Werner

I am reading a lot about these gold and silver plated pads and I made a lot
of reliability testing on the solder joints produced with these surfaces.
As a matter of fact, during the solder process we have to wait long enough
until all of the gold / silver is diluted in the solder joint without
forming intermetallics. Something I wonder is the fact, that a extended
soldering time does result in the growth of tin / copper or tin / nickel
intermetallics. do you have any information about this aspect ? And, is
there a way to have a glance on the results the IEEE Compliant Lead Task
Group achieved?

Merry Christmas

Cordially
Guenter



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