave soldering. (1 message)
Seminar, Total Electronics Manufacturing Process Seminar (1 message)
Sensing device for double loading. (2 messages)
SERA solderability analyzer (1 message)
Service for Mach-El wire bonders (1 message)
Shadow Question. (1 message)
Sheet Resistivity of 1 OZ. Copper (2 messages)
Shipley Chemistries (1 message)
shop certification (1 message)
shop floor control (2 messages)
Short cyrcuits in PCB's (1 message)
Short leads in a PWA (1 message)
Short Term Help Wanted (1 message)
Shorts (1 message)
Silver Electromigration (2 messages)
Silver Ink Screen Print. (5 messages)
Silver Plating over (1 message)
Silver Plating over Copper (7 messages)
silver vs. HASL/OSPs (4 messages)
Single Ply (1 message)
Single Ply Mil Specs Requirements (1 message)
SIR and SEC (4 messages)
SIR comb pattern (3 messages)
SIR questions from Japanese colleague (2 messages)
SIR Testing (3 messages)
SIR Workshop (1 message)
Sites (1 message)
Skip plating (1 message)
SL54S273/BRA (2 messages)
sm pad design (1 message)
sm-tc-001 (1 message)
small closed loop aqueous recovery system (4 messages)
Small closed loop cleaning system (2 messages)
Small Via Formation (9 messages)
SMART Cleaning Survey Results 1991-1996 (1 message)
SMC Replacement system (2 messages)
SMD adhesive printing (3 messages)
SMEMA (1 message)
SMEMA and other organizations (silly) (3 messages)
SMEMA standard (3 messages)
SMI '96 Proceedings (2 messages)
SMI 1995 Proceedings (2 messages)
SMT - Screening Adhesive (1 message)
smt / pcb or flex assembly ? (2 messages)
SMT Cleaning (4 messages)
SMT Component Packaging (2 messages)
SMT Consultant-Assembly (1 message)
SMT Design book by Vern Solberg (1 message)
SMT device storage (3 messages)
SMT Equipment (3 messages)
SMT inspection equipment (3 messages)
SMT silkscreen standard for cathode/anode, cap. +/- (2 messages)
SMT Solder Joint Film (4 messages)
SMT Survey-Solderability Testing (1 message)
SMT tape splicing tool (1 message)
SMT Test Points (2 messages)
SMT Test Points (fwd) (1 message)
SMT Training Program (1 message)
SMT--Screening Adhesive (3 messages)
SMTA/IEPS Orange Chapter Joint mtg may 23 (1 message)
Sn-Pb etch (6 messages)
SnPb Oxidation (2 messages)
SO-8 Termal (2 messages)
Solder (2 messages)
Solder @ SOT-23 (2 messages)
Solder analyses and eutectic (1 message)
SOLDER BALLS (7 messages)
Solder Balls - Question for B. Willis (2 messages)
Solder balls on PCB (1 message)
Solder Balls/Air Knife Solution (1 message)
Solder Bath/pot Dipping temperatures (1 message)
Solder blow-out in soldered PTH assemblies (6 messages)
Solder defect rate at 20mil pitch (1 message)
solder impureties (2 messages)
SOLDER IN THE BENDS (3 messages)
Solder Joint & Rework (1 message)
Solder joint reliability with Alloy 42 (1 message)
Solder Joint Stress Generated from Compression Connector (2 messages)
Solder joint temp (1 message)
solder leveling tape residue (3 messages)
Solder Mask Artwork Markoff (2 messages)
Solder paste (1 message)
Solder Paste Deposit Spec. (4 messages)
SOLDER PASTE INSPECTION MACHINE QUALIFICATION (2 messages)
Solder paste kneeding (2 messages)
Solder Paste Plastic or Eutectic (6 messages)
Solder Paste Plastic or Eutectic (#975031) (1 message)
solder pastes with water soluble flux (2 messages)
SOLDER SPLASH ON GOLD FINGER (2 messages)
Solder Sticking to Wave Soldering Pallets (4 messages)
Solder stripper (3 messages)
Solder Symposium (1 message)
Solder Symposium Oct. 21-22, 1996 (1 message)
SOLDER WAVE OPTIMIZER (6 messages)
Solder-cut-solder process (2 messages)
Solderability issue on Ni/Au (2 messages)
Solderability of Au/Ni plate printed cir (1 message)
Solderability of Electoless Ni (3 messages)
solderability test for ENIG pcb finish (5 messages)
Solderability Testing (2 messages)
SolderFill (1 message)
Soldering 50 mil connectors (1 message)
Soldering Alloy 42 lead frames (3 messages)
Soldering CK06 Capacitors (7 messages)
soldering gold pcb's (1 message)
Soldering IEDs at angles (1 message)
Soldering iron tip temperatures (2 messages)
Soldering PCBs to carriers (3 messages)
Soldering SMC (2 messages)
Soldermask (3 messages)
Soldermask Clearance and Web Width requirements (1 message)
Soldermask dams (1 message)
SOLDERMASK DETERIORATION (4 messages)
SOLDERMASK DETERIORATION (long) (3 messages)
soldermask equip. (3 messages)
Soldermask on Teflon (2 messages)
Soldermask over vias (2 messages)
Soldermask peeling (20 messages)
Soldermask Tented Vias (9 messages)
Soldermask Test Guru (4 messages)
Soldermask webs (6 messages)
Sonascan (4 messages)
SOT 23 Markings (2 messages)
SOT 23 soldering challenges (1 message)
SOT23 - Marking (2 messages)
source of infor on environment (1 message)
Space approved solder mask (2 messages)
spacing/design considerations for 1206 packages (2 messages)
spc (2 messages)
SPC Procedures (4 messages)
SPC Software (1 message)
Spec. JIS-C6481 (2 messages)
specs on CD (2 messages)
SPEEDBOARD PLATING (6 messages)
Speeds and Feeds (1 message)
Spray Fluxer (5 messages)
Spray Fluxer (general info) (1 message)
Spray Vs Foam Fluxing (1 message)
Stabilizing Compounds for Components on PWB's (2 messages)
starting Designer Council chapter in Arizona (1 message)
Stencil Application of Adhesives (1 message)
Stencil design or Solder Paste? (6 messages)
Stencil Printing Adhesive (for bottom side SMT) (1 message)
Stencil printing adhesive for chip components (4 messages)
Stencil Printing Adhesive for chips (1 message)
Stencil Survey Up Date (1 message)
Step tablet (4 messages)
Street price PCB (1 message)
Stress Relief (2 messages)
Sub: Solder Paste Plastic or Eutectic (5 messages)
Sub: Solder Paste Plastic or Eutectic (#888717) (1 message)
SUB: Steve A --Solder Paste Plastic or Eutectic #975031 (1 message)
subcontract photoplot (1 message)
Subj: 50 mil pitch thru hole connectors (1 message)
Subj: Flux Compatibility Questions (2 messages)
Subj: Forming PTH DIPs For SMD (3 messages)
Subj: Machine Survey (1 message)
Subj: No-clean Repair (7 messages)
Subj: No-clean Solder Solution and Military Contracts (1 message)
Subj: OSPs (2 messages)
Subj: S.P. Precision Contact (3 messages)
Subj: Solder Contamination Limits (1 message)
Subj: Switching speeds, stray capacitance, & No Clean flux (1 message)
Subject: Assy:Flux residue on SMC (2 messages)
Sulfur contamination (1 message)
Sulphur contamination (4 messages)
sulphuric acid and pumice! (3 messages)
Summary: Pressure Fit Entek (1 message)
Sun Tar Vs HP Tar (1 message)
Sunken Solder (2 messages)
Superb job opportunity (1 message)
Supercritical CO2 Cleaning (2 messages)
Supplier for dummy components (2 messages)
Supplier Identification (1 message)
Surface Areas in Ionic Calculations (1 message)
Surface Finish (3 messages)
Surface Finishes and Solderability (1 message)
Surface Mount Considerations (3 messages)
Surface mount land patterns (8 messages)
Surface Mount Rework Method for A Class 2 Product (3 messages)
surface prepared before outer dry film process (1 message)
Surface Tension (5 messages)
Surface treatment prior to plating (1 message)
SurfWare (1 message)
Survey (2 messages)
SV: The Interconnection Group WWW pages (1 message)
SVP Packages (2 messages)
Symposium (1 message)
Tabletop PWA Cleaner wanted (4 messages)
Tango Pro vs Pads-2000 (1 message)
Tape Residue Removal (2 messages)
TCAD in Printed Circuit Industry (1 message)
TCE (4 messages)
TDR Measured Dielectric Constant (3 messages)
Tech Info (1 message)
Tech Tip (1 message)
Tech Writers Needed (1 message)
TechNet and IllinoisNet Unlinked (1 message)
TechNet Archive (4 messages)
TechNet digest list (3 messages)
TechNet Problem (1 message)
TechNet service (3 messages)
Technical paper (2 messages)
Technical queries previously submitted via internet (2 messages)
Technology Roadmap (1 message)
Teflon (1 message)
Teflon board with a metal substrate (3 messages)
Teflon-like materials (2 messages)
Telecomms Tropicalisation (3 messages)
Tellurium copper (1 message)
Temp. and RH (6 messages)
Temporary Protective Coating (2 messages)
Tented vias??? (11 messages)
Terminal Solderability (3 messages)
test (3 messages)
Test Contact (1 message)
test coupons (2 messages)
Test Data for GETEK (1 message)
Test e-mail (1 message)
Test Fixture Loading (2 messages)
Test for Inspecting Copper Plating Thickness of Hole Wall (1 message)
Test information from PCIF (1 message)
Test Point Coverage (3 messages)
Test Services Recommendations requested (1 message)
test validation (1 message)
test: FLYING PROBE VS. HARD TOOLING (8 messages)
TEST: re cu plating thickness/hole wall (1 message)
Test: RF testing of PTFE based laminates (1 message)
Text books (5 messages)
Thanks for the contact (1 message)
Thanks!-FAB (1 message)
The Interconnection Group WWW pages (1 message)
THE PARADIGM PARADOX & ODD UNITS (2 messages)
The SMART Group Conference 1996 (1 message)
The Ultimate in Flooring (5 messages)
Thermagon.pjk: Etching Very Thick Copper (1 message)
Thermal Conductivity of Soldermask (3 messages)
Thermal Profile for HASL (2 messages)
Thermal shock of blind (1 message)
Thermal shock of blind and buried vias (2 messages)
They Want It Right Now... (1 message)
Thick Electroless (4 messages)
Thick Film Technology discussion (1 message)
Thick FR4 (1 message)
Thickfilm resistor technology (4 messages)
Thickness of copper on PCB (5 messages)
Thieving (1 message)
Thin laminates (fwd) (2 messages)
THIS IS NOT AN Undeliverable Message (1 message)
Three Rivers Designers Council (1 message)
Three! (1 message)
Through hole vs. smt (1 message)
Through Hole wave Vs. rework (4 messages)
tin electroplate (1 message)
Tin electroplate finish for PCBs (3 messages)
Tin electroplate on PCB contact tabs (1 message)
Tin Plating (1 message)
Tin Sulfide (1 message)
Tin-lead plating thickness (5 messages)
Tin/Lead to Straight Tin Plating (2 messages)
TM 2.3.17.2 (1 message)
TN: JOBS: Job Opportunities (1 message)
To Much Mail !! (7 messages)
TO SENT (1 message)
TO220 reflow soldering (4 messages)
tombstoning (9 messages)
Tombstoning - Typing error (1 message)
Tombstoning 0805 Film Caps (4 messages)
Tombstoning 0805 Film Caps -Reply (1 message)
Too Much Mail !! (2 messages)
Touch up Paralyene after rework (1 message)
Trace repair (1 message)
Traces in between SOIC Pads (4 messages)
Track/traces used as a fuse. (1 message)
Trade Show Proceedings (3 messages)
Trade Show Proceedings -Reply (1 message)
Training Video on Moisture Sensitive Device (2 messages)
Training videos (2 messages)
Transmission Line Software (1 message)
TSOP, PBGA Hermeticity Issue?? (3 messages)
Tucson area fabricators (4 messages)
Two Percent Silver Soldering (1 message)
Two sided SMA (3 messages)
UL CONFORMAL COATING (2 messages)
UNDELIVERABLE MAIL (3 messages)
understanding the root cause of PCB assembly defects (1 message)
Unfused Solder and/or Tin (5 messages)
Unfused Tin/Lead plated PCB finish, Thank you all for the enlightenment! (1 message)
Unidentified subject! (57 messages)
Unidentified subject! (SMT Repair) (2 messages)
Unidentified subject! seepage shorts (1 message)
Unidentified subject! warpage (1 message)
Unidentified subject!(Intentional shorts) (2 messages)
Universal DIP Inserter (1 message)
Unsubcribe (3 messages)
unsubscribe (4 messages)
Up punch (1 message)
Upgrade from Cadnetix to ... (1 message)
Uploading of Lavenir FixLT Trace test program to Trace 924. (1 message)
USB Devices (1 message)
Use of a Dynachem 360 DFSM Manual Pre-Laminator (1 message)
Use of a Dynachem 360 DFSM Manual Pre-Laminator. (1 message)
use of electroless nickel as PTH seeder. (2 messages)
Use of Nitrogen for convection oven reflow (1 message)
use of nitrogen for convection reflow (1 message)
USED PCB MACHINES 4 SALE (1 message)
User friendly ionic contamination tester? (1 message)
Users/designer of buried via product (3 messages)
Users/Suppliers Workshop (1 message)
Using ground plane as a heatsink (3 messages)
Using SOlder Paste for Leaded Components (1 message)
UV curable ink? (2 messages)
UV Cure Soldermask (2 messages)
UV Measurements (3 messages)
UV-vis Methods for Waste Treatment (4 messages)
vacancy sr. micropackaging designer (1 message)
Vacuum Desiccating (4 messages)
Validating J-STD-001 (1 message)
Validating J-STD-001B (2 messages)
Vapor Phase Reflow (4 messages)
Various Questions (1 message)
Verification Testing (1 message)
via data (2 messages)
Via Entrapment and LPI (2 messages)
via hole filling with epoxy (ablebond) (2 messages)
Via Hole filling with resin (1 message)
via holes & surface mount components (5 messages)
Via Size (2 messages)
VIAS - Thermal vs. Direct (1 message)
Vias in SMT (1 message)
vias in smt pads (1 message)
Vias under SMT components (1 message)
Vibrators (3 messages)
Virus Alert (10 messages)
Virus Alert - It's a Hoax (1 message)
Virus Alert Hoax (1 message)
virus alerts... real or imagined (4 messages)
Virus hoaxes by CIAC - Please read this (1 message)
Vision System (2 messages)
VME Sizes (1 message)
voiding from Ca? (1 message)
Volts per Mil ??? (part (2 messages)
Volts per Mil ???? (5 messages)
VSO Land Patterns (1 message)
W A N T E D ! (2 messages)
W A N T E D !!! (1 message)
Walmart Supplies- Another Last Item (1 message)
Walmart Supplies-Last Item (1 message)
WANTED ! (2 messages)
Wanted! Information on Industrial Instruments Inc. (1 message)
Wanted: Zero defects to our customer (1 message)
warped completed assemblies (2 messages)
Water Bag in box project (2 messages)
Water Mark (3 messages)
Water wash solder masks (1 message)
Water wash solder masks -Reply (2 messages)
wave solder and reflow fixture technology (2 messages)
Wave Solder and solder bridging (1 message)
Wave Solder Evaluation Test Board (2 messages)
WAVE SOLDER FIXTURES (4 messages)
Wave solder not adhering to electrotin p (1 message)
Wave Solder SPC (6 messages)
Wave Solder Temperature Profiles (1 message)
Wave Soldering !!! update !!! (2 messages)
Wave Soldering Equipment, [log in to unmask] (1 message)
Wave soldering flux problems (3 messages)
wavesoldering mixed tech boards (4 messages)
We've Moved (1 message)
Wedge voiding (1 message)
Wetting Balance Test Services for PWB's (1 message)
What is a rectifier? (2 messages)
What is an NECQ Audit? (2 messages)
What...No mail?? (1 message)
When is Nepcon '97 (1 message)
Where Did You Go? (1 message)
Where is John Lau (3 messages)
Where is R.J.Klein Wassink? ( DES:Solder Lands ) (2 messages)
Which DNC system for a small shop? (2 messages)
White residue between soldered leads (5 messages)
White residue/lead oxide (6 messages)
White solder mask (3 messages)
Who was looking for Joe Mitello? (1 message)
who was that masked man? (1 message)
Why am I recv'ing mesg's twice? (1 message)
Why Polyimide is Not ANSI? (2 messages)
Width Chart (1 message)
Wire Bond Testing (3 messages)
Wire bonders (3 messages)
Wire Bonding (3 messages)
Wire Cutting and Stripping (2 messages)
Wire Wrap Capability (2 messages)
Wire Wrap Vendors (1 message)
WIrebond Gold? (3 messages)
wirewrap (2 messages)
wirewrap subcontractor (2 messages)
Wisker growth on PCBs (4 messages)
Wisker growth, a summary (1 message)
Workmanship Standards (5 messages)
Workshop on Flip Chip Underfill (1 message)
Workshop to Enhance Relations Between Packaging Users and Suppliers (1 message)
World Class Drilling Expert (1 message)
Woven Kevlar (6 messages)
X Ray Inspection Standard (1 message)
X-OUTS (4 messages)
X-outs and Fallout rate (1 message)
X-outs On Multiple Board Arrays (5 messages)
X-outs on panels (5 messages)
x-ray diffraction machine (1 message)
X-Ray Inspection (2 messages)
X-ray inspection and process analysis. (3 messages)
YDES: MIXED DIELECTRIC CONTROLLED IMPEDANCE? (1 message)
[2] Alloy 42 (3 messages)
[DES: Mixed dielectric controlled impedance] (1 message)
[FAB] Fine line Imaging (1 message)
[FAB] Fine line Imaging -Reply (2 messages)
[Fwd: Re: CEM-3 vs. FR-4] (2 messages)
[Fwd: Re: FAB:Wire Bonding] (1 message)
[Fwd: Re: Glue and Fine Pitch Devices] (1 message)
[Fwd: Re: X-outs On Multiple Board Arrays] (1 message)
[Fwd: Silver Plating over Copper] (1 message)
[Fwd: Wire Bonding] (1 message)
[Re]: Off Shore Fab Houses (2 messages)

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Date

Size

RE(11) Copper Plating

<>

Sun, 22 Dec 1996 21:20:29 -0500

44 lines

New Thread

..."Battery Substitution"

..."Battery Substitution"

Doxtator, Gary

Tue, 03 Dec 96 05:55:00 CST

41 lines

New Thread

!st reflow oven

Re: !st reflow oven

<>

Mon, 18 Nov 1996 12:52:29 -0500

47 lines

!st reflow oven

P Roy

14 Nov 96 08:46:36 EST

49 lines

New Thread

"Average" solder defect rate

Re: "Average" solder defect rate

DAVY.J.G-

Thu, 12 Dec 1996 15:20:36 -0500

104 lines

New Thread

"Drape" of Material

Re: "Drape" of Material

<>

Tue, 26 Nov 1996 23:16:18 -0500

40 lines

Re: "Drape" of Material

<>

Tue, 26 Nov 1996 10:56:53 -0500

37 lines

Re: "Drape" of Material

ddhillma

Mon, 25 Nov 96 09:11:37 cst

87 lines

"Drape" of Material

Lynch, Lyn

Mon, 25 Nov 96 06:49:59

59 lines

New Thread

"J" Lead shear strength?

"J" Lead shear strength?

Dill, Norm J

Thu, 21 Mar 96 21:11:00 EST

40 lines

"J" Lead shear strength?

Dill, Norm J

Thu, 21 Mar 96 20:01:00 EST

36 lines

New Thread

"RWE" labelled connector

"RWE" labelled connector

Unai Ugalde

Wed, 04 Dec 1996 10:51:17 +0100

54 lines

New Thread

"SHADOW / EIDSCHUN"DILEMMA

Re: "SHADOW / EIDSCHUN"DILEMMA

<>

Thu, 22 Feb 1996 12:15:28 -0500

32 lines

"SHADOW / EIDSCHUN"DILEMMA

<>

Wed, 21 Feb 1996 14:13:45 -0500

39 lines

New Thread

"washable/removable" soldermask?

Re: "washable/removable" soldermask?

Michael Barmuta

Tue, 20 Aug 1996 12:30:54 -0700

81 lines

"washable/removable" soldermask?

Jim Chen

Fri, 16 Aug 1996 08:01:10 -0700

43 lines

New Thread

# of Layers?

Re: # of Layers?

ddhillma

Wed, 11 Dec 96 17:16:15 cst

88 lines

# of Layers?

Alex Basauri

09 Dec 96 14:47:42 PST

55 lines

New Thread

%P in electroless Ni

%P in electroless Ni

Bab-Hui Lee-CTUA065

Sun, 14 Jul 1996 19:35:04 -0500

58 lines

New Thread

(ASSEM) Wave soldering SOT-23

Re: (ASSEM) Wave soldering SOT-23

<>

Sun, 15 Dec 1996 08:37:20 -0500

60 lines

Re: (ASSEM) Wave soldering SOT-23

Bob Willis

14 Dec 96 08:20:30 EST

173 lines

Re[2]: (ASSEM) Wave soldering SOT-23

Aric Parr

12 Dec 96 16:27:29 -0500

99 lines

Re[2]: (ASSEM) Wave soldering SOT-23

<>

Thu, 12 Dec 96 07:27:48

65 lines

Re[2]: (ASSEM) Wave soldering SOT-23

ddhillma

Thu, 12 Dec 96 07:42:27 cst

101 lines

Re: (ASSEM) Wave soldering SOT-23

<>

Thu, 12 Dec 1996 08:11:42 -0500

34 lines

Re: (ASSEM) Wave soldering SOT-23

<>

Thu, 12 Dec 96 11:20:24 +0100

71 lines

Re: (ASSEM) Wave soldering SOT-23

Aric Parr

11 Dec 96 07:43:12 -0500

99 lines

Re: (ASSEM) Wave soldering SOT-23

<>

Tue, 10 Dec 1996 16:41:59 -0500

46 lines

(ASSEM) Wave soldering SOT-23

Tom Rapp

Tue, 10 Dec 1996 10:03:25 -0600

48 lines

New Thread

(ASSY): Cost estimating

(ASSY): Cost estimating

Mike Matson

Wed, 27 Nov 1996 13:10:00 -0600

48 lines

New Thread

(DES, FAB, ASSEM) Din Rail Mountable PCB's

(DES, FAB, ASSEM) Din Rail Mountable PCB's

Chris Wiwczaroski

Thu, 05 Dec 1996 14:15:11 -0600

50 lines

New Thread

(FAB) Fine Line Imaging

(FAB) Fine Line Imaging

<>

Fri, 1 Nov 1996 17:08:59 -0500

49 lines

New Thread

(Fwd) AMI Multichip Package Engineering Position - NEW -

(Fwd) AMI Multichip Package Engineering Position - NEW -

Marshall Andrews

Fri, 10 May 1996 19:24:13 GMT

90 lines

New Thread

(Fwd) Filleting of via pads

(Fwd) Filleting of via pads

pat tussey

Fri, 15 Mar 1996 13:23:24 -0800

79 lines

New Thread

(Fwd) FW: Buy me!

(Fwd) FW: Buy me!

John Gully

Thu, 25 Jul 1996 10:37:01 +600 CDT

185 lines

New Thread

(Fwd) Mail Delivery Failure.

(Fwd) Mail Delivery Failure.

John Guy

Wed, 17 Apr 1996 09:54:55 +0000

75 lines

New Thread

(Fwd) Re: Military Polyimide Board Failures

(Fwd) Re: Military Polyimide Board Failures

John Gully

Fri, 29 Mar 1996 14:01:13 +600 CDT

94 lines

New Thread

(Fwd) Re: Military Polyimide Board Failures-EDN

Re: (Fwd) Re: Military Polyimide Board Failures-EDN

<>

Mon, 01 Apr 96 10:16:16 PST

108 lines

New Thread

(Fwd) Re: Wave Solder SPC

(Fwd) Re: Wave Solder SPC

<>

Tue, 19 Nov 1996 14:42:05 +0000

51 lines

New Thread

(Fwd) Seinfeldisms

Re[2]: (Fwd) Seinfeldisms

dmitchel

Thu, 25 Jul 96 16:47:26 PST

210 lines

(Fwd) Seinfeldisms

John Gully

Wed, 24 Jul 1996 15:13:26 +600 CDT

158 lines

New Thread

(Fwd) TO220 reflow soldering

(Fwd) TO220 reflow soldering

Alan Hilton

Wed, 26 Jun 1996 22:06:27 PST

76 lines

New Thread

(Fwd) TopFive -- 7/23/96 -- Movie Sequels Nobody Wants to See

(Fwd) TopFive -- 7/23/96 -- Movie Sequels Nobody Wants to See

John Gully

Thu, 25 Jul 1996 10:31:38 +600 CDT

173 lines

New Thread

(gen):cti for getek

(gen):cti for getek

mickey

Wed, 09 Oct 1996 18:25:42 -0700

49 lines

New Thread

(no subject)

(no subject)

hchui000

Sat, 07 Dec 1996 22:52:24 +0800

47 lines

(no subject)

<>

Thu, 12 Sep 1996 22:00:10 -0700

41 lines

Re: (no subject)

Tom Kavendek

Mon, 6 May 1996 19:04:42 -0400

51 lines

Re: (no subject)

<>

Mon, 6 May 1996 06:46:57 -0400

41 lines

(no subject)

Tim Grotheer

Fri, 03 May 96 18:09:22 -0700

37 lines

New Thread

(no subject) (fiducials)

Re: (no subject) (fiducials)

Pat McGuine

Mon, 06 May 1996 08:11:43 -0500

67 lines

New Thread

(U)

(U)

<>

Fri, 19 Apr 96 10:48:19 EDT

29 lines

New Thread

*"Potato Chipping" "ANSI/J-STD-011"

*"Potato Chipping" "ANSI/J-STD-011"

Paul Waldner

31 Mar 96 08:58:09 EST

46 lines

Re: *"Potato Chipping" "ANSI/J-STD-011"

pmcarter

Thu, 28 Mar 96 08:11:54 cst

30 lines

*"Potato Chipping" "ANSI/J-STD-011"

Maurice Dore *

Thu, 28 Mar 96 12:41:00 GMT

43 lines

New Thread

-D Circuit Boards (Vendor wanted)

Re: -D Circuit Boards (Vendor wanted)

<>

Tue, 6 Aug 1996 17:07:51 -0400

63 lines

-D Circuit Boards (Vendor wanted)

Doug Burstedt

Tue, 6 Aug 1996 10:02:57 -0700

44 lines

New Thread

-No Subject-

-No Subject-

Charles Barker/IO-US

16 Jan 96 15:22:44

24 lines

New Thread

...no subject...

Re: ...no subject...

ddhillma

Fri, 24 May 96 04:19:11 cst

57 lines

...no subject...

<>

Thu, 23 May 96 14:35:31 PDT

33 lines

New Thread

10 years of UK MCMs - an IEEE CPMT technical meeting

10 years of UK MCMs - an IEEE CPMT technical meeting

D.C.Whalley

Thu, 24 Oct 1996 17:22:42 -0400

216 lines

New Thread

2 New IPC Documents

2 New IPC Documents

Douglas Sandvick

Fri, 27 Dec 1996 10:54:39 -0600 (CST)

61 lines

New Thread

2 questions

2 questions

John de Gruyter

Tue, 29 Oct 1996 16:47:46 -0800

45 lines

New Thread

2-up panels.

2-up panels.

<>

Tue, 27 Feb 96 13:25:40 -0100

72 lines

New Thread

21st ANNUAL ELECTRONICS MANUFACTURING SEMINAR

Re: 21st ANNUAL ELECTRONICS MANUFACTURING SEMINAR

Aric Parr

27 Nov 96 16:51:27 -0500

107 lines

21st ANNUAL ELECTRONICS MANUFACTURING SEMINAR

MTTC

Wed, 27 Nov 1996 10:09:27 -0800 (PST)

83 lines

New Thread

2nd hand EX200 drill router

2nd hand EX200 drill router

<>

Mon, 21 Oct 1996 07:08:53 EDT

53 lines

New Thread

4 vs 6 layer

RE: 4 vs 6 layer

Davis, Ben L.

Tue, 09 Jul 1996 08:49:00 EDT

59 lines

Re: 4 vs 6 layer

<>

Mon, 8 Jul 1996 14:45:30 -0400

40 lines

New Thread

4-layer vs 6-layer

Re[2]: 4-layer vs 6-layer

<>

Mon, 01 Jul 96 07:28:03 EST

80 lines

Re[2]: 4-layer vs 6-layer

ROGER HELD

Mon, 1 Jul 1996 09:21:52 -0500

89 lines

Re: 4-layer vs 6-layer

George Franck X2648 N408

Mon, 1 Jul 1996 09:32:28 -0500

69 lines

New Thread

500M SMDII

500M SMDII

Robert Welch

Thu, 25 Jul 1996 10:31:48 +0000

49 lines

New Thread

8 inch Floppies

8 inch Floppies

<>

Fri, 23 Feb 96 10:21:04 -0800

77 lines

8 inch Floppies

George Franck X2648 N408

Fri, 23 Feb 1996 10:55:33 -0500

55 lines

Re: 8 inch Floppies

Bill Fabry

22 Feb 1996 18:51:26 -0800

85 lines

Re: 8 inch Floppies

<>

Thu, 22 Feb 1996 11:43:04 -0500

24 lines

Re: 8 inch Floppies

Luke Mendoza

Thu, 22 Feb 1996 22:15:30 +0800

46 lines

8 inch Floppies

George Franck X2648 N408

Wed, 21 Feb 1996 12:19:21 -0500

38 lines

New Thread

8 inch Floppies -Reply

Re: 8 inch Floppies -Reply

BOB HOENE

Fri, 23 Feb 1996 07:18:33 -0600

34 lines

New Thread

;-) Hadco + Zycon

Re: ;-) Hadco + Zycon

<>

Thu, 12 Dec 1996 08:11:44 -0500

33 lines

Re: ;-) Hadco + Zycon

<>

Wed, 11 Dec 96 18:02:14 EST

83 lines

;-) Hadco + Zycon

Jerry Cupples

Tue, 10 Dec 1996 18:21:43 -0600

74 lines

New Thread

<No subject>

<No subject>

Brian Wilkinson

Fri, 01 Nov 1996 21:31:13 -0500

74 lines

<no subject>

<>

Thu, 01 Aug 1996 11:25:45 -0600

46 lines

<No subject>

<>

31 July 96, 07:04:39 EDT

115 lines

New Thread

<none>

Re: <none>

Sherman Banks

12 Nov 96 11:22:36 PST

43 lines

<None>

Alex Basauri

24 Oct 96 08:23:16 PDT

49 lines

Re: <none>

Sherman Banks

11 Oct 96 08:40:14 PDT

47 lines

New Thread

<unidentified subject/ aka / Shadow/Eidschun Dilemma>

<unidentified subject/ aka / Shadow/Eidschun Dilemma>

<>

Mon, 26 Feb 1996 16:24:35 -0500

37 lines

New Thread

?

?

<>

Thu, 09 May 96 13:10:01 EDT

41 lines

New Thread

Abstracts of IEPS OC Emerging Tech 96, Feb 7

Abstracts of IEPS OC Emerging Tech 96, Feb 7

Bill Gaines B160 x2199

Wed, 31 Jan 96 08:53:46 PST

94 lines

New Thread

AC imp. eval sold paste

AC imp. eval sold paste

Frederick B. Koch

Fri, 18 Oct 1996 17:23:01 -0400

106 lines

New Thread

Acronyms

Re: Acronyms

<>

Sat, 6 Apr 1996 14:30:32 -0500

25 lines

Re: Acronyms

<>

Wed, 3 Apr 1996 14:43:50 -0500

23 lines

Re: Acronyms

<>

Tue, 02 Apr 96 10:21:27 PST

88 lines

Acronyms

George Franck X2648 N408

Tue, 2 Apr 1996 08:30:14 -0500

41 lines

New Thread

Acronyms-CAF

Re: Acronyms-CAF

<>

Tue, 02 Apr 96 09:01:42 PST

108 lines

New Thread

Activity

Activity

MR DOUGLAS C JEFFERY

Mon, 26 Aug 1996 05:18:36, -0500

42 lines

New Thread

Additive technology

Re: Additive technology

<>

Sun, 18 Feb 1996 13:19:05 -0500

27 lines

Re: Additive technology

ROGER HELD

Fri, 16 Feb 1996 09:47:12 -0600

81 lines

Additive technology

<>

Thu, 15 Feb 1996 11:08:19 -0500

46 lines

New Thread

address

address

Alex Basauri

11 Oct 96 09:07:30 PDT

56 lines

Address

Alex Basauri

11 Oct 96 09:02:42 PDT

53 lines

New Thread

Adhesive query

Re: Adhesive query

<>

Thu, 18 Apr 96 10:34:39 PST

57 lines

Adhesive query

<>

Thu, 18 Apr 1996 12:03:23 -0400 (EDT)

33 lines

New Thread

adhesives

Re: adhesives

Douglas Sandvick

Wed, 11 Dec 1996 13:03:12 -0600 (CST)

75 lines

Re: adhesives

<>

Wed, 11 Dec 1996 07:33:29 -0500

40 lines

New Thread

Adipic acid

Re: Adipic acid

<>

Wed, 2 Oct 1996 13:31:07 -0400

93 lines

Re: Adipic acid

ddhillma

Wed, 02 Oct 96 05:16:38 cst

87 lines

Re: Adipic acid

Jerry Cupples

Tue, 1 Oct 1996 16:14:34 -0500

70 lines

Re: Adipic acid

<>

Tue, 01 Oct 96 10:21:40 PST

85 lines

Adipic acid

<>

Tue, 1 Oct 96 17:08:53 +0200

53 lines

New Thread

ADM: Job opportunity

ADM: Job opportunity

Eastman, Brian @ GSC

Fri, 25 Oct 96 06:32:00 PDT

103 lines

New Thread

ADM: SWOT Analysis

ADM: SWOT Analysis

<>

Wed, 17 Jul 1996 11:57:54 -0500

43 lines

New Thread

ADMIN- Poll Results on S

Re: ADMIN- Poll Results on S

Ralph Hersey

29 Feb 1996 11:21:51 -0800

73 lines

New Thread

ADMIN: Another Interruption in TechNet

ADMIN: Another Interruption in TechNet

Melinda Robinson

Thu, 25 Jul 1996 12:16:34 -0500 (CDT)

56 lines

New Thread

ADMIN: Enough is enough!

ADMIN: Enough is enough!

Mike Buetow

Wed, 8 May 1996 12:35:59 -0500 (CDT)

54 lines

New Thread

ADMIN: faulty mail delivery

Re: ADMIN: faulty mail delivery

Melinda Robinson

Wed, 10 Apr 1996 11:42:48 -0500 (CDT)

126 lines

New Thread

ADMIN: IPC-CF-148

Re: ADMIN: IPC-CF-148

David Bergman

Tue, 18 Jun 1996 09:59:13 -0500 (CDT)

66 lines

ADMIN: IPC-CF-148

John Gully

Tue, 18 Jun 1996 09:55:57 +600 CDT

41 lines

New Thread

ADMIN: Job required

ADMIN: Job required

Peter Swanson

Tue, 22 Oct 1996 18:32:36 GMT

58 lines

New Thread

ADMIN: Please do not quote the digest.

ADMIN: Please do not quote the digest.

Dmitriy Sklyar

Thu, 31 Oct 1996 10:34:30 -0600 (CST)

54 lines

New Thread

ADMIN: Poll Results on Splitting TechNet

ADMIN: Poll Results on Splitting TechNet

Fred Paul

Thu, 29 Feb 1996 10:17:41 PST

48 lines

Re: ADMIN: Poll Results on Splitting TechNet

<>

Thu, 29 Feb 1996 11:19 -0500 (EST)

216 lines

ADMIN: Poll Results on Splitting TechNet

Melinda Robinson

Thu, 29 Feb 1996 08:29:30 -0600 (CST)

162 lines

New Thread

ADMIN: Re: digest format?

ADMIN: Re: digest format?

Peter Swanson

Tue, 02 Apr 1996 14:11:57 GMT

46 lines

New Thread

ADMIN: Re: job posting

ADMIN: Re: job posting

Dmitriy Sklyar

Thu, 31 Oct 1996 09:56:24 -0600 (CST)

76 lines

New Thread

ADMIN: Reminder to Identify Contents

Re: ADMIN: Reminder to Identify Contents

Melinda Robinson

Mon, 1 Apr 1996 10:25:34 -0600 (CST)

120 lines

ADMIN: Reminder to Identify Contents

Melinda Robinson

Fri, 29 Mar 1996 11:50:16 -0600 (CST)

57 lines

New Thread

ADMIN: Sales postings / A...

Re: ADMIN: Sales postings / A...

<>

Wed, 8 May 1996 13:38:05 -0400

28 lines

New Thread

ADMIN: Sales postings / Advertisements

Re: ADMIN: Sales postings / Advertisements

<>

Wed, 8 May 1996 10:09:48 -0400

32 lines

Re: ADMIN: Sales postings / Advertisements

Evaltine

Wed, 8 May 1996 08:00:54 -0400 (EDT)

102 lines

Re: ADMIN: Sales postings / Advertisements

Manufacturing-BilalK

Tue, 7 May 1996 15:48:07 -0700

28 lines

Re: ADMIN: Sales postings / Advertisements

Karl Sauter

Tue, 7 May 1996 11:56:56 -0700

28 lines

Re: ADMIN: Sales postings / Advertisements

Robert Bormann

Tue, 07 May 96 14:34:43 -0500

146 lines

Re: ADMIN: Sales postings / Advertisements

rhall

Tue, 07 May 96 10:20:21 EDT

103 lines

Re: ADMIN: Sales postings / Advertisements

<>

Tue, 07 May 96 09:56:34 CST

115 lines

Re: ADMIN: Sales postings / Advertisements

<>

Tue, 07 May 96 09:30:31 CST

24 lines

Re: ADMIN: Sales postings / Advertisements

<>

Tue, 7 May 1996 09:46:44 -0400

36 lines

re: ADMIN: Sales postings / Advertisements

Ed Santana

Tue, 7 May 96 9:19:13 EDT

105 lines

ADMIN: Sales postings / Advertisements

George Franck X2648 N408

Tue, 7 May 1996 08:37:51 -0500

90 lines

New Thread

ADMIN: Sales postings / Advertisements -Reply

Re: ADMIN: Sales postings / Advertisements -Reply

John Guy

Tue, 7 May 1996 15:36:13 +0000

67 lines

Re: ADMIN: Sales postings / Advertisements -Reply

<>

Tue, 07 May 1996 10:27:43 -0700

34 lines

New Thread

ADMIN: Sales postings / Advertisements -Reply -Last R

Re[2]: ADMIN: Sales postings / Advertisements -Reply -Last R

<>

Tue, 07 May 96 14:52:16 CST

63 lines

New Thread

ADMIN: Sales postings / Advertisements -Reply -Last Reply

Re: ADMIN: Sales postings / Advertisements -Reply -Last Reply

<>

Tue, 7 May 1996 13:10:58 -0400

35 lines

New Thread

ADMIN: Sales/Ads

Re[2]: ADMIN: Sales/Ads

ALAN COCHRANE

Tue, 07 May 96 15:40:38 PST

71 lines

Re: ADMIN: Sales/Ads

Jack Olson

Tue, 07 May 1996 12:26:32 -0700

45 lines

New Thread

ADMIN: TechNet Digest list: What is that?

ADMIN: TechNet Digest list: What is that?

<>

Mon, 5 Aug 1996 11:31:05 -0500 (CDT)

75 lines

New Thread

ADMIN: Temporary mail problems at IPC

ADMIN: Temporary mail problems at IPC

Melinda Robinson

Fri, 15 Mar 1996 14:46:38 -0600 (CST)

61 lines

New Thread

ADMIN: Use of DesignerCouncil and TechNet Forums

Re: ADMIN: Use of DesignerCouncil and TechNet Forums

Jack Olson

Mon, 30 Sep 1996 12:03:14 -0700

34 lines

ADMIN: Use of DesignerCouncil and TechNet Forums

Melinda Robinson

Mon, 30 Sep 1996 12:01:31 -0500 (CDT)

82 lines

New Thread

ADMIN: Using IPC mail lists:

ADMIN: Using IPC mail lists:

<>

Wed, 31 Jul 1996 11:57:10 -0500 (CDT)

80 lines

ADMIN: Using IPC mail lists:

<>

Wed, 31 Jul 1996 11:57:10 -0500 (CDT)

80 lines

ADMIN: Using IPC mail lists:

<>

Wed, 31 Jul 1996 11:57:10 -0500 (CDT)

80 lines

New Thread

ADMIN: We are back

ADMIN: We are back

<>

Fri, 19 Jul 1996 13:04:10 -0500 (CDT)

52 lines

New Thread

ADMIN:RE:Sales postings / Advertisements

Re: ADMIN:RE:Sales postings / Advertisements

<>

Tue, 7 May 1996 17:15:09 -0400

32 lines

ADMIN:RE:Sales postings / Advertisements

Roland Jaquet

Tue, 7 May 1996 16:29:21 +0200

75 lines

New Thread

Advise CTM

Advise CTM

<>

Mon, 8 Jan 1996 11:57:47 -0500

32 lines

New Thread

Ag or Pd alternative to HASL inquiry

Re: Ag or Pd alternative to HASL inquiry

ddhillma

Mon, 23 Sep 96 07:54:32 cst

75 lines

re: Ag or Pd alternative to HASL inquiry

James Kenny

Sat, 21 Sep 96 1:01:35 EDT

79 lines

RE: Ag or Pd alternative to HASL inquiry

Edwards, Ted A (AZ75)

20 Sep 1996 17:48:32 -0500

97 lines

Ag or Pd alternative to HASL inquiry

David E Kelly

20 Sep 1996 11:59:50 -0700

62 lines

New Thread

AGEING OF ELECTROLESS NI/IMMERSION AU FINISH

Re: AGEING OF ELECTROLESS NI/IMMERSION AU FINISH

<>

Wed, 3 Jan 1996 23:39:36 -0500

27 lines

AGEING OF ELECTROLESS NI/IMMERSION AU FINISH

<>

Tue, 2 Jan 96 16:53:27 PST

30 lines

New Thread

Air Emissions from Printed Circuit Manufacturing

Re: Air Emissions from Printed Circuit Manufacturing

<>

Wed, 10 Apr 1996 21:39:42 -0400

46 lines

Air Emissions from Printed Circuit Manufacturing

Brian Thomas

Wed, 10 Apr 1996 06:44:48 PST

71 lines

New Thread

Air flow across solder joints

Re: Air flow across solder joints

Poh Kong Hui

Sat, 27 Jul 1996 07:55:18 +0800

64 lines

Air flow across solder joints

<>

Fri, 26 Jul 1996 17:16:12 -0400

36 lines

New Thread

Airbourne bovines etc

RE: Airbourne bovines etc

Darrell Bonzo

Sat, 21 Dec 96 7:06

146 lines

Airbourne bovines etc

Michael Fenner

20 Dec 96 14:52:57 EST

93 lines

New Thread

AK-225

AK-225

Howard Feldmesser

Thu, 25 Jul 1996 13:41:18 -0400

47 lines

New Thread

Allegro to IPC-D-356 utility

Allegro to IPC-D-356 utility

Greg Goodenbury

Wed, 17 Apr 1996 09:51:35 -0400

43 lines

New Thread

Alloy 42

Re: Alloy 42

<>

Tue, 23 Apr 96 10:57:01 EST

29 lines

Re: Alloy 42

John Guy

Wed, 17 Apr 1996 08:51:14 +0000

72 lines

Re: Alloy 42

<>

Tue, 16 Apr 96 16:25:28 PST

54 lines

Re: Alloy 42

<>

Tue, 16 Apr 1996 20:38:32 -0400

33 lines

Re: Alloy 42

<>

Tue, 16 Apr 96 17:32:10 PST

88 lines

Re: Alloy 42

ddhillma

Tue, 16 Apr 96 19:25:48 cst

58 lines

Alloy 42

Leo Reynolds

Tue, 16 Apr 1996 17:07:33 -0500

39 lines

New Thread

Alloy 42 TSOP Solder Joint Cracks

Alloy 42 TSOP Solder Joint Cracks

<>

Fri, 11 Oct 96 14:17:35 EDT

44 lines

New Thread

Almit solder

re: Almit solder

Jerry Cupples

Wed, 24 Jan 1996 09:34:15 -0600

37 lines

re: Almit solder

Jerry Cupples

Tue, 23 Jan 1996 21:46:27 -0600

42 lines

New Thread

ALMIT Source

ALMIT Source

Jim Marsico

Wed, 24 Jan 96 11:33:01 -0500

29 lines

Re: ALMIT Source

Jerry Cupples

Tue, 23 Jan 1996 16:56:09 -0600

64 lines

ALMIT Source

Crawford, John A.

Tue, 23 Jan 96 16:07:00 EST

30 lines

New Thread

ALPHA POLYSOLDER LT

ALPHA POLYSOLDER LT

<>

Mon, 11 Nov 96 12:46:35 PST

33 lines

New Thread

Alpha Prep

Re: Alpha Prep

Peter McGrath

Thu, 26 Dec 1996 22:00:56 -0500

40 lines

New Thread

Alpha Preq

Re: Alpha Preq

Terry Zhu

Mon, 23 Dec 1996 20:12:18 -0600 (CST)

75 lines

Alpha Preq

Peter McGrath

Mon, 23 Dec 1996 14:40:20 -0500

36 lines

Alpha Preq

<>

Mon, 23 Dec 1996 11:47:21 -0500

49 lines

New Thread

Alphametals Ionograph 500 M Test

Re: Alphametals Ionograph 500 M Test

Steve Mikell

Thu, 23 May 1996 22:17:02 -0500

43 lines

Re: Alphametals Ionograph 500 M Test

Jack Crawford

Thu, 23 May 1996 14:12:22 -0500

96 lines

New Thread

Alternate Heat Sink Compounds

Alternate Heat Sink Compounds

Ed Gavin

Mon, 09 Dec 1996 16:18:01 -0500

43 lines

New Thread

Alternate Heatsink compound

Alternate Heatsink compound

Ed Gavin

Tue, 10 Dec 1996 13:10:54 -0500

44 lines

New Thread

Alternative Solder Masks

Re: Alternative Solder Masks

<>

Mon, 28 Oct 96 10:15:59 PST

77 lines

Alternative Solder Masks

Hollandsworth, Ron

Fri, 25 Oct 96 09:02:36 EST

44 lines

New Thread

Alternatives to Bromine in Flame Retardants

Re: Alternatives to Bromine in Flame Retardants

Magee, Andrew P

Mon, 22 Jan 1996 16:01:00 -0800

79 lines

Re: Alternatives to Bromine in Flame Retardants

<>

Sat, 20 Jan 1996 11:14:01 -0500

39 lines

Re: Alternatives to Bromine in Flame Retardants

David Bergman

Fri, 19 Jan 1996 17:42:24 -0600 (CST)

95 lines

Alternatives to Bromine in Flame Retardants

Nancy Nelson

Fri, 19 Jan 96 15:51:04 CST

35 lines

New Thread

Aluminum Oxide Scrubbing

Aluminum Oxide Scrubbing

<>

Thu, 08 Feb 96 16:29:42 EST

35 lines

New Thread

Ammoniacal Etching Speed

Re: Ammoniacal Etching Speed

<>

Thu, 11 Jul 1996 09:52:12 -0400

77 lines

Re: Ammoniacal Etching Speed

Hans M. Rohr

10 Jul 96 22:42:08 EDT

37 lines

New Thread

Analog guard rings

Analog guard rings

David M Fulmer

Wed, 21 Aug 1996 14:06:29 PST

40 lines

New Thread

Announcement for your e-mail comm network

Announcement for your e-mail comm network

Ron Gedney

Thu, 11 Apr 1996 10:07:41 -0400 (EDT)

68 lines

New Thread

Annular ring breakout

RE:Annular ring breakout

Paul Waldner

22 Apr 96 03:03:06 EDT

32 lines

Re[2]: Annular ring breakout

<>

Thu, 18 Apr 96 14:41:10 EST

58 lines

RE:Annular ring breakout

<>

Thu, 18 Apr 1996 11:27:42 -0400

44 lines

New Thread

Another passing

Another passing

<>

Wed, 28 Aug 1996 10:27:58 -0400

45 lines

New Thread

ANSI-J

Re: ANSI-J

Leo P. Lambert

Sun, 27 Oct 1996 17:53:41 -0500 (EST)

72 lines

Re: ANSI-J

<>

Thu, 24 Oct 1996 11:28:10 -0400

39 lines

ANSI-J

<>

Tue, 22 Oct 96 09:21:04 PST

48 lines

New Thread

ANSI/IPC-A-6700D

Re: ANSI/IPC-A-6700D

Mike Buetow

Wed, 21 Feb 1996 12:00:41 -0600 (CST)

52 lines

ANSI/IPC-A-6700D

<>

Wed, 21 Feb 96 12:36:13 EST

28 lines

New Thread

Answers to IPC-D-356 Test Formats

Answers to IPC-D-356 Test Formats

Harry Parkinson DTN 264-6760

Wed, 28 Feb 96 11:19:30 EST

91 lines

New Thread

Anyone using AlphaLevel

Re[2]: Anyone using AlphaLevel

ddhillma

Tue, 03 Dec 96 11:41:36 cst

101 lines

Re: Anyone using AlphaLevel

Richard Wood-Roe

Mon, 2 Dec 96 19:11:15 +0000

75 lines

New Thread

Anyone using AlphaLevel?

Re: Anyone using AlphaLevel?

ddhillma

Mon, 02 Dec 96 09:54:44 cst

90 lines

Anyone using AlphaLevel?

David Tandy

Mon, 2 Dec 96 13:58:17 GMT

48 lines

New Thread

AOI/PCMCIA thin core

RE: AOI/PCMCIA thin core

Murray, George @ GSC

Wed, 07 Aug 96 07:00:00 PDT

89 lines

AOI/PCMCIA thin core

Wendy Fung

Wed, 07 Aug 1996 09:44:33 +0900

58 lines

AOI/PCMCIA thin core

Wendy Fung

Mon, 05 Aug 1996 10:26:44 +0900

58 lines

New Thread

application of adhesive dots

Re: application of adhesive dots

<>

Thu, 1 Aug 1996 13:44:20 -0700

64 lines

application of adhesive dots

rob barnes

Thu, 1 Aug 1996 10:02:25 -0600 (MDT)

41 lines

re: APPLICATION OF ADHESIVE DOTS

<>

31 JUL 96 13:07:20 EDT

59 lines

APPLICATION OF ADHESIVE DOTS

rob barnes

Wed, 31 Jul 1996 09:09:22 -0600 (MDT)

39 lines

New Thread

AQP

AQP

<>

Mon, 12 Feb 1996 09:20:48 -0600

27 lines

New Thread

arlon clte

arlon clte

lance riley

Fri, 6 Dec 1996 12:14:39 -0700

43 lines

New Thread

Arrgh Oh No did some one up AOL BTW this is not a specific PCB topic!

Arrgh Oh No did some one up AOL BTW this is not a specific PCB topic!

<>

Tue, 10 Dec 96 19:43 WET

64 lines

New Thread

ARRGHH! Re: Silver Ink Screen Print.

ARRGHH! Re: Silver Ink Screen Print.

Dwight Mattix (Dwight Mattix)

Thu, 14 Nov 1996 16:37:02 -0800 (PST)

104 lines

New Thread

ascii art on the rise

ascii art on the rise

Joseph Fjelstad

Fri, 20 Dec 1996 01:26:18 -0800

269 lines

New Thread

ASEMEP Symposium

ASEMEP Symposium

Luke Mendoza

Thu, 6 Jun 1996 02:21:03 +0800

35 lines

New Thread

ASM Surface mount w/out soldermask

Re: ASM Surface mount w/out soldermask

Spendow, Jim

Fri, 15 Mar 96 07:15:46 EST

58 lines

ASM Surface mount w/out soldermask

George Franck X2648 N408

Wed, 13 Mar 1996 11:14:47 -0500

47 lines

New Thread

ASM: 610B / 2000A Comparison

Re: ASM: 610B / 2000A Comparison

<>

Thu, 11 Jul 96 09:34:45 EDT

144 lines

ASM: 610B / 2000A Comparison

Jack Crawford

Thu, 11 Jul 1996 07:05:37 -0500

69 lines

Re: ASM: 610B / 2000A Comparison

<>

Wed, 10 Jul 1996 10:33:11 +0000

81 lines

ASM: 610B / 2000A Comparison

<>

Tue, 9 Jul 1996 09:04:04 +0000

36 lines

New Thread

ASM: Exposed copper on component leads

ASM: Exposed copper on component leads

<>

Thu, 15 Aug 1996 10:14:46 -0500

51 lines

New Thread

ASM: Flexibility Testing

ASM: Flexibility Testing

<>

Wed, 11 Sep 96 13:29:21 EDT

51 lines

ASM: Flexibility Testing

<>

Wed, 11 Sep 96 10:58:54 EDT

34 lines

New Thread

ASM: Follow-up soldermask dam question

ASM: Follow-up soldermask dam question

George Franck X2648 N408

Tue, 19 Mar 1996 11:18:14 -0500

72 lines

New Thread

ASM: Parylene Conformal Coating

Re: ASM: Parylene Conformal Coating

Jeffery L. Hempton

Tue, 10 Sep 1996 09:59:08 -0500

85 lines

ASM: Parylene Conformal Coating

<>

Mon, 9 Sep 96 08:47:04 EDT

56 lines

New Thread

ASM: RTV

Re: ASM: RTV

Michael Fenner

20 Oct 96 04:16:53 EDT

43 lines

Re: ASM: RTV

Jerry Cupples

Wed, 16 Oct 1996 16:59:49 -0500

63 lines

Re: ASM: RTV

Michael Barmuta

Wed, 16 Oct 1996 09:35:53 -0700

96 lines

Re: ASM: RTV

Aric Parr

16 Oct 96 08:29:36 -0500

75 lines

ASM: RTV

<>

Tue, 15 Oct 96 13:45:17 EDT

41 lines

New Thread

ASM: SMT pads with vias.

RE: ASM: SMT pads with vias.

Edwards, Ted A (AZ75)

10 Jun 1996 15:48:23 -0500

61 lines

ASM: SMT pads with vias.

<>

Fri, 07 Jun 96 16:15:28 PST

37 lines

New Thread

Aspect Ratios

Re: Aspect Ratios

David Bergman

Tue, 31 Dec 1996 16:05:41 -0600 (CST)

85 lines

Aspect Ratios

Isaac Stringer

Tue, 31 Dec 1996 13:18:37 -0800 (PST)

51 lines

New Thread

ASS- X S Solder on SOT-23

Re: ASS- X S Solder on SOT-23

<>

Wed, 01 May 96 17:34:02 PST

148 lines

Re: ASS- X S Solder on SOT-23

Bob Willis

01 May 96 13:09:50 EDT

35 lines

ASS- X S Solder on SOT-23

Ralph Hersey

30 Apr 1996 11:33:43 -0700

109 lines

New Thread

Ass. BGA shape

Re: Ass. BGA shape

Thad McMillan

19 Nov 96 08:45 CST

67 lines

Ass. BGA shape

<>

Tue, 19 Nov 96 15:34: 0 PST

41 lines

New Thread

ass: axial

Re: ass: axial

Jack Crawford

Tue, 21 May 1996 08:58:03 -0500

70 lines

Re: ass: axial

David Bergman

Mon, 20 May 1996 12:47:37 -0500 (CDT)

81 lines

ass: axial

Martin Dooner *

Mon, 20 May 96 15:32:00 GMT

5384 lines

New Thread

Ass: Bob Willis Fan Club

Ass: Bob Willis Fan Club

Bob Willis

16 Dec 96 02:45:44 EST

53 lines

New Thread

Ass: Cable Assembly Destructive Testing

Re: Ass: Cable Assembly Destructive Testing

Bob Willis

05 Sep 96 02:24:07 EDT

45 lines

Ass: Cable Assembly Destructive Testing

Maurice Dore *

Sun, 03 Sep 95 18:14:00 GMT

40 lines

New Thread

ASS: Cracking of Decoupling Caps

Re: ASS: Cracking of Decoupling Caps

Bob Willis

08 Aug 96 03:41:34 EDT

128 lines

RE: ASS: Cracking of Decoupling Caps

Yuen, Mike

Wed, 07 Aug 96 09:02:00 CDT

52 lines

re: ASS: Cracking of Decoupling Caps

Gregg Klawson

Wed, 07 Aug 1996 08:10:44 -0400

53 lines

Re: ASS: Cracking of Decoupling Caps

Doug McKean

Wed, 07 Aug 1996 07:25:08 -0400

56 lines

ASS: Cracking of Decoupling Caps

Maurice Dore *

Mon, 07 Aug 95 09:26:00 GMT

41 lines

New Thread

ASS: Defects on CD ROM ?

ASS: Defects on CD ROM ?

Bob Willis

18 Apr 96 14:53:50 EDT

60 lines

New Thread

ASS: Eyring Model

ASS: Eyring Model

Guenter Grossmann

Fri, 12 Jul 1996 09:03:19 +0200

45 lines

New Thread

ASS: Green Contamination

Re: ASS: Green Contamination

<>

Mon, 11 Nov 1996 09:57:18 -0500

65 lines

ASS: Green Contamination

Michel POULIN

11 Nov 96 08:46 +0500

50 lines

ASS: Green Contamination

Maurice Dore *

Mon, 11 Nov 96 10:06:00 GMT

42 lines

New Thread

ASS: Masking of Switches

ASS: Masking of Switches

Maurice Dore *

Sat, 29 Jul 95 12:34:00 GMT

43 lines

New Thread

ASS: SIR tests

Re: ASS: SIR tests

<>

Wed, 18 Dec 1996 11:32:05 -0500

41 lines

Re: ASS: SIR tests

Karen Tellefsen

Wed, 18 Dec 1996 10:00:25 -0500 (EST)

63 lines

ASS: SIR tests

Maurice Dore *

Wed, 18 Dec 96 12:24:00 GMT

46 lines

New Thread

ASS: Socket temperature performance

Re: ASS: Socket temperature performance

<>

Tue, 14 May 96 09:47:17 EDT

33 lines

Re: ASS: Socket temperature performance

<>

Tue, 14 May 1996 08:57 -0500 (EST)

49 lines

ASS: Socket temperature performance

Maurice Dore *

Tue, 14 May 96 12:48:00 GMT

31 lines

New Thread

Ass: Soldermask problem!

Re: Ass: Soldermask problem!

<>

Wed, 14 Aug 1996 17:43:27 -0400

43 lines

Re: Ass: Soldermask problem!

Leo P. Lambert

Tue, 13 Aug 1996 23:02:11 -0400 (EDT)

95 lines

Re: Ass: Soldermask problem!

sbryan

Tue, 13 Aug 96 07:32:59 PST

75 lines

Ass: Soldermask problem!

Martin Dooner *

Sat, 31 Aug 96 14:02:00 GMT

59 lines

New Thread

ASS: Storeage of HASL PCBs

ASS: Storeage of HASL PCBs

Maurice Dore *

Fri, 25 Oct 96 11:58:00 GMT

45 lines

New Thread

ASS: Storeage of PWB

re: ASS: Storeage of PWB

<>

Tue, 14 May 96 9:10:59 PDT

53 lines

Re: ASS: Storeage of PWB

Jack Crawford

Tue, 14 May 1996 07:34:55 -0500

49 lines

ASS: Storeage of PWB

Maurice Dore *

Tue, 14 May 96 12:23:00 GMT

30 lines

New Thread

ASS: Storeage of PWB -Reply

re: ASS: Storeage of PWB -Reply

David Boggs

Wed, 15 May 96 14:29:49 PDT

105 lines

ASS: Storeage of PWB -Reply

<>

Wed, 15 May 1996 12:03:44 -0400

69 lines

New Thread

Ass: Sunken Solder

Re: Ass: Sunken Solder

Robert Willis

08 Apr 96 10:07:58 EDT

47 lines

New Thread

Ass: Wavesoldering temperature profiles

Ass: Wavesoldering temperature profiles

D.C.Whalley

Tue, 10 Sep 1996 14:32:04 -0400

56 lines

New Thread

ASS: X S Solder on SOT-23

ASS: X S Solder on SOT-23

Kenny Bloomquist

Tue, 30 Apr 1996 06:09:41 -0700

41 lines

ASS: X S Solder on SOT-23

Kenny Bloomquist

Fri, 26 Apr 1996 11:30:27 -0700

36 lines

New Thread

Ass:Des:Free UK Seminars

Ass:Des:Free UK Seminars

Bob Willis

09 Aug 96 13:38:20 EDT

80 lines

New Thread

Ass:Fab:Des:SMART European Workshops

Ass:Fab:Des:SMART European Workshops

Bob Willis

14 Oct 96 04:36:32 EDT

151 lines

New Thread

Ass:Fab:Des:SMART Workshops

Ass:Fab:Des:SMART Workshops

Bob Willis

28 Oct 96 03:36:07 EST

106 lines

New Thread

ASSEM: Block changes

ASSEM: Block changes

Mike Buetow

Wed, 15 May 1996 13:50:57 -0500 (CDT)

44 lines

New Thread

ASSEM: Component attrition during placem

Re[2]: ASSEM: Component attrition during placem

BrianWada

Thu, 26 Dec 96 08:59:46 PST

75 lines

Re[2]: ASSEM: Component attrition during placem

<>

Tue, 24 Dec 96 11:41:57

117 lines

Re: ASSEM: Component attrition during placem

D. Rooke

Mon, 23 Dec 1996 21:46:53 -0500 (EST)

47 lines

ASSEM: Component attrition during placem

Larry Morse

Mon, 23 Dec 1996 18:34:19 -0700

42 lines

New Thread

ASSEM: Dendritic growths

Re:ASSEM: Dendritic growths

Guenter Grossmann

Thu, 18 Jul 1996 10:16:15 +0200

53 lines

ASSEM: Dendritic growths

Peter Swanson

Tue, 16 Jul 1996 14:28:31 GMT

59 lines

New Thread

ASSEM: Pick/Place

ASSEM: Pick/Place

James Edwards

Thu, 12 Dec 1996 17:16:01 -0500

39 lines

New Thread

ASSEM: Re: IPC-A-610

ASSEM: Re: IPC-A-610

Mike Buetow

Wed, 27 Mar 1996 18:27:37 -0600 (CST)

52 lines

New Thread

ASSEM:FW: Component attrition

ASSEM:FW: Component attrition

Larry Morse

Tue, 24 Dec 1996 14:29:34 -0700

51 lines

New Thread

ASSEM:NI/GOLD

Re: ASSEM:NI/GOLD

<>

Wed, 18 Dec 1996 16:13:08 -0500

44 lines

ASSEM:NI/GOLD

<>

Wed, 18 Dec 96 12:54:40 +0100

59 lines

ASSEM:NI/GOLD

<>

Wed, 18 Dec 1996 04:02:01 EST

53 lines

Re: ASSEM:NI/GOLD

<>

Tue, 17 Dec 96 16:32:45

97 lines

re: ASSEM:NI/GOLD

<>

Tue, 17 Dec 96 16:50:48 PST

55 lines

ASSEM:NI/GOLD

James Edwards

Tue, 17 Dec 1996 15:36:24 -0500

40 lines

New Thread

ASSEM:Router

Re: ASSEM:Router

<>

Wed, 18 Dec 96 17:11:49

121 lines

ASSEM:Router

James Edwards

Wed, 18 Dec 1996 08:40:28 -0500

43 lines

New Thread

Assembly

Re: Assembly

Leo P. Lambert

Tue, 15 Oct 1996 20:21:25 -0400 (EDT)

94 lines

Assembly

brianwada

Mon, 14 Oct 96 17:16:44 PST

39 lines

Re: Assembly

Jon Holmen

Tue, 30 Jul 1996 15:36:35 -0500 (CDT)

65 lines

Assembly

<>

Tue, 30 Jul 96 15:47:42 EDT

49 lines

New Thread

Assembly - OSP? Clarification.

Re: Assembly - OSP? Clarification.

Michael Barmuta

Fri, 21 Jun 1996 09:19:44 -0700

67 lines

RE: Assembly - OSP? Clarification.

Thorson, Kevin J @EAG

Fri, 21 Jun 96 08:08:00 CDT

48 lines

Assembly - OSP? Clarification.

<>

Thu, 20 Jun 96 15:07:48 PST

38 lines

New Thread

assembly - pressfit connections

Re: assembly - pressfit connections

<>

Wed, 19 Jun 96 17:38:04 EST

70 lines

Re: assembly - pressfit connections

Pat McGuine

Wed, 19 Jun 1996 06:59:38 -0500

61 lines

assembly - pressfit connections

Bob Mykich

Tue, 18 Jun 96 18:17:00 EDT

43 lines

New Thread

Assembly Benchmarking Survey

Assembly Benchmarking Survey

Kimberly Sterling

Thu, 15 Feb 1996 10:09:52 -0600 (CST)

44 lines

New Thread

Assembly: OSP and Bake.

Re: Assembly: OSP and Bake.

Thorson, Kevin J @EAG

Thu, 20 Jun 96 08:31:00 CDT

71 lines

Re: Assembly: OSP and Bake.

ddhillma

Wed, 19 Jun 96 15:31:25 cst

53 lines

Re: Assembly: OSP and Bake.

<>

Wed, 19 Jun 1996 00:32:55 -0400

31 lines

Assembly: OSP and Bake.

<>

Tue, 18 Jun 96 16:22:28 PST

31 lines

New Thread

Assembly: Silver PWA Finishes

Re[2]: Assembly: Silver PWA Finishes

dmitchel

Thu, 11 Jul 96 15:31:32 PST

77 lines

Re: Assembly: Silver PWA Finishes

<>

Thu, 11 Jul 96 11:41:23 EST

60 lines

Assembly: Silver PWA Finishes

ddhillma

Tue, 09 Jul 96 09:05:16 cst

41 lines

New Thread

Assembly: Solder Paste Life Extension

Re: Assembly: Solder Paste Life Extension

Michael Fenner

22 Apr 96 18:12:55 EDT

70 lines

Re: Assembly: Solder Paste Life Extension

<>

Wed, 17 Apr 1996 11:45 -0500 (EST)

115 lines

Re: Assembly: Solder Paste Life Extension

John Guy

Wed, 17 Apr 1996 09:51:24 +0000

72 lines

Assembly: Solder Paste Life Extension

ddhillma

Tue, 16 Apr 96 11:59:01 cst

43 lines

New Thread

ASSEMBLY:solder paste stencils

ASSEMBLY:solder paste stencils

<>

Thu, 18 Jul 96 15:01:04 PST

42 lines

New Thread

Assisted visual inspection of fine-pitch solder connec

Re: Assisted visual inspection of fine-pitch solder connec

<>

Mon, 9 Dec 96 09:49:50 +0800

177 lines

New Thread

Assisted visual inspection of fine-pitch solder connecti

Re: Assisted visual inspection of fine-pitch solder connecti

<>

Fri, 06 Dec 96 15:47:59 PST

91 lines

New Thread

Assisted visual inspection of fine-pitch solder connections

Re: Assisted visual inspection of fine-pitch solder connections

Vijay Sankaran

Fri, 06 Dec 1996 15:04:47 -0500

76 lines

Assisted visual inspection of fine-pitch solder connections

DAVY.J.G-

Fri, 6 Dec 1996 11:33:07 -0500

70 lines

New Thread

assly-stencil aperture s

Re: assly-stencil aperture s

Bill Fabry

21 Nov 1996 10:53:50 U

71 lines

New Thread

assly:baking of hasl pcbs

Re: assly:baking of hasl pcbs

Aric Parr

23 Oct 96 07:54:18 -0500

83 lines

assly:baking of hasl pcbs

Wolfgang ERAT

23 Oct 96 07:59 +0500

46 lines

assly:baking of hasl pcbs

<>

23 Oct 96 15:33 GMT+0500

54 lines

New Thread

assly:baking of hasl pcbs (#994327)

Re: assly:baking of hasl pcbs (#994327)

<>

Thu, 24 Oct 1996 11:28:15 -0400

59 lines

New Thread

assly:baking of hasl pcbs -Reply

assly:baking of hasl pcbs -Reply

Bob Poirier

Wed, 23 Oct 1996 08:25:17 -0700

55 lines

New Thread

assly:stencil aperture size for 20 mil pitch component

assly:stencil aperture size for 20 mil pitch component

<>

21 Nov 96 17:52 GMT+0500

89 lines

assly:stencil aperture size for 20 mil pitch component

<>

21 Nov 96 17:52 GMT+0500

58 lines

assly:stencil aperture size for 20 mil pitch component

<>

Thu, 21 Nov 96 09:46:18 EST

49 lines

assly:stencil aperture size for 20 mil pitch component

<>

21 Nov 96 17:52 GMT+0500

50 lines

New Thread

ASSLY:X-OUT PROBLEM IN PANELS

Re: ASSLY:X-OUT PROBLEM IN PANELS

MohitGujral

Fri, 15 Nov 96 14:35:23 PST

66 lines

Re: ASSLY:X-OUT PROBLEM IN PANELS

George Franck Jr

Fri, 15 Nov 1996 16:23:18 -0500

90 lines

ASSLY:X-OUT PROBLEM IN PANELS

<>

15 Nov 96 18:52 GMT+0500

55 lines

New Thread

ASSM: 610B

Re: ASSM: 610B

Doug McKean

Wed, 19 Jun 1996 15:14:16 -0400

58 lines

Re: ASSM: 610B

Mike Buetow

Wed, 19 Jun 1996 12:05:42 -0500 (CDT)

61 lines

ASSM: 610B

Peter Swanson

Wed, 19 Jun 1996 17:46:39 GMT

39 lines

New Thread

ASSM: Assembly Bench Mark Study

ASSM: Assembly Bench Mark Study

Kimberly Sterling

Fri, 11 Oct 1996 08:54:48 -0500 (CDT)

77 lines

New Thread

ASSM: Re: JEDEC Testing Specifications

ASSM: Re: JEDEC Testing Specifications

Mike Buetow

Thu, 11 Jul 1996 09:12:26 -0500 (CDT)

63 lines

New Thread

ASSM: Top fillet formation

Re: ASSM: Top fillet formation

Andrew Nicholson

24 Dec 96 04:33:43 EST

43 lines

RE: ASSM: Top fillet formation

DAVY.J.G-

Mon, 23 Dec 1996 10:51:34 -0500

164 lines

RE: ASSM: Top fillet formation

Bruenning, Jason

Fri, 20 Dec 96 14:11:00 CST

108 lines

Re: ASSM: Top fillet formation

<>

Fri, 20 Dec 1996 14:10:27 -0500

42 lines

Re: ASSM: Top fillet formation

<>

Fri, 20 Dec 96 08:46:51

158 lines

Re: ASSM: Top fillet formation

Bilal Khalaf

Fri, 20 Dec 96 08:27:00 PST

89 lines

Re: ASSM: Top fillet formation

<>

Fri, 20 Dec 96 10:33:38 EST

90 lines

Re: ASSM: Top fillet formation

Hollandsworth, Ron

Fri, 20 Dec 96 08:32:27 EST

94 lines

Re: ASSM: Top fillet formation

<>

Fri, 20 Dec 96 08:19:43 PST

97 lines

ASSM: Top fillet formation

Poh Kong Hui

Fri, 20 Dec 1996 18:34:32 +0800 (SST)

71 lines

New Thread

ASSM: Top fillet formation - Thanks

RE: ASSM: Top fillet formation - Thanks

Poh Kong Hui

Tue, 24 Dec 1996 22:06:31 +0800 (SST)

60 lines

New Thread

ASSY

Re[2]: ASSY

<>

Tue, 06 Aug 96 11:45:14 PST

69 lines

RE: ASSY

Jim Moffit

Tue, 06 Aug 1996 11:33:33 -0500

63 lines

RE: ASSY

Jeffery L. Hempton

Tue, 06 Aug 1996 09:42:01 -0500

66 lines

RE: ASSY

MR JIM R ZANOLLI

Tue, 6 Aug 1996 08:00:16, -0500

44 lines

Re: ASSY

Mike Buetow

Wed, 31 Jul 1996 08:23:03 -0500 (CDT)

59 lines

ASSY

Kasprzak, Bill (esd) US

Wed, 31 Jul 96 08:06:00 PDT

49 lines

ASSY

Mike Cussen

Fri, 26 Apr 96 13:02 EDT

55 lines

assy

Gloria Ebert

Wed, 03 Apr 96 10:49:02 CST

32 lines

ASSY

Mike Cussen

Wed, 3 Apr 96 10:59 EST

29 lines

Re: ASSY

DOUG MILLS DIR RESIDENT CME GROUP (714)438-2985

Sat, 23 Mar 1996 14:58:12 -1000

63 lines

Re[2]: ASSY

<>

Thu, 21 Mar 96 12:20:23 EST

71 lines

Re: ASSY

Charles Barker/IO-US

18 Mar 96 8:02:47

56 lines

Re: ASSY

<>

Mon, 18 Mar 1996 09:03:45 -0500

28 lines

Re: ASSY

<>

Fri, 15 Mar 1996 21:39:25 -0500

31 lines

Re: ASSY

<>

Fri, 15 Mar 1996 10:24:20 -0500

32 lines

ASSY

Mike Cussen

Fri, 15 Mar 96 07:30 EST

32 lines

New Thread

ASSY (2); Intrusive Reflow (Through-hole reflow)

ASSY (2); Intrusive Reflow (Through-hole reflow)

Eric Pilon, (514) 685-7230 X: 2586

Tue, 16 Jul 1996 09:47:56 -0400 (EDT)

45 lines

New Thread

ASSY - Padless Plated Thru Holes

Re: ASSY - Padless Plated Thru Holes

<>

Wed, 13 Nov 1996 13:14:38 -0500

58 lines

Re: ASSY - Padless Plated Thru Holes

jseeger

Wed, 13 Nov 1996 12:47:17 -0500

65 lines

Re: ASSY - Padless Plated Thru Holes

<>

Wed, 13 Nov 1996 12:12:17 -0500

45 lines

RE: ASSY - Padless Plated Thru Holes

Dill, Norm J

Wed, 13 Nov 96 10:43:00 EST

80 lines

Re: ASSY - Padless Plated Thru Holes

George Franck Jr

Wed, 13 Nov 1996 10:31:19 -0500

84 lines

ASSY - Padless Plated Thru Holes

<>

Wed, 13 Nov 96 08:04:35 -0500

105 lines

New Thread

ASSY - soldering thru-hole connectors

RE: ASSY - soldering thru-hole connectors

Gary Peterson

Wed, 7 Aug 96 08:20:49 MDT

38 lines

RE: ASSY - soldering thru-hole connectors

Joe Cachina

Tue, 06 Aug 1996 17:27:25 -0700

74 lines

New Thread

ASSY -Reply

RE: ASSY -Reply

ED HARKESS

Tue, 06 Aug 1996 10:41:22 -0600

90 lines

New Thread

Assy : Component Engineer

Assy : Component Engineer

Stephen Cooper

Thu, 4 Jul 1996 08:27:00 +1100

50 lines

New Thread

ASSY : Cracks in TSOP

Re: ASSY : Cracks in TSOP

Guenter Grossmann

Fri, 11 Oct 1996 09:58:33 +0200

72 lines

New Thread

ASSY : Hot Bar Reflow

ASSY : Hot Bar Reflow

<>

Fri, 7 Jun 1996 17:02:00 +0000

44 lines

New Thread

ASSY : LowHighProfile

Re: ASSY : LowHighProfile

<>

Mon, 22 Jul 96 09:04:11 +0800

91 lines

Re: ASSY : LowHighProfile

<>

Fri, 19 Jul 1996 16:25:48 -0400

35 lines

ASSY : LowHighProfile

<>

Fri, 19 Jul 1996 12:41:00 +0000

51 lines

New Thread

ASSY : Marking On Nickel/Gold

Re: ASSY : Marking On Nickel/Gold

<>

Fri, 10 May 96 12:31:36 PST

50 lines

ASSY : Marking On Nickel/Gold

<>

Fri, 10 May 96 19:27:18 +0800

38 lines

New Thread

ASSY : paste printing

Re: ASSY : paste printing

<>

Thu, 17 Oct 1996 10:23:19 -0400

39 lines

RE: ASSY : paste printing

Valladares Hector A

17 Oct 1996 09:16:11 -0400

93 lines

ASSY : paste printing

YAP CHOW LAN

Thu, 17 Oct 1996 18:27:59 +0800

43 lines

New Thread

ASSY : Post Assembly soldering

ASSY : Post Assembly soldering

D. Rooke

Mon, 4 Mar 1996 23:44:29 -0500 (EST)

33 lines

New Thread

Assy : Re : Laser Stencils

Assy : Re : Laser Stencils

Guenter Grossmann

Fri, 25 Oct 1996 12:09:05 +0200

54 lines

New Thread

ASSY Circuits Assembly

Re: ASSY Circuits Assembly

Cooper, Tom

Thu, 06 Jun 96 09:10:53 EST

64 lines

Re: ASSY Circuits Assembly

<>

Thu, 6 Jun 1996 12:05:09 -0400

31 lines

ASSY Circuits Assembly

Fokker ELMO B.V.

Thu, 06 Jun 1996 08:38:36 +0200

56 lines

New Thread

ASSY cleaning.

ASSY cleaning.

<>

Thu, 30 May 96 07:54:36 +0100

53 lines

New Thread

ASSY ink marking

ASSY ink marking

<>

Tue, 21 May 96 10:30:01 +0100

79 lines

New Thread

ASSY light guided assembly.

ASSY light guided assembly.

<>

Tue, 25 Jun 96 14:51:43 +0100

54 lines

New Thread

ASSY Marking of 0603's

Re: ASSY Marking of 0603's

Jerry Cupples

Mon, 10 Jun 1996 16:53:08 -0500

60 lines

New Thread

ASSY minimum fillet height.

ASSY minimum fillet height.

<>

Thu, 21 Mar 96 15:11:41 -0100

60 lines

New Thread

ASSY Moisture Release Rates and Prebake Parameters

Re[2]: ASSY Moisture Release Rates and Prebake Parameters

HOHALLOR

Fri, 27 Sep 1996 09:16:59 -0500

151 lines

Re: ASSY Moisture Release Rates and Prebake Parameters

george

Fri, 27 Sep 1996 10:09:06 +0000

85 lines

ASSY Moisture Release Rates and Prebake Parameters

Magee, Andrew P

Thu, 26 Sep 1996 10:37:00 -0700

82 lines

re: ASSY Moisture Release Rates and Prebake Parameters

<>

26 SEP 96 15:23:18 EDT

64 lines

Re: ASSY Moisture Release Rates and Prebake Parameters

Bob Neves

Thu, 26 Sep 1996 11:46:51 -0700

91 lines

ASSY Moisture Release Rates and Prebake Parameters

Doug Whitnell

Thu, 26 Sep 1996 08:26:39 -0700 (PDT)

46 lines

New Thread

ASSY More info on Omegameter 600SMD problem

Re: ASSY More info on Omegameter 600SMD problem

ddhillma

Fri, 17 May 96 14:51:12 cst

58 lines

ASSY More info on Omegameter 600SMD problem

Rick Vernon (RICK VERNON)

Tue, 14 May 1996 12:14:33 -0500

43 lines

New Thread

ASSY non-rosin flux and MIL

Re: ASSY non-rosin flux and MIL

<>

Wed, 8 May 1996 16:10:25 -0400

32 lines

RE: ASSY non-rosin flux and MIL

Jim Marsico

Wed, 08 May 96 15:19:01 -0400

54 lines

Re: ASSY non-rosin flux and MIL

ddhillma

Wed, 08 May 96 08:32:18 cst

87 lines

ASSY non-rosin flux and MIL

<>

Wed, 08 May 96 10:59:42 +0100

56 lines

New Thread

ASSY Omegameter 600SMD

Re: ASSY Omegameter 600SMD

Phil Cassel

Tue, 14 May 1996 13:16:25 +0400 (EDT)

58 lines

Re: ASSY Omegameter 600SMD

<>

Tue, 14 May 1996 09:33:58 -0400

25 lines

Re: ASSY Omegameter 600SMD

Poh Kong Hui

Tue, 14 May 1996 20:37:09 +0800 (SST)

53 lines

Re: ASSY Omegameter 600SMD

ddhillma

Mon, 13 May 96 22:02:53 cst

51 lines

RE: ASSY Omegameter 600SMD

<>

Mon, 13 May 96 22:32:25 EDT

32 lines

ASSY Omegameter 600SMD

Rick Vernon

Mon, 13 May 1996 15:18:50 -0500

35 lines

New Thread

ASSY post reflow cleaning

ASSY post reflow cleaning

<>

Thu, 18 Apr 96 09:29:58 -0100

83 lines

New Thread

ASSY post-reflow cleaning

Re: ASSY post-reflow cleaning

Bob Willis

15 Apr 96 10:35:57 EDT

34 lines

Re: ASSY post-reflow cleaning

<>

Thu, 11 Apr 1996 17:31:48 -0400

55 lines

ASSY post-reflow cleaning

<>

Thu, 11 Apr 96 13:19:05 -0100

49 lines

New Thread

ASSY Prepping radial leaded components

Re: ASSY Prepping radial leaded components

Juanita Zeinstra

Wed, 31 Jul 96 13:53:26 EST

65 lines

ASSY Prepping radial leaded components

RICK VERNON

Wed, 31 Jul 1996 10:50:23 -0500

46 lines

New Thread

ASSY Qualifying reflow solder process

Re: ASSY Qualifying reflow solder process

Bob Willis

15 Apr 96 10:35:53 EDT

35 lines

Re: ASSY Qualifying reflow solder process

<>

Thu, 11 Apr 1996 17:31:31 -0400

85 lines

ASSY Qualifying reflow solder process

<>

Thu, 11 Apr 96 13:20:23 -0100

47 lines

New Thread

Assy Re: Compatability between saponification and PWB soldermask/marking

Assy Re: Compatability between saponification and PWB soldermask/marking

Steve Mikell

Thu, 21 Mar 1996 17:18:18 -0600

67 lines

New Thread

ASSY RE: light guided assembly

ASSY RE: light guided assembly

Michael J. Chmela

Wed, 26 Jun 1996 17:34:58 -0400 (EDT)

89 lines

New Thread

ASSY re: soldering old boards

ASSY re: soldering old boards

Jerry Cupples

Sat, 16 Mar 1996 16:00:31 -0600

95 lines

New Thread

Assy Re: Tant. Caps

Assy Re: Tant. Caps

Jerry Cupples

Tue, 19 Mar 1996 12:17:16 -0600

94 lines

New Thread

ASSY reflow profile expert software.

Re: ASSY reflow profile expert software.

ddhillma

Tue, 18 Jun 96 10:09:10 cst

79 lines

Re: ASSY reflow profile expert software.

D.C.Whalley

Tue, 18 Jun 1996 15:06:13 -0400

59 lines

ASSY reflow profile expert software.

<>

Tue, 18 Jun 96 13:56:29 +0100

56 lines

New Thread

ASSY revision J-STD-001

Re: ASSY revision J-STD-001

Phil Bavaro (Phil Bavaro)

Wed, 17 Jul 1996 17:40:30 -0800

53 lines

Re: ASSY revision J-STD-001

Mike Buetow

Thu, 6 Jun 1996 10:13:35 -0500 (CDT)

76 lines

ASSY revision J-STD-001

Fokker ELMO B.V.

Thu, 06 Jun 1996 08:38:41 +0200

50 lines

New Thread

ASSY UNactivated R-fluxed solder paste

ASSY UNactivated R-fluxed solder paste

<>

Thu, 21 Mar 96 15:12:42 -0100

50 lines

New Thread

Assy, training

Re[2]: Assy, training

Usergroup

Tue, 28 May 96 14:59:06 PST

83 lines

RE:Assy, training

<>

Fri, 24 May 1996 08:13:52 -0400

68 lines

Re[2]: Assy, training

<>

Thu, 23 May 96 19:23:50 CST

61 lines

RE:Assy, training

Douglas J. Whitnell

Thu, 23 May 1996 13:08:50 -0700

52 lines

RE:Assy, training

Chris Byrne

Thu, 23 May 1996 10:33:47 -0500

34 lines

New Thread

Assy, training provider

RE:Assy, training provider

Bob Willis

28 May 96 13:51:58 EDT

36 lines

New Thread

ASSY,FAB,DES Electronics Manufacturing Seminar

ASSY,FAB,DES Electronics Manufacturing Seminar

MTTC

Wed, 30 Oct 1996 15:39:53 -0800 (PST)

48 lines

ASSY,FAB,DES Electronics Manufacturing Seminar

Doug Whitnell

Tue, 24 Sep 1996 09:58:49 -0700 (PDT)

70 lines

ASSY,FAB,DES Electronics Manufacturing Seminar

Doug Whitnell

Tue, 24 Sep 1996 09:58:49 -0700 (PDT)

70 lines

New Thread

ASSY- (Mac?) Gerber View

Re: ASSY- (Mac?) Gerber View

Bill Fabry

22 May 1996 14:48:50 -0800

93 lines

New Thread

Assy- Ball Grid Array

Re: Assy- Ball Grid Array

Greg Bartlett

27 Sep 1996 09:09:50 -0400

189 lines

New Thread

ASSY- calculation of ac

Re: ASSY- calculation of ac

Greg Bartlett

11 Jul 1996 12:51:15 -0400

149 lines

New Thread

ASSY- Gold-to-Gold Sold

Re: ASSY- Gold-to-Gold Sold

Greg Bartlett

3 Oct 1996 13:15:08 -0400

218 lines

New Thread

ASSY- Laser Ash?

Re[2]: ASSY- Laser Ash?

ddhillma

Fri, 07 Jun 96 08:20:12 cst

95 lines

Re: ASSY- Laser Ash?

<>

Fri, 7 Jun 96 12:00:04 +0800

163 lines

Re: ASSY- Laser Ash?

Marshall Andrews

Thu, 6 Jun 1996 16:29:25 -0400

96 lines

Re: ASSY- Laser Ash?

Greg Bartlett

6 Jun 1996 13:22:40 -0400

70 lines

New Thread

ASSY- OCC and Zn Mounti

Re: ASSY- OCC and Zn Mounti

Greg Bartlett

5 Jun 1996 09:01:13 -0400

116 lines

New Thread

ASSY- PCMCIA Board Depa

Re: ASSY- PCMCIA Board Depa

Bill Fabry

10 Oct 1996 09:10:02 U

182 lines

New Thread

ASSY- PQFP pull test

Re: ASSY- PQFP pull test

Greg Bartlett

13 Dec 1996 09:11:45 -0500

76 lines

New Thread

ASSY- RE>BGA PPM Question

ASSY- RE>BGA PPM Question

Greg Bartlett

19 Apr 1996 15:37:58 -0400

69 lines

New Thread

ASSY- Rework of PBGA pac

Re: ASSY- Rework of PBGA pac

Greg Bartlett

11 Jul 1996 16:28:46 -0400

151 lines

New Thread

ASSY- Solder joint mech

Re: ASSY- Solder joint mech

Bob Willis

01 Aug 96 01:51:35 EDT

42 lines

Re: ASSY- Solder joint mech

Greg Bartlett

31 Jul 1996 17:26:56 -0400

134 lines

New Thread

ASSY- TSOP Underfilling?

ASSY- TSOP Underfilling?

Greg Bartlett

16 Jul 1996 16:28:58 -0400

50 lines

New Thread

Assy-Fiducials

Re: Assy-Fiducials

<>

Fri, 27 Sep 1996 13:37:31 -0400

44 lines

Re: Assy-Fiducials

Pat McGuine

Fri, 27 Sep 1996 11:30:47 -0500

62 lines

Re: Assy-Fiducials

Charles H. Emory

Fri, 27 Sep 1996 11:49:43 -0400

55 lines

Assy-Fiducials

MCCOY K.

27 Sep 1996 08:55:40 -0500

34 lines

New Thread

ASSY-Flagging

Re: ASSY-Flagging

<>

Wed, 15 May 96 17:01:53 PST

76 lines

Re: ASSY-Flagging

<>

Tue, 14 May 1996 17:51:33 -0400

38 lines

ASSY-Flagging

<>

Mon, 13 May 1996 12:53:00 +0000

53 lines

Re: ASSY-Flagging

<>

Fri, 10 May 96 13:19:55 PST

103 lines

Re: ASSY-Flagging

<>

Fri, 10 May 96 13:59:45 EDT

32 lines

ASSY-Flagging

<>

Fri, 10 May 1996 11:29:00 +0000

51 lines

New Thread

assy-Immersion gold fini

Re[2]: assy-Immersion gold fini

Richard Krug

Thu, 22 Aug 96 16:31:26 EST

137 lines

Re: assy-Immersion gold fini

Greg Bartlett

22 Aug 1996 14:31:46 -0400

120 lines

New Thread

ASSY-Metal Stamping

Re: ASSY-Metal Stamping

ddhillma

Thu, 30 May 96 13:29:16 cst

84 lines

Re: ASSY-Metal Stamping

<>

Thu, 30 May 1996 14:25:46 -0400

32 lines

Re: ASSY-Metal Stamping

Bob Lundquist

Thu, 30 May 96 10:09:23 CDT

45 lines

ASSY-Metal Stamping

Jack Crawford

Wed, 29 May 1996 15:42:41 -0500

63 lines

New Thread

ASSY-part search MC78M06CDT

ASSY-part search MC78M06CDT

Jack Crawford

Mon, 5 Aug 1996 13:36:25 -0500

43 lines

New Thread

ASSY.

RE: ASSY.

JIM ENNIS

Tue, 28 May 96 08:18:00 PDT

64 lines

ASSY.

<>

Tue, 28 May 96 08:25:33 +0100

54 lines

ASSY.

<>

Tue, 28 May 96 08:24:28 +0100

54 lines

New Thread

ASSY. Solder joint temp

RE: ASSY. Solder joint temp

Randy Johnson (Loveland)

Wed, 20 Nov 1996 11:02:00 -0600

78 lines

ASSY. Solder joint temp

<>

Wed, 20 Nov 96 16:46:59 PST

42 lines

New Thread

ASSY/DES: RWE connector

Re: ASSY/DES: RWE connector

<>

Tue, 03 Dec 1996 14:07 -0500 (EST)

113 lines

ASSY/DES: RWE connector

Jerry Cupples

Mon, 2 Dec 1996 17:33:09 -0600

51 lines

New Thread

ASSY/FAB - Padless Plated Thru Holes

Re: ASSY/FAB - Padless Plated Thru Holes

joef

Wed, 13 Nov 96 11:29:20 EST

170 lines

New Thread

Assy/Fab Grn Rst-Gold

Assy/Fab Grn Rst-Gold

<>

Thu, 23 May 1996 18:01:31 -0400

29 lines

New Thread

Assy/Fab SIR handbook available for comment.

Assy/Fab SIR handbook available for comment.

David Bergman

Thu, 28 Mar 1996 11:12:49 -0600 (CST)

84 lines

New Thread

Assy/Fab: PCB Thickness

RE: Assy/Fab: PCB Thickness

<>

Mon, 03 Jun 96 23:01:27 EST

44 lines

Re: Assy/Fab: PCB Thickness

<>

Mon, 3 Jun 1996 16:37:23 -0400

28 lines

Re[3]: Assy/Fab: PCB Thickness

<>

Mon, 3 Jun 1996 14:16:39 -0400

81 lines

RE: Assy/Fab: PCB Thickness

R_R_HOLMES

3 Jun 96 14:15:25 -0400

82 lines

Re[2]: Assy/Fab: PCB Thickness

Jim Spendow

Mon, 03 Jun 96 12:38:45 EST

61 lines

RE: Assy/Fab: PCB Thickness

Poh Kong Hui

Mon, 3 Jun 1996 22:11:36 +0800

49 lines

New Thread

ASSY/FAB: SnPb Oxidation

Re[2]: ASSY/FAB: SnPb Oxidation

ddhillma

Mon, 18 Nov 96 15:40:12 cst

156 lines

Re: ASSY/FAB: SnPb Oxidation

Yuen, Mike

Mon, 18 Nov 96 14:44:00 CST

115 lines

Re: ASSY/FAB: SnPb Oxidation

George Franck Jr

Sun, 17 Nov 1996 14:12:30 -0500

142 lines

ASSY/FAB: SnPb Oxidation

<>

Mon, 18 Nov 1996 09:23:37 -0600

49 lines

New Thread

ASSY/FAB: SnPb Oxidation, Removal

Re: ASSY/FAB: SnPb Oxidation, Removal

<>

Tue, 19 Nov 1996 10:17:37 -0500

50 lines

Re: ASSY/FAB: SnPb Oxidation, Removal

<>

19 Nov 1996 08:29:17 CST

38 lines

Re: ASSY/FAB: SnPb Oxidation, Removal

<>

Tue, 19 Nov 1996 00:07:51 -0500

39 lines

New Thread

Assy/Fab: Solder in via-hole

Re[2]: Assy/Fab: Solder in via-hole

sbryan

Fri, 14 Jun 96 11:07:41 PST

66 lines

Re: Assy/Fab: Solder in via-hole

Poh Kong Hui

Fri, 14 Jun 1996 00:24:33 +0800 (SST)

60 lines

New Thread

ASSY:

Re: ASSY:

<>

Thu, 16 May 1996 11:11:30 -0400

29 lines

RE:ASSY:

Jack Crawford

Tue, 14 May 1996 13:42:33 -0500

116 lines

Re[2]: ASSY:

<>

Tue, 14 May 96 11:09:03 CST

61 lines

RE:ASSY:

Gary Ferrari

Tue, 14 May 1996 09:48:39 -0400

67 lines

RE:ASSY:

Poh Kong Hui

Tue, 14 May 1996 21:10:59 +0800 (SST)

53 lines

New Thread

ASSY: "Off-the-Shelf" Enclosures

Re[2]: ASSY: "Off-the-Shelf" Enclosures

<>

Mon, 03 Jun 1996 08:00 -0500 (EST)

50 lines

Re: ASSY: "Off-the-Shelf" Enclosures

Ellsworth D. Berkowitz

Fri, 31 May 1996 16:54:27 -0400 (EDT)

39 lines

ASSY: "Off-the-Shelf" Enclosures

Ellsworth D. Berkowitz

Fri, 31 May 1996 16:01:06 -0400 (EDT)

38 lines

New Thread

ASSY: (Mac?) Gerber Viewing Software

ASSY: (Mac?) Gerber Viewing Software

Dwight Mattix (Dwight Mattix)

Wed, 22 May 1996 13:07:53 -0700 (PDT)

41 lines

New Thread

ASSY: 0402 chip placement

ASSY: 0402 chip placement

Louis Dallara

Wed, 9 Oct 1996 11:40:20 -0400

58 lines

ASSY: 0402 chip placement

Steve Quinn

Wed, 9 Oct 1996 08:59:03 -0500 (CDT)

46 lines

New Thread

ASSY: 0402 chip placement (#570929)

Re[2]: ASSY: 0402 chip placement (#570929)

Juanita Zeinstra

Thu, 10 Oct 96 13:26:49 EST

58 lines

RE: ASSY: 0402 chip placement (#570929)

<>

Wed, 9 OCT 96 11:09:54 MDT

43 lines

New Thread

ASSY: 3D Visual Inspection Request

ASSY: 3D Visual Inspection Request

<>

Mon, 9 Dec 1996 10:21:31 -0600

132 lines

New Thread

ASSY: Accelerated Aging Equations

ASSY: Accelerated Aging Equations

<>

Thu, 25 Jul 1996 10:08:47 -0400

82 lines

New Thread

ASSY: adhesive

Re: ASSY: adhesive

<>

Thu, 11 Apr 1996 11:00:25 -0400

25 lines

Re: ASSY: adhesive

<>

Thu, 11 Apr 1996 07:20 -0500 (EST)

102 lines

Re: ASSY: adhesive

Mike Buetow

Wed, 10 Apr 1996 16:32:38 -0500 (CDT)

57 lines

ASSY: adhesive

<>

Wed, 10 Apr 96 10:42:52 PDT

38 lines

New Thread

ASSY: Adhesive Dots for 0805s

Re: ASSY: Adhesive Dots for 0805s

Nathan Barnes

Sat, 21 Sep 96 07:18:43 GMT

78 lines

Re: ASSY: Adhesive Dots for 0805s

Nathan Barnes

Sat, 21 Sep 96 07:18:43 GMT

78 lines

Re: ASSY: Adhesive Dots for 0805s

Michael Fenner

21 Sep 96 03:18:43 EDT

54 lines

Re: ASSY: Adhesive Dots for 0805s

Larry Waksman

Mon, 16 Sep 1996 09:40:12 -0700

128 lines

Re: ASSY: Adhesive Dots for 0805s

Jerry Cupples

Sat, 14 Sep 1996 22:27:40 -0500

82 lines

Re: ASSY: Adhesive Dots for 0805s

Poh Kong Hui

Sat, 14 Sep 1996 23:28:43 +0800

95 lines

ASSY: Adhesive Dots for 0805s

Pat McGuine

Wed, 11 Sep 1996 13:56:18 -0500

67 lines

ASSY: Adhesive Dots for 0805s

Pat McGuine

Fri, 13 Sep 1996 07:28:11 -0500

67 lines

New Thread

ASSY: ADHESIVE SCREEN CLEANING

Re: ASSY: ADHESIVE SCREEN CLEANING

<>

Wed, 16 Oct 1996 19:56:27 -0400

78 lines

Re: ASSY: ADHESIVE SCREEN CLEANING

Aric Parr

16 Oct 96 10:35:59 -0500

82 lines

ASSY: ADHESIVE SCREEN CLEANING

Jim Marsico 516-595-5879

Wed, 16 Oct 1996 06:27:00 -0500 (EST)

63 lines

New Thread

ASSY: Adipic acid

ASSY: Adipic acid

Karen Tellefsen

Tue, 01 Oct 1996 22:53:33 -0700

96 lines

New Thread

ASSY: Affect of Sulfur on Gold or Silver Platings

Re: ASSY: Affect of Sulfur on Gold or Silver Platings

<>

Thu, 21 Mar 1996 09:51:58 -0500

34 lines

Re: ASSY: Affect of Sulfur on Gold or Silver Platings

Rory Doyle

Thu, 21 Mar 1996 09:37:09 +0000

68 lines

ASSY: Affect of Sulfur on Gold or Silver Platings

<>

Wed, 20 Mar 1996 14:42 -0500 (EST)

44 lines

New Thread

ASSY: Affects on solder mask after wave solder

Re: ASSY: Affects on solder mask after wave solder

BrianWada

Wed, 27 Nov 96 15:19:11 PST

57 lines

ASSY: Affects on solder mask after wave solder

Charlie Crep

Wed, 27 Nov 96 08:46:27 CST

38 lines

New Thread

ASSY: Alloy 42 Plating Questions

Re: ASSY: Alloy 42 Plating Questions

ddhillma

Wed, 16 Oct 96 13:08:26 cst

145 lines

ASSY: Alloy 42 Plating Questions

Richard Huziak

Fri, 11 Oct 1996 10:50:33 -0400 (EDT)

74 lines

New Thread

ASSY: Aluminum to Tin/Lead

Re: ASSY: Aluminum to Tin/Lead

Michael Fenner

09 Nov 96 05:01:30 EST

53 lines

Re: ASSY: Aluminum to Tin/Lead

Michael Barmuta

Fri, 8 Nov 1996 09:05:09 -0800

88 lines

Re: ASSY: Aluminum to Tin/Lead

Jerry Cupples

Thu, 7 Nov 1996 17:46:07 -0600

75 lines

ASSY: Aluminum to Tin/Lead

John Parsons

Thu, 7 Nov 1996 14:43:33 -0800

46 lines

New Thread

ASSY: Aramid material and baking

RE: ASSY: Aramid material and baking

Edwards, Ted A (AZ75)

20 Jun 1996 17:36:37 -0500

54 lines

ASSY: Aramid material and baking

dmitchel

Thu, 20 Jun 96 11:45:07 PST

26 lines

New Thread

ASSY: Area Calc. for Ionic Contamination

RE: ASSY: Area Calc. for Ionic Contamination

Steve Mikell

Mon, 25 Mar 1996 23:05:35 -0600

86 lines

RE: ASSY: Area Calc. for Ionic Contamination

<>

Mon, 25 Mar 96 20:49:23 EST

65 lines

Re: ASSY: Area Calc. for Ionic Contamination

<>

Mon, 25 Mar 1996 14:36:16 -0500

31 lines

ASSY: Area Calc. for Ionic Contamination

Barthel, Bill

Mon, 25 Mar 96 07:23:00 CST

33 lines

New Thread

ASSY: Automated Defect Scatter Diagrams ?

RE: ASSY: Automated Defect Scatter Diagrams ?

Chilcote, Jim (AZ75)

30 Dec 1996 17:28:43 -0600

83 lines

New Thread

ASSY: Baking before wave soldering

Re[2]: ASSY: Baking before wave soldering

<>

Mon, 24 Jun 96 20:40:06 PST

91 lines

Re: ASSY: Baking before wave soldering

Mike Buetow

Wed, 19 Jun 1996 09:38:03 -0500 (CDT)

59 lines

Re: ASSY: Baking before wave soldering

guyj

Wed, 19 Jun 1996 07:53:01 +0000

80 lines

ASSY: Baking before wave soldering

teik

Tue, 18 Jun 96 15:08:02 EST

36 lines

New Thread

Assy: Ball Grid Array

Re: Assy: Ball Grid Array

Tony Sturgeon

Thu, 26 Sep 1996 11:55:36 +0000

116 lines

Re: Assy: Ball Grid Array

Lisa Williams

Wed, 25 Sep 1996 10:54:20 -0500 (CDT)

60 lines

Re: Assy: Ball Grid Array

Jerry Cupples

Tue, 24 Sep 1996 18:21:17 -0500

84 lines

Assy: Ball Grid Array

TIM MENDENHALL

Tue, 24 Sep 1996 16:26:58 -0500

53 lines

New Thread

ASSY: BGA SOCKETS

Re: ASSY: BGA SOCKETS

Martin N Mason

Tue, 8 Oct 1996 08:31:37 +0100

61 lines

Re: ASSY: BGA SOCKETS

Pratap Singh

Mon, 07 Oct 1996 15:54:55 -0700

82 lines

Re: ASSY: BGA SOCKETS

Gary Peterson

Mon, 7 Oct 96 10:58:10 MDT

65 lines

ASSY: BGA SOCKETS

Jim Marsico 516-595-5879

Mon, 07 Oct 1996 09:35:00 -0500 (EST)

62 lines

New Thread

ASSY: BGA SOLDERABILITY

RE: ASSY: BGA SOLDERABILITY

Foster, Donald C.

Mon, 18 Nov 96 08:46:00 MST

85 lines

Re: ASSY: BGA SOLDERABILITY

ddhillma

Fri, 15 Nov 96 15:12:31 cst

117 lines

RE: ASSY: BGA SOLDERABILITY

Foster, Donald C.

Fri, 15 Nov 96 13:15:00 MST

86 lines

RE: ASSY: BGA SOLDERABILITY

Foster, Donald C.

Fri, 15 Nov 96 10:32:00 MST

79 lines

ASSY: BGA SOLDERABILITY

Jim Marsico 516-595-5879

Thu, 14 Nov 1996 07:08:00 -0500 (EST)

68 lines

ASSY: BGA SOLDERABILITY

Jim Marsico 516-595-5879

Thu, 14 Nov 1996 11:44:00 -0500 (EST)

85 lines

New Thread

Assy: BGA vs QFP

RE: Assy: BGA vs QFP

Jim Marsico 516-595-5879

Tue, 22 Oct 1996 15:31:00 -0500 (EST)

72 lines

Assy: BGA vs QFP

Yuen, Mike

Tue, 22 Oct 96 11:29:00 CDT

40 lines

New Thread

Assy: BGA vs QFP [Round 2]

Assy: BGA vs QFP [Round 2]

Yuen, Mike

Wed, 23 Oct 96 10:29:00 CDT

42 lines

New Thread

ASSY: BGAs

ASSY: BGAs

Sherman Banks

Fri, 31 May 1996 07:18 PST

36 lines

New Thread

ASSY: Bismuth Solder

Re: ASSY: Bismuth Solder

ddhillma

Wed, 31 Jul 96 09:04:36 cst

89 lines

New Thread

Assy: Board Bake

Re: Assy: Board Bake

Steve Mikell

Tue, 14 May 1996 20:01:49 -0500

101 lines

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ASSY: Board Flatness Spec

Re: ASSY: Board Flatness Spec

D. Rooke

Tue, 27 Aug 1996 07:15:12 -0400 (EDT)

62 lines

ASSY: Board Flatness Spec

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Mon, 26 Aug 96 22:25:24 EDT

43 lines

New Thread

ASSY: Bottom side Adhesives

Re: ASSY: Bottom side Adhesives

<>

Tue, 10 Dec 96 13:09:20

141 lines

New Thread

ASSY: BOUNDARY VS. FULL TUNNEL WAVE SOLDER NITROGEN INER

Re: ASSY: BOUNDARY VS. FULL TUNNEL WAVE SOLDER NITROGEN INER

Aric Parr

16 Aug 96 13:15:19 -0500

94 lines

New Thread

ASSY: BOUNDARY VS. FULL TUNNEL WAVE SOLDER NITROGEN INERTING

RE: ASSY: BOUNDARY VS. FULL TUNNEL WAVE SOLDER NITROGEN INERTING

Bruenning, Jason

Fri, 16 Aug 96 12:39:00 CDT

69 lines

ASSY: BOUNDARY VS. FULL TUNNEL WAVE SOLDER NITROGEN INERTING

VIC BELDAVS

Fri, 16 Aug 1996 11:19:57 -0600

52 lines

New Thread

ASSY: calculation of accelerated aging factor

Re: ASSY: calculation of accelerated aging factor

<>

Thu, 11 Jul 96 14:28:15 PDT

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Re: ASSY: calculation of accelerated aging factor

<>

Thu, 11 Jul 96 15:07:57 EDT

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Re: ASSY: calculation of accelerated aging factor

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Thu, 11 Jul 1996 10:24:36 -0400

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Re: ASSY: calculation of accelerated aging factor

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Wed, 10 Jul 1996 10:03:44 -0400

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