 
| Subject: | |
| From: | |
| Date: | Thu, 8 Feb 1996 15:02:30 -0600 (CST) |
| Content-Type: | TEXT/PLAIN |
| Parts/Attachments: |
|
|
Jim:
Here's a few:
-excess board movement during reflow
-inaccurate placement of parts
-uneven solderability on pads or leads
-incorrect pad design
Mike Buetow
IPC Technical Staff
2215 Sanders Road
Northbrook, IL 60062
P: 847-509-9700, ext. 335
F: 847-509-9798
[log in to unmask]
On Thu, 8 Feb 1996, Jim Marsico wrote:
> What are some of the major causes of tombstoning of small chip SMT components?
>
> Jim M.
> [log in to unmask]
>
>
>
|
|
|
