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1996

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Subject:
From:
"Edwards, Ted A (AZ75)" <[log in to unmask]>
Date:
08 May 1996 12:21:54 -0500
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     Occasionally with Teflon base material boards adhesion of a pad or run 
is lost during assembly, especially with connectors and larger parts which 
require more heat,  and we are wondering if anyone has experience in rework 
or repair to reattach pads or runs to Teflon boards.  We would like bond 
strength in the range of original and without microwave performance 
degradation.  Anybody got any ideas or suggestions?
     Thanks
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