Those of you using a no-clean/low-residue soldering solution 
     in your manufacturing operations, I have some questions 
     concerning flux compatibility.
     
     What problems have you encountered between no-clean paste, 
     liquid flux at wave solder and benchtop soldering no-clean 
     flux(hand soldering)?  I am strongly considering a water 
     based no-clean for wave solder to try to reduce VOCs 
     contribution at this facility.  Will this direction limit 
     the flexibility of the SMD area to choose their no-clean 
     paste, or, perhaps the hand soldering side be limited in 
     their flux selection?  I would appreciate some feedback and 
     thanks in advance.  

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