Steve

IPC-RB-276 is IPC's spec for Rigid Printed Boards.  This spec has a 
minimum plated through hole copper thickness specified by class but does 
not differentiate between holes with lands on both size versus one side 
only.  

Regards
Dave Bergman, IPC


On Thu, 10 Oct 1996, Steve Collins wrote:

> I have been told in the past by PCB vendors that IPC controls the amount 
> of plating one can expect in a double sided plated thru board which may 
> contain both, holes with pads on both sides and some that have pads on 
> one side only. Can anyone tell me what section of what spec I might find 
> this in. I am writing a PCB general requirement standard for our company 
> and we have this situation on alot of our older boards. We have stoped 
> this practice and now place a min pad (.015 over hole dia) on the 
> component side.
> 
> Thak you for any help.
> 
> Steve Collins
> PCB Design Supervisor
> 
> ***************************************************************************
> * TechNet mail list is provided as a service by IPC using SmartList v3.05 *
> ***************************************************************************
> * To unsubscribe from this list at any time, send a message to:           *
> * [log in to unmask] with <subject: unsubscribe> and no text.        *
> ***************************************************************************
> 
> 

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************