Hi Chris,

Try to bake the board a bit longer - at least more than 4 hrs to 8 hrs.
However, I'm not sure what sort of solder splashes you are getting, but you 
also can try to run the board thru' lower solder pot temperature ranges from 
235 to 240 deg. celcius, this will have less thermal impact on the board.

Check whether your flux is being contained water ...

Good Luck.

Poh Kong Hui
Nera Electronics 

----------------------------------------------------------------------------
-------------------------------------------------
At 11:23 AM 6/17/96 -0500, you wrote:
>Presently we are seeing accurrances of solder splashes in our wave solder
>process. We have PCB's that are less then three months old and our storage
>process is inside of a ziplock bag with desiccant. Our present environment
>has a higher than normal humidity level of 40 to 50%.  We have attempted
>many adjustments to the proces such as speed, flux gravity(foamer), etc..
>The only thing that appears to eliminate or reduce the splashes is baking
>the assembly for 1 hour at 50 degrees 'C' and doing the wave process while
>the assembly is still hot. 
>
>Does anyone out there have any ideas of what could cause this problem or
>things we should try that could eliminate them?
>
>Thanks in advance
>
>