Our designs are utilizing Surface Mount Components more each day. Due to the type of product we manufacture, we will continue to have several through-hole style components on each circuit card. The small amount of through-hole does not justify continuing Wave-Soldering. This year we have introduced an alternate process to our production floor. We are screening solder-paste over the through-hole components along with the SMD components and then reflowing the entire CCA. This process is not necessarily new to industry but new to our company. We have had both success and horror stories. The success stories have encouraged us to develop this process further with the intent of reducing or eliminating Wave-Soldering altogether. My question is: Are there any guidelines published surrounding this process or is anyone else using or developing this process? Most of our information that we used to get this far came from one of our screen suppliers. IF anyone is interested in our current process please let me know. Thanks - Harlan [log in to unmask]