Our designs are utilizing Surface Mount Components more each day. 
     Due to the type of product we manufacture, we will continue to 
     have several through-hole style components on each circuit card.  
     The small amount of through-hole does not justify continuing 
     Wave-Soldering.
     
     This year we have introduced an alternate process to our 
     production floor.  We are screening solder-paste over the 
     through-hole components along with the SMD components and then 
     reflowing the entire CCA.  This process is not necessarily new to 
     industry but new to our company.  We have had both success and 
     horror stories.  The success stories have encouraged us to 
     develop this process further with the intent of reducing or 
     eliminating Wave-Soldering altogether.
     
     My question is:  Are there any guidelines published surrounding 
                      this process or is anyone else using or        
                      developing this process?  Most of our          
                      information that we used to get this far
                      came from one of our screen suppliers.  IF
                      anyone is interested in our current process
                      please let me know.
     
     Thanks - Harlan
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