Address,
     
     Unless I'm missing it, IPC-SM-782 does not define how much spacing is 
     under the package (lead contact to package bottom).  I need to add a 
     0603 or 0805 chip resistor underneath a PLCC-44 for a minor revision 
     change.  
     
     Question:
     
     Is it possible to add a 0603/0805 with a .016/.024 package height, 
     respectively under a PLCC-44?
     
     Has anyone done this and acheived a reasonable solder paste flow under 
     the package or did the PLCC-44 rob the passive devices of heat?
     
     I think the PLCC-44 may crush (crack) the underlying devices in 
     assembly unless there is enough height?
     
     Please advise.
     
     John Gulley
     
     
     

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