Hello Everyone:

I would like to know the major reliability issues with Plastic BGA packages 
(glob top / molded) and how the end users in the industry are coping with them.

 Are the package-die top,bottom delamination / popcorning / ball attach 
(compared to lead attach) / 
board attach /  reworkability / susceptibility to corrosion issues better/worse 
when compared to molded surface mount packages because of differences in 
materials of construction ?

 Is there a jury with a verdict out there ? 

I would prefer if the responses are limited to 'reliability issues' only.

Thanks in advance.

Dipak Sengupta

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