I can only concur with Jeff Seeger's response. 
I can add that for reflow soldering the 50-mil pitch creates a high thermal
mass because of the many densely packed PTVs and pins (many of these
connectors have high thermal masses themselves and act as heat sinks). You
may try some aggressive preheating and soaks in the ramp-soak-spike profile
that are as long and as high as the flux in the paste will permit.
For wave soldering some aggressive air knives after the wave as well as
non-protruding shorter pins may help. 

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]


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