Colleagues:

Our in house SMT assembly facility has asked that we tent our vias on top and 
bottom sides to aid in solder bridge reduction.  If bottom tenting is not 
possible becaues vias may double as test points, they ask that we still tent 
the top (component) side.  They use a no clean process.  

I am concerned that contaminants will be trapped in vias tented only on one 
side and cause premature failure down the road.  Normal via size is .012.  
What are your thoughts on tented vias???  One side?  Both sides?  Not tented 
ever?  Why???  What other problems may we encounter?

Thanks in advance for your opinions.


gary ...

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