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Subject:	Re: Calcium ion on laminate
From:	"peterb" <[log in to unmask]>
Date:	Tue, 20 Aug 96 10:41:21 EST
Content-Type:	text/plain
Parts/Attachments:	text/plain (49 lines)

     
We experienced voiding on one lot at one particular layer where Arlon 
polyimide laminate (0.018) and ADI 2116 polyimide prepreg interfaced.  
Voiding affected about half the holes on the boards of all sizes.  SEM/EDAX 
analysis showed  P, Sn, Cl, Pb, C, O, and a Sn/Ca peak.  We never found out 
what the cause was.  Hope this gives you a clue.

Regards, 
Peter at PC World
416-299-4000
[log in to unmask]

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Subject: Calcium ion on laminate
Author:  [log in to unmask] at INET
Date:    8/14/96 8:26 PM
     
     
SEM/EDX analysis of a voided area on an electroless Cu deposit on Mitsubishi 
BT laminate shows Si, O, Br and Ca ions.  Si and O coming from glass, Br 
from epoxy as a flame retardant; where is Ca ion coming from (DI water used 
everywhere)?  Has anyone else experienced uneven Cu deposit on this type of 
laminate(the larger the hole or cavity the higher occurence of voiding)??? 
C-stage of this laminate is deliberately undercured; can this have any 
impact on the voiding problem?
Thanks for help,
Paul
     
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