Sounds like you're talking about the new memory devices. Japanese 
          packages are lead stand (VSMP - Vertical Surface Mount Package), while 
          TI developed the post stand type (VPAK). Anyhow, the only equipment I 
          know of that will place these is the KME CM92. They have a special 
          Vertical Package Feeder and nozzle. Fujitsu worked with KME to develop 
          the JEDEC specs. and placement method. I've never had the opportunity 
          to work with them, but I was in your shoes 2 years ago. The product 
          that was to use these packages never made it off the drawing board.
          
          Greg Kilinski
          PCA Manufacturing Engineer
          Acuson Corp.
          [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: SVP Packages
Author:  [log in to unmask] at ccUnix
Date:    11/5/96 10:44 AM


I am looking for equipment to place SVP packages, specifically PSSVP (Post Stand
Surface Vertical Packages) and LSSVP (Lead Stand Surface Vertical Packages).  
Has anyone out there had any experience with these?
          
Thanks in advance.
          
Richard Regner
Process Engineer
Micron Technology, Inc.
[log in to unmask]
          
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