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Subject:
solderability test for ENIG PCB finish
From:
Lee Bab Kieng <[log in to unmask]>
Date:
Sat, 14 Dec 1996 12:22:00 +0800 (SST)
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (20 lines) 
Dear Technetters,

 What is a quick, easy & effective way of assessing
solderability/ wettability of a PCB with electroless nickel/immersion gold
(ENIG) finish? How does phosphorus content in the Ni deposits affect
solderability? Will a lower %P content in Ni be more prone to
passivation/oxidation & thus affecting solderability??

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