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Date: | Tue, 15 Oct 96 08:27:30 PST |
Content-Type: | text/plain |
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Hi:
The question here is how do you plug vias in SMT pads. A
soldermask ink (LPI, Liquid Epoxy or Dry film mask) would not be
acceptable in this type of situation. This could jeopardize the
attach joint of the smt device on this pad depending on how the pad is
designed. As stated in an E Mail that I had seen earlier was the
recommendation of a laser blind via. This would create a via that is
approximately 0.005 - 0.008 diameter and 0.003 - 0.006 deep drilled
and will be sealed on the bottom. This type of via would be more
forgiving to the integrity of the solder joint.
Guy Willingham
Zycon Corporation
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