We have a vendor who asked us to forward this inquiry to technet:

A customer had a board that accidentally got left in an oven for 7 days at 
200F over the 4th of July shutdown.  This board is a multilayer board with 
IR  fused solder finish.

The board was then wave soldered and the solder flaked off the pads leaving 
unsolderable copper surfaces.  Another  board from the extended bake failed 
all adhesion testing prior to solder.  Boards without the extended bake 
passed adehsion testing.  The copper surface on the extended bake boards was 
dark brown (similar to too much heat) to a white haze.

They are trying to explain what happened and have looked for intermetallic 
and are planning on using auger to look for possible surface contaminants. 
 Has anyone had a similar experience or insight for further evaluation? 

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