The HDP users group, telecom working group (which includes 
Alcatel - and virtually every other telecom company) is working 
the Ni-Pd lead finish issue. The suppliers represented include 
TI, AMD, National, Motorola, Amkor/Anam and others - so this 
issue is likely to become much more widespread. I recommend that 
items/issue related to this lead finish be sent to Reuben Bergman 
(e-mail: [log in to unmask]) for coordination to the entire 
working group. For reference the Alcatel rep on the Pd issue is 
Nic De Roose. 

Joe Smetana
DSC Communications
"All opinions expressed are solely my own and do not necessarily reflect the 
opinions of DSC Communications."

______________________________ Forward Header __________________________________
Subject: ASSY: SOIC'S IN WAVESOLDERING (fwd)
Author:  GEILAND at DSC-1100
Date:    4/9/96 11:41 AM



Joe:

FYI.  Looks like something you discussed a couple of months ago.


GE


______________________________ Forward Header __________________________________
Subject: ASSY: SOIC'S IN WAVESOLDERING (fwd)
Author:  [log in to unmask] at SMTPLINK 
Date:    4/9/96 11:36 AM



Forwarded to TechNet for Assistance
Thanks
Dave Bergman, IPC


---------- Forwarded message ---------- 
Date: Tue, 09 Apr 1996 13:36:48 +0100 (MET)
From: EDDIE VAN HOREN 014 57 20 08 <[log in to unmask]> 
To: [log in to unmask]
Subject: SOIC'S IN WAVESOLDERING

David,
I'm looking for help somewhere in the industry on a serious soldering 
problem.
Is there something like a bulletin board where items can be posted for 
discussion?
Today's problem in a nutshell :

Subject : wavesoldering of SO-components (mainly SOIC).

Since a few years, Texas Instruments has changed the lead finish of the 
SOIC's to a layer of nickel with a palladium flash (simplified).
This can result in 1000 ppm open solder joints when wave soldering.
In the very near future, starting next june, Motorola is also switching 
to a simular leadfinish. All others are expected to follow soon.
In the farther future, useing other PCB finishes than SnPb ( NiAu, 
preservated Cu etc.) will undoubtedly increase the problem.
I see this as a tremendous problem for those people who are 
wavesoldering this kind of components.
Is there a way to find out whether this problem is recognized by users, 
and if somebody sees a solution to the problem ?
And again, is there a way to put questions to the IPC community?

Best regards.
Eddie

Eddie Van Horen
Industrial Engineer
Alcatel Telecom Belgium
Bell Telephonelaan 2
2440 Geel
Belgium
Tel (32) 14 57 20 08
Fax (32) 3 240 48 02
E-mail : [log in to unmask]