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Date: Thu, 07 Nov 1996 08:25:33 EST
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RE  Message ID: G20824C9706NOV199608200552
UA  content ID: Encapsulation of Alloy 42 TSOP Solder Joints

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Message-id: G20824C9706NOV199608200552
From:	MX%"[log in to unmask]"@MRGATE@WOODS
Subject: Encapsulation of Alloy 42 TSOP Solder Joints
Precedence: 1
To:	CARVALHOV@AM

   Does anyone have experience in the encapsulation of Alloy 42 TSOP solder 
joints ? Has anyone used an electrically conducting polymer or non-conducting
polymer for solder joint strength enhancement? Our parts have 20 mil pitch.
What has been found to be an appropriate max. reflow temp. and over liquidous
time for soldering Alloy 42 TSOP leads and also Copper TSOP leads?

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Date: Wed, 6 Nov 1996 7:32:26 -0500
From: [log in to unmask]
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Subject: Encapsulation of Alloy 42 TSOP Solder Joints
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