Phil,

I think that the realistic approach of allowing some breakout is the right way
to think. Many of our customers' customers here in Europe don't allow breakouts
of any kind. Perhaps a dose of functionality driven common-sense could be
applied here.  

I have been working for some time on laser drilling blind via applications where
the goal is .004" to .005" holes in pads of .010" to .012".  Breakout on pads
which are on internal layers and should be the foot of a laser drilled
interconnect can cause damage to the surrounding substrate.  This is one area
where breakout cannot be tolerated.

I hope that you are happy and well, Phil.  Take care--  Paul

Paul Waldner
Multiline International Europa
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