Sounds like you're talking about the new memory devices. Japanese packages are lead stand (VSMP - Vertical Surface Mount Package), while TI developed the post stand type (VPAK). Anyhow, the only equipment I know of that will place these is the KME CM92. They have a special Vertical Package Feeder and nozzle. Fujitsu worked with KME to develop the JEDEC specs. and placement method. I've never had the opportunity to work with them, but I was in your shoes 2 years ago. The product that was to use these packages never made it off the drawing board. Greg Kilinski PCA Manufacturing Engineer Acuson Corp. [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: SVP Packages Author: [log in to unmask] at ccUnix Date: 11/5/96 10:44 AM I am looking for equipment to place SVP packages, specifically PSSVP (Post Stand Surface Vertical Packages) and LSSVP (Lead Stand Surface Vertical Packages). Has anyone out there had any experience with these? Thanks in advance. Richard Regner Process Engineer Micron Technology, Inc. [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************