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Subject:
DES\ASSY: Blind Vias In BGA Pads
From:
"Vince, Harlan" <[log in to unmask]>
Date:
Mon, 29 Jul 96 13:52:43 EST
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     Hello TechNetters!
     
     Has anyone had any experience with blind vias in BGA pads?  The 
     BGA is a 225 I/O, 1.27mm" pitch.  The ball diameter is .0295" and 
     the pad size being considered is .030".  The via hole size is 
     .012" maximum.  I have had success with vias in pads that go 
     through the board but I'm concerned about using a blind via in the 
     BGA attachment pad due to outgassing or some other unknown 
     problem.
     
     Thanks in advance.
     
     Harlan
     [log in to unmask]

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