Being an Application Engineer supporting Flex and
Rigid-flex product for Merix Corporation, I always
get nervous when comments are made regarding things
that "cannot be done" on flex circuitry. 

At Merix, one of our largest flex circuit programs
uses the Entek 106A process. This flex application,
as well as others that have used the Entek OSP surface 
finish, have proven to be very compatible with our customers
assembly processes and flex assembly processes at Merix. 

Furthermore, the process for applying the Entek
OSP surface finish is extremely compatible with 
flex circuit processing. Especially if you are comparing
it to the mechanical and thermal stresses inherent to other 
surface finish application processes (ie: HASL).


I do not want to suggest that the Entek system will work in 
every application. If I knew of such a system, Merix wouldn't
need Applications Engineers like me.

If you have specific questions about using Entek
surface finishes on flex circuits, feel free
to contact me at Merix Corp:

      [log in to unmask]

I would be happy to discuss the compatibility of our 
Entek 106A with your assembly processes.

If you have generic questions around Entek, 
N/C process compatibility, etc. I would suggest 
that you contact Enthone directly. A name you can 
start with is:

      Bret Taucher
      Enthone
      206/222-6629


Thank for you time,
  Jon Woodyard,  Applications Engineer
  Merix Corporation
  503/359-2623
  [log in to unmask]


---------Original Message---------------------------------------
| _________________________________
| Subject: Re: REQ: Info on Entek Plus/NC Flux
| Author:  [log in to unmask] at corp
| Date:    1/31/96 7:58 PM
| 
| 
| I worked for a flex manufacture that was trying to get Entek 
| approved.  It's 
| almost imposible with flex.  I don't recommend it.  Be sure 
| your spec. is 
| clear about ridgid only.
|  
|