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1996

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Wed, 14 Aug 1996 20:11:08 -0400
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SANTA CLARA PROCESS 
I still see the Santa Clara process referenced in some company procurement
documents.  I was as Rudy stated a process patented by some guys from Santa
Clara and involved applying a second coat of resist over the pattern plated
copper and usually tin-nickel, imaging and plating only the lands with
tin-lead or tin.

I believe the patent was dated 1978 or therabouts.  I was a little known
patent and manufacturers unknownly used the process or variations of it for
many years before and after the patent was granted.  At any rate the patent
holders never wanted to or requested licensing fee from other users.

Phil Hinton 
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