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Subject:	Re: FAB/ASM: Pressure Fit Entek
From:	Jack Olson <[log in to unmask]>
Date:	Wed, 07 Aug 1996 13:26:21 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (19 lines)

George Franck X2648 N408 wrote:
> We are considering using SMOBC (tented vias) and Entek on a press fit
> connector backplane.  The assembly process will not coat the Entek with
> solder or conformal coat.  The boards will go into the field with only
> Entek as an oxidation barrier for the copper.

As far as I know (I could be wrong), Entek is not a "permanent" coating. 
It is only meant to protect the copper until it is soldered, and it won't 
last forever.

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