Hi:
     
        The question here is how do you plug vias in SMT pads.  A 
     soldermask ink (LPI, Liquid Epoxy or Dry film mask) would not be 
     acceptable in this type of situation.  This could jeopardize the 
     attach joint of the smt device on this pad depending on how the pad is 
     designed.  As stated in an E Mail that I had seen earlier was the 
     recommendation of a laser blind via.  This would create a via that is 
     approximately 0.005 - 0.008 diameter and 0.003 - 0.006 deep drilled 
     and will be sealed on the bottom.  This type of via would be more 
     forgiving to the integrity of the solder joint.
     
     Guy Willingham
     Zycon Corporation

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