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Date: | Thu, 26 Sep 96 13:30:36 CDT |
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As a HASL service provider we see the entire gambit of solder mask
residues. We use a persulfate based etchant at a rate of 40-60
microinches. The trade off is that it is much more difficult to rinse
than peroxide/sulfuric chemistries and can cause non-wets if not
entirely removed before entering the HAL machine.
Michael Holan
Process Engineer
Radian Electronics Div.
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Subject: HASL Microetch
Author: [log in to unmask] at INTERNET
Date: 9/26/96 12:57 PM
Does anyone have information, opinions or preferably data regarding micro
etching with persulfate vs sulfuric acid/peroxide chemistries? We are
currently using a sulfuric acid/peroxide based microetch at the HAL line, and
are considering alternatives. I have seen some information which suggests a
persulfate based chemistry is better at removing solder mask residues. Any
feedback would be appreciated.
Jim Kenny
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