we find blowholes in entek finished pwbs.these are in bga pth holes. (finish 
dia 0.25 m.m) The coating thickness within specs (0.25 to 0.45). no blow
holes in other leaded components.

solder float tests done after entek with rma flux indicate good
solderability with NO BLOWHOLES (235 deg C) on bga holes.

the assembly process is apply solder paste, mount component and pass through IR
reflow.solder paste is screen printed on on bga holes also.

can somebody throw more info on above problem

thanks in advance

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