Being an Application Engineer supporting Flex and Rigid-flex product for Merix Corporation, I always get nervous when comments are made regarding things that "cannot be done" on flex circuitry. At Merix, one of our largest flex circuit programs uses the Entek 106A process. This flex application, as well as others that have used the Entek OSP surface finish, have proven to be very compatible with our customers assembly processes and flex assembly processes at Merix. Furthermore, the process for applying the Entek OSP surface finish is extremely compatible with flex circuit processing. Especially if you are comparing it to the mechanical and thermal stresses inherent to other surface finish application processes (ie: HASL). I do not want to suggest that the Entek system will work in every application. If I knew of such a system, Merix wouldn't need Applications Engineers like me. If you have specific questions about using Entek surface finishes on flex circuits, feel free to contact me at Merix Corp: [log in to unmask] I would be happy to discuss the compatibility of our Entek 106A with your assembly processes. If you have generic questions around Entek, N/C process compatibility, etc. I would suggest that you contact Enthone directly. A name you can start with is: Bret Taucher Enthone 206/222-6629 Thank for you time, Jon Woodyard, Applications Engineer Merix Corporation 503/359-2623 [log in to unmask] ---------Original Message--------------------------------------- | _________________________________ | Subject: Re: REQ: Info on Entek Plus/NC Flux | Author: [log in to unmask] at corp | Date: 1/31/96 7:58 PM | | | I worked for a flex manufacture that was trying to get Entek | approved. It's | almost imposible with flex. I don't recommend it. Be sure | your spec. is | clear about ridgid only. | |