Hi TechNet!
     
     I have had the "opportunity" to be part of the committee working on 
     the JSTD 001 document and the comment that "....Most of the 
requirements mentioned in the J-STD-001 are either cosmetic or not measurable by
 well-established inspection techniques" I take violent exception too! Yes, not 
all of the requirements in JSTD 001 have hard and fast data behind but just as 
many of the requirements do have data which the task group reviewed, argued 
over, and even retested. The JSTD 001 specification is being used by many 
companies to produce acceptable electronics hardware. No specification can 
prescribe requirements that fit every application for all electronics for all 
use environments. The JSTD 001 comes the closer to the goal of a "everyone can 
use" specification than any other document to date. Will it satisfy everyone's 
needs? No. All potential users should use the specification as  it would apply 
to their product and use environments. As for Rensselear conducting data that 
could be used to improve JSTD 001 that would be wonderful - being part of the 
process instead of throwing stones at the specification is a positive, 
constructive activity. I suggest you talk to the task group chairman, Jerry 
Rosser, to get a better insight of the specification and how the testing you are
planning could improve the specification. 

(Wow, sorry to get on my soapbox TechNet but that hit a nerve!)


Dave Hillman
Rockwell Collins
[log in to unmask]


______________________________ Reply Separator _________________________________
Subject: Validating J-STD-001B
Author:  [log in to unmask] at ccmgw1
Date:    10/30/96 8:15 PM


Hi Technetters:
     
We all know ANSI J-STD-001 provides the inspection guidelines 
for quality. What one never comes across is data correlating
the numbers prescribed in the standard and quality/reliability issues. 
Most of the requirements mentioned in the J-STD-001 are either 
cosmetic or not measurable by well-established inspection
techniques. Moreover, the implications of the standard on 
board, assembly, and process design is not clearly understood.
     
I am posting this message to announce that we are initiating
a research effort at Rensselaer that will focus on the above issue. 
In 1988 we had performed a study here at Rensselaer on 
this topic which revealed that (post-reflow) component tilt lowered 
the cycles to failure more than any other investigated variable. 
This has been published in several articles and books. 
At that time it was felt that the emerging standards would 
include some reliability and performance criteria. (which has 
not happened to date!)
     
We now propose to back parts of the J-STD-001 with quantitative data 
as part of the 3rd phase of our Electronics Manufacturing Program. 
Other focal areas include Intelligent Manufacturing, Solder/joint 
characterization, Innovative soldering approaches, Alternatives to 
soldered interconnects, Recycling issues, and Online design and 
brokering. This program is an integrated effort with as much 
interaction between the focal areas as applicable. 
     
A kick-off meeting will be held on November 21st, 1996 at 
Rensselear Polytechnic Institute, Troy, NY to incorporate the
opinions and suggestions of the attendees into the research program. 
Companies participating in the program will have direct access
to the results and technical publications.
     
Take a look at our web site
http://www.cieem.rpi.edu
for more information. You can also contact me for further details.
     
Regards,
     
Vijay Sankaran
Research Associate
Center for Integrated Electronics and Electronics Manufacturing 
Rensselaer Polytechnic Institute
Troy, NY 12180
     
[log in to unmask]
Phone: 518/276-2721
Fax:   518/276-2990
     
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