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1996

TechNet@IPC.ORG

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Subject:
From:
"Dill, Norm J" <[log in to unmask]>
Date:
Fri, 29 Mar 96 12:51:00 EST
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Harlan,
     What type of flux and cleaning process are you using?

 ----------
From: TechNet-request
To: TechNet
Subject: Nickel/Gold Immersion
Date: Friday, March 29, 1996 8:10AM

     We have experienced dramatic yield improvements in SMT by
     utilizing Nickel/Gold (2-6 micro-inches of Gold over 100
     micro-inches of Nickel) instead of Tin/Lead(HASL) on our Printed
     Wiring Boards.  Due to Mixed Technology Designs, several of these
     Designs are processed through Wave-Solder.  We have experienced
     the obvious, increased Gold contamination in the pot, but yields
     have also increased. We have stepped-up Pot samples and Pot
     changes to overcome this problem.

     Is anyone else processing Nickel/Gold plated Printed Wiring
     Boards across Wave-Solder and have there been any problems other
     then what I have listed above?

     Thanks for your time - Harlan



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