 
| Subject: | |
| From: | |
| Date: | Fri, 9 Feb 96 9:27:22 PST |
| Content-Type: | text/plain |
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[log in to unmask] (MR DOUGLAS C JEFFERY) Wrote:
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| -- [ From: Doug Jeffery * EMC.Ver #2.10P ] --
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| Dear friends
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| Can someone define what is meant when Wirebondable gold
| plating is
| required?..Does this define a specific type of deposit
| chemsitry?
| Is this refering to a thickness issue?
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| Thanks
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| Doug Jeffery
| Electrotek
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Doug -
I have some information regarding your question. My phone number is
(503)627-3160.
Best Regards
Nora Xiao
Tektronix, Inc.
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