I have a few questions about an issue that started this whole eutectic
conversation.  What are the advantages of moving to a 62Sn/36Pb/2Ag solder
paste.  From the information that I have received from some solder paste
reps is that the popularity of the silver alloy paste has dwindled from about
50% of the volume to about 35%(according to Alpha, Kester, Indiun and Heraeus
reps).  Our supplier demands an extra half a cent a gram for a 2% silver
formula.
Our 63/37 solder joints are 3-4 times the strength requirements set by IPC,
thus an increase in strength is not cost effective with the high volumes of
paste we use.  And even though we have seen a very low number of palladium
silver components, I am not convinced that a 2% silver is going to buy us
much since palladium is supposed have a 100% dissolution rate with tin provided
your reflow profiles are set up correctly(with sufficient time over reflow).

Has anyone out there recently moved from a 63/37 to a 62/36/2 or visa versa,
and why.

          Steve A 

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