TECHNET Archives

1996

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Copper peel strength
From:
Ranjith V Menon <[log in to unmask]>
Date:
Thu, 03 Oct 1996 09:44:47 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (15 lines) 
What could be the cause for low copper peel strength. A strong transfer 
is observed. (i.e deposits of copper on the substrate is observed). But 
even then the peel strength is low.

Any information on this will be appreciated.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************

ATOM RSS1 RSS2