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   TO:         I4235700 IBMMAIL   new address for ipc technet 25.6.96

   FROM:       DSTEWART EX2       D.Stewart        - Product Development Manager.

   DATE:       23 August 1996
   SUBJECT:    re-filling vias with RESIN
   REFERENCE:  question previously

    I believe someone was looking for a way to completely fill vias
    with RESIN (not the sequential blind via type).

    For whoever was interested, there is a company in France called
    LAPE who are subcontractors for pcb fabrication processes including
    soldermask, HASL etc processes. One of the processes that they
    offer is via hole injection filling, where they use a CNC
    controlled, syringe injection system for filling holes with resin.

    More details from LAPE on +33 (1) 60 86 51 83 or
                          fax +33 (1) 60 86 51 80


    Dougal Stewart
    Product development manager
    Exacta Circuits
    Scotland

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