Technetters 

In the mid 1970's Paul Davis of Tin Research wrote an article on dewetting as
result of pumice scrub.  Does anyone have a reference to where this was
published.  Also does anyone have any input as to dewetting as result of
pumice scrub in relation to a sequence of: (1) pumice scrub, (2)apply solder
mask, (3) hot air level, (4)solderability test and dewet..

Another question on dewetting.  Has anybody seen dewetting as a result of a
white residue on the lands and board which was analyzed as lead carbonate?
 And another:where does the lead carbonate come ?

Phil Hinton 
Hinton PWB Engineering 
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