 
| Subject: | |
| From: | |
| Date: | Tue, 27 Aug 1996 12:39:25 -0400 |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
When producing multi layer PCBs to MIL-P-55110 we have historically used a
"cap" build.,as the
interpretation was that to use a "foil" build we would have to get approval
under MIL-P-13949,a laminate
spec.. Is this the general concensus or are people using foil builds against
the 55110 spec??
Regards
Paul Greene
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
