To Whom It May Concern:
     
        Has anyone had any experience stencil printing adhesive for bottom 
     side chip components in a medium to high volume facility?  We are 
     looking at some very large quantities of chip components on the bottom 
     side of the boards and the present dispensing equipment will not be 
     able to keep up with the component placement rate.
     
        If so:  what is a recommended adhesive formulation?
                what are some recommended squeegee print speed and          
                        pressures?
                what are associated areas of risk stencil printing          
                        adhesive?
     
        Thank you for your time and consideration.
     
     Regards,
     
     Kevin Frasier