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| From [log in to unmask] Tue Feb 27 14: |
21:57 1996 |
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To Whom It May Concern:
Has anyone had any experience stencil printing adhesive for bottom
side chip components in a medium to high volume facility? We are
looking at some very large quantities of chip components on the bottom
side of the boards and the present dispensing equipment will not be
able to keep up with the component placement rate.
If so: what is a recommended adhesive formulation?
what are some recommended squeegee print speed and
pressures?
what are associated areas of risk stencil printing
adhesive?
Thank you for your time and consideration.
Regards,
Kevin Frasier
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