I am in the process of having samples made with Cu/Ni/Pd/Au for gold 
     wire bonding.  The gold in this process is immersion gold.  This is 
     touted by two suppliers as a reliable surface for bonding.  I also 
     have yet another supplier telling me that their electroless 
     nickel/electroless palladium process (NO gold) is also bondable.  This 
     will be tested too.  
     
     I have had samples made in the past with just e-nickel and immersion 
     gold (which we are all experts on now) which were ball bonded with 
     gold wire.
     
     I have been told that the gold wires adhered to the immersion gold 
     when they were new, but they won't be good for the long term.  How can 
     I stress the deposits to determine how good my surface finishes are?  
     That is: How would I know if it is reliable enough for me to offer it 
     to MY customers?
     
     
     Matt Byrne

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************