i am also interested in vacuum desiccating after oxide instead of 
baking. someone please reply.
thank you.

andy white
-------------


From:    [log in to unmask] (keith larson)
To:      [log in to unmask]
cc:      
Date:    Fri, 30 Aug 96 13:20:57 -0500 (CDT)
Subject: RE: Vacuum Desiccating



FYI



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>Date: 30 Aug 1996 10:21:24 -0500
>From: "Edwards, Ted A (AZ75)" <[log in to unmask]>
>To: "[log in to unmask]" <[log in to unmask]> (Return requested)
>Subject: RE: Vacuum Desiccating
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>When we were in the board fabrication business, we did not store layers in a

>vacuum with desiccant but  when we used vacuum frame we would pull a vacuum 
>and hold it for more than 30 minutes before lamination.  When we switched to

>a vacuum lamination we continued to use a vacuum in the press and hold 
>before lamination.  We also pulled a vacuum on the prepreg and back filled 
>it's storage chamber with dry nitrogen.  The froth at the edge of the board 
>when down but we did not know if that was from the vacuum steps or the fact 
>we went to low pressure lamination when we switched to vacuum lamination.
> ----------
>From: [log in to unmask]
>To: [log in to unmask]
>Subject: Vacuum Desiccating
>Date: Friday, August 30, 1996 6:38AM
>
>Has anyone done testing, or incorporated as part of normal processing, the
>use of vacuum desiccating instead of baking after layer oxide coating, prior

>to
>lay-up and lamination. I would appreciate any information that is available.
>
>
>Bob G.
>
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andy white

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