Item Subject: cc:Mail Text
     As mentioned in several other messages, we have found no reliability 
     problems associated with exposed copper on OCC assemblies. 
     
     However, I have one question which I hope someone can answer:
     
     On some assemblies, we use grounded contact pads to ground 
     shields/bulkheads, etc. The contact between the shield and the board is 
     simply a metal tab on the shield that presses against a contact pad on 
     the board. Is such a connection reliable if the pad is exposed copper 
     (or copper with residual OCC after a couple of reflow cycles and an 
     aqueous wash)as opposed to HASL? Pasting those pads is not possible in 
     all applications due to the size, number of pads, etc.
     
     Regards,
     
     
     Denis Mori
     Hewlett-Packard Co.
     Roseville, CA
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