At first we had a few worries of contaminants in the plating baths and
we Carbon and peroxide treated one  bath and no improvement. There were
a few suggestions of having fungus in the brightner lines, as it is
automatically added based on an amphour meter. 
All brightner lines were changes to eliminate this possibility. 
 
For more information about the baths: 
All three acid copper baths are in the same plating line. All baths
using one hoist and is controlled by a central computer. 
 
The nodules seem to have shown up in all three baths apporximately the
same time. 
 
Characteristics all three baths have in common: 
 
Same agitation speed 
Central controller (computer) 
All three baths are Hot loading-with a 5 second lag 
 
We are currently using PC-606 brightner. 
All chloride levels are checked and all well within the vedors specs. 
 
Questions: 
 
1. Can a 5 second lag for hot loading be detrimental to copper plating? 
2. What results will we see on a Copper plated panel if the ripple in
the rectifier is excessive.  

If you have any suggestions or need more info, please let me know.
I'll get back with you on anode to cathode distance

T. Gaylor 

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