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1996

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Subject:
From:
"George Franck Jr" <[log in to unmask]>
Date:
Thu, 7 Nov 1996 12:20:37 -0500
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Bill,
	This sounds like a pad size / hole size problem.  If I remember 
correctly, we used a 22-28 hole size and a 45x55 rectangular pad.  The 
rectangular pad was the key to resolving our problems with the 
component, (however I have forgotten just what our problems were.)

Good Luck,
George Franck

On Nov 7, 11:23am, Bill Hunt wrote:
> Subject: ASSY:  Soldering process for 50 mil pitch connectors
> Has anybody had any success wave soldering 50 mil pitch through hole 
> connectors? Or has anybody had any success reflow soldering a hi 
> temperature 50 mil pitch connector? We have insufficient solder joints 
> when the connectors are reflowed and bridging if the connector is wave 
> soldered. 
> 
> 
> 

-- 


George Franck Jr
Raytheon E-Systems
Product Assurance Engineer
Falls Church Va

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