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Date: | Fri, 16 Aug 96 10:39:19 PST |
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There is an excellent article in the August 1996 issue of Circuits
Assembly, "OSPs and the Assembly Process, " which address this
specific issue.
Is the debris visible after cleaning? Just out of curiosity, why are
you cleaning a no-clean flux?
______________________________ Reply Separator _________________________________
Subject: FAB/ASSY: OSP to No Clean Flux
Author: [log in to unmask] at ccUnix
Date: 8/16/96 10:16 AM
Address,
Has anyone encountered incompatibility issues with OSPs and No clean
fluxes used in Dual wave solder units. We are having difficulties in
solder wicking into some of the barrels, used and non-used through
holes. I have found some orange/amber debris on the board surface
after wave. I assume it is the flux, since it has this color to begin with.
I don't think it is the OSP, since it measures between 3microinches or
.1 angstroms. The board is 8x17, through hole technology only (NO SMTs).
The boards are shipped from Japan. No apparent oxidation is seen prior
to wave. The boards are cleaned in a Corpane unit using Axarel.
Will someone please advise. Thank you.
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