TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Gary Ferrari <[log in to unmask]>
Date:
Wed, 28 Feb 1996 09:35:11 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines)
At 04:48 PM 2/27/96 -0800, you wrote:
>
><Text_1>
>       Our company just started using surface mount components and as I'm
>     creating the land patterns, I notice that on the resistors &
>     capacitors, the width of the part is greater than the width of the
>     pad. What is the reason for this and would it cause a problem if I
>     made the pad the same size as the part?
>
>     Thanks,
>     Mike Wedlock
>     Aerospace Avionics
>
>
Mike;

It was noticed that on some of the larger chip components, that the volume
of solder was too great. This volume caused some cracking of the component
during the soldering process. To reduce this volume, the land pattern width
was reduced.

Gary Ferrari
Tech Circuits
[log in to unmask]



ATOM RSS1 RSS2