In a message dated 96-08-09 18:19:33 EDT, you write:

>On Fri, 9 Aug 1996 10:23:53 -0500 "Todd Rogers" <[log in to unmask]>
>writes:
>>We are attempting to switch our pre-clean process prior to soldermask 
>>from chem-clean followed by a mechanical scrub to chem-clean only.  We have
>>experienced problems with poor soldermask adhesion at the nickel/gold 
>>tab area.  We are using a reverse current tin/lead strip prior to
nickel/gold
>>and the HCL seems to be getting under the mask causing it to peel.  
>>Has anyone else had experience with a chem-clean process prior to 
>>soldermask>>and reverse current plate prior to nickel/gold.

Todd:

I suspect that the problem you are experiencing is due to Oxygen gas
formation under the mask, adjacent to the fingers, in the reverse current
stripper.  This is caused by excessive current density.

The answer is to cut down the current (Amps) by cutting down the volts.  And
yes, this will mean that you will have to slow down the line...  Sorry about
that, you cannot have it all.

Rudy Sedlak
RD Chemical Company

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************