Wedemeyer, Ron wrote:
> 
> We have an application were we need to bond a small heatsink to the top
> of a plastic packaged device (bonding area is approx 1.0" x 0.5").
> We are undecided whether we should use a self adhesive  thermally
> conductive sheet material to bond the two together, or use a thermal
> bonding compound (liquid adhesive). Due to the size and implementation,
> mechanical methods of securing the heatsink are not suitable.
> 
> Any advice or experiences people have had with either or both of the two
> methods would be appreciated
> 
> Ron Wedemeyer
> Senior Engineer - Product Engineering
> QPSX Communications Pty Ltd
> [log in to unmask]
> 
> ***************************************************************************
Loctite has a full line of thermally conductive adhesives which could
meet your application needs.  Call 1-800-LOCTITE.  There are activator
cured and heat cured products available.

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