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| Date: | Thu, 25 Apr 1996 18:06:33, -0600 |
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-- [ From: michael carano * EMC.Ver #2.10P ] --
If your electroless copper is of sufficient thickness and you employ a
microetch that will give you consistant and predictable etch rates, you
should not experience any problems. But, the key here is really the
consistency of the microetch.
With respect to the electroless copper deposit, my experience has shown
that a fine tight grained elctroless deposit will give more consistant
and predictable etch rates than a porous deposit of equal thickness.
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